公开(公告)号：US06610778B2

公开(公告)日：2003-08-26

申请号：US09942655

申请日：2001-08-31

申请人： Kenichi Takita ,  Kunihiko Mita

发明人： Kenichi Takita ,  Kunihiko Mita

IPC分类号： C08L8307

CPC分类号： C08K5/0025 ,  C08K3/36 ,  C08K5/14 ,  C08L83/08 ,  Y10T428/31797 ,  C08L2666/34 ,  C08L2666/54

摘要： In a fluorosilicone rubber composition comprising (A) an organopolysiloxane having trifluoropropyl and (B) a silica filler, there are included (C) an organic peroxide of percarbonate type as a crosslinking agent and (D) a compound having a molecular weight of up to 10,000 and bearing in a molecule at least two substituents selected from among allyl, acryloyl, methacryloyl, epoxy and alkoxy groups as a co-crosslinking agent, whereby the vulcanization molding time is substantially reduced without detracting from physical properties.

公开(公告)号：US07484556B2

公开(公告)日：2009-02-03

申请号：US11527641

申请日：2006-09-27

申请人： Kunihiko Mita ,  Kazuhiko Tomaru ,  Yoshitaka Aoki ,  Hironao Fujiki

发明人： Kunihiko Mita ,  Kazuhiko Tomaru ,  Yoshitaka Aoki ,  Hironao Fujiki

IPC分类号： F28F7/00 ,  F28F13/00 ,  H05K7/20

CPC分类号： C09K5/06 ,  H01L23/3737 ,  H01L23/4275 ,  H01L2924/0002 ,  Y10S165/905 ,  H01L2924/00

摘要： A heat dissipating member which is disposed between a heat generating electronic component which when operated generates heat and reaches a temperature higher than room temperature and a heat dissipating component is characterized in that the heat dissipating member is non-fluid in a room temperature state prior to operation of the electronic component and acquires a low viscosity, softens or melts under heat generation during operation of the electronic component to fluidize at least a surface thereof so as to fill between the electronic component and the heat dissipating component without leaving any substantial voids, and the heat dissipating member is formed of a composition comprising a silicone resin and a heat conductive filler.

摘要翻译： 一种散热构件，其设置在发热电子部件之间，其在运转时产生热量并达到高于室温的温度，散热部件的特征在于，散热构件在室温状态下为非流体， 电子部件的操作并且获得低粘度，在电子部件的操作期间在发热的同时软化或熔化至少使其表面流化，以便填充电子部件和散热部件而不留下任何实质的空隙，以及 散热构件由包含硅树脂和导热填料的组合物形成。

公开(公告)号：US07417078B2

公开(公告)日：2008-08-26

申请号：US10250685

申请日：2002-03-20

申请人： Hironao Fujiki ,  Kazuhiko Tomaru ,  Ikuo Sakurai ,  Akio Suzuki ,  Kunihiko Mita

发明人： Hironao Fujiki ,  Kazuhiko Tomaru ,  Ikuo Sakurai ,  Akio Suzuki ,  Kunihiko Mita

IPC分类号： G21F1/10 ,  C08K3/10 ,  C08K3/22 ,  C08L83/06 ,  H05K7/20

CPC分类号： H05K9/0083

摘要： An electromagnetic wave absorbing heat conductive composition is used to form an electromagnetic wave absorbing heat dissipating article that is placed between a heat generating electronic component which, when operated, generates heat, reaches a temperature higher than room temperature and acts as an electromagnetic wave generating source, and a heat dissipating component. The composition is non-fluid at room temperature prior to operation of the electronic component, but acquires a low viscosity, softens or melts under heat generation during operation of the electronic component, to fluidize at least a surface of the composition so that the composition substantially fills any gaps between the electronic component and the heat-dissipating component.

摘要翻译： 使用电磁波吸收导热组合物形成电磁波吸收散热物品，其放置在发热电子部件之间，发热电子部件在运转时发热，达到高于室温的温度，作为电磁波发生源 ，以及散热部件。 组合物在电子组件操作之前在室温下是非流体的，但是在电子部件的操作期间获得低粘度，在发热时软化或熔化，以使组合物的至少一个表面流化，使得组合物基本上 填充电子部件和散热部件之间的任何间隙。

公开(公告)号：US07279224B2

公开(公告)日：2007-10-09

申请号：US10643978

申请日：2003-08-20

申请人： Yoshitaka Aoki ,  Tsutomu Yoneyama ,  Kunihiko Mita

发明人： Yoshitaka Aoki ,  Tsutomu Yoneyama ,  Kunihiko Mita

IPC分类号： B32B25/20

CPC分类号： B32B25/20 ,  B32B25/02 ,  B32B27/20 ,  H01L23/3737 ,  H01L2924/0002 ,  Y10T428/31663 ,  H01L2924/00

摘要： A heat conductive composite sheet comprising (a) a heat softening, heat conductive layer containing a silicone resin and a heat conductive filler, and (b) a heat conductive silicone rubber layer containing a heat conductive filler is ideally suited to use as a heat radiating structure provided between a heat generating electronic component and a heat radiating component such as a heat sink or a circuit board, for the purposes of radiating heat away from the heat generating electronic component and thus cooling it. This heat conductive composite sheet not only offers good thermal conductivity, but if an installed heat conductive member formed from this type of heat conductive composite sheet needs to be removed temporarily to enable the electronic component such as a CPU to be repaired or replaced, the electronic component is not removed together with the heat conductive member.

摘要翻译： 一种导热性复合片，其特征在于，包括：（a）含有硅树脂的热软化导热层和导热性填料，（b）含有导热性填料的导热性硅橡胶层，理想地适用于散热 在发热电子部件和诸如散热器或电路板的散热部件之间提供的结构，用于将热量从发热电子部件散热并因此冷却。 该导热性复合片不仅具有良好的导热性，而且，如果需要临时移除由这种导热性复合片形成的导热性部件，能够修复或更换CPU等电子部件， 部件不与导热部件一起被去除。