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    Heat dissipating member
    1.
    发明申请
    Heat dissipating member 有权
    散热构件

    公开(公告)号：US20070023179A1

    公开(公告)日：2007-02-01

    申请号：US11527641

    申请日：2006-09-27

    申请人： Kunihiko Mita ,  Kazuhiko Tomaru ,  Yoshitaka Aoki ,  Hironao Fujiki

    发明人： Kunihiko Mita ,  Kazuhiko Tomaru ,  Yoshitaka Aoki ,  Hironao Fujiki

    IPC分类号： H05K7/20

    CPC分类号： C09K5/06 ,  H01L23/3737 ,  H01L23/4275 ,  H01L2924/0002 ,  Y10S165/905 ,  H01L2924/00

    摘要： A heat dissipating member which is disposed between a heat generating electronic component which when operated generates heat and reaches a temperature higher than room temperature and a heat dissipating component is characterized in that the heat dissipating member is non-fluid in a room temperature state prior to operation of the electronic component and acquires a low viscosity, softens or melts under heat generation during operation of the electronic component to fluidize at least a surface thereof so as to fill between the electronic component and the heat dissipating component without leaving any substantial voids, and the heat dissipating member is formed of a composition comprising a silicone resin and a heat conductive filler.

    摘要翻译： 一种散热构件，其设置在发热电子部件之间，其在运转时产生热量并达到高于室温的温度，散热部件的特征在于，散热构件在室温状态下为非流体， 电子部件的操作并且获得低粘度，在电子部件的操作期间在发热的同时软化或熔化至少使其表面流化，以便填充电子部件和散热部件而不留下任何实质的空隙，以及 散热构件由包含硅树脂和导热填料的组合物形成。

    Heat dissipating member
    2.
    发明授权
    Heat dissipating member 有权
    散热构件

    公开(公告)号：US07484556B2

    公开(公告)日：2009-02-03

    申请号：US11527641

    申请日：2006-09-27

    申请人： Kunihiko Mita ,  Kazuhiko Tomaru ,  Yoshitaka Aoki ,  Hironao Fujiki

    发明人： Kunihiko Mita ,  Kazuhiko Tomaru ,  Yoshitaka Aoki ,  Hironao Fujiki

    IPC分类号： F28F7/00 ,  F28F13/00 ,  H05K7/20

    CPC分类号： C09K5/06 ,  H01L23/3737 ,  H01L23/4275 ,  H01L2924/0002 ,  Y10S165/905 ,  H01L2924/00

    摘要： A heat dissipating member which is disposed between a heat generating electronic component which when operated generates heat and reaches a temperature higher than room temperature and a heat dissipating component is characterized in that the heat dissipating member is non-fluid in a room temperature state prior to operation of the electronic component and acquires a low viscosity, softens or melts under heat generation during operation of the electronic component to fluidize at least a surface thereof so as to fill between the electronic component and the heat dissipating component without leaving any substantial voids, and the heat dissipating member is formed of a composition comprising a silicone resin and a heat conductive filler.

    摘要翻译： 一种散热构件，其设置在发热电子部件之间，其在运转时产生热量并达到高于室温的温度，散热部件的特征在于，散热构件在室温状态下为非流体， 电子部件的操作并且获得低粘度，在电子部件的操作期间在发热的同时软化或熔化至少使其表面流化，以便填充电子部件和散热部件而不留下任何实质的空隙，以及 散热构件由包含硅树脂和导热填料的组合物形成。

    Electromagnetic wave absorbing thermally conductive composition and thermosoftening electromagnetic wave absorbing heat dissipation sheet and method of heat dissipation work
    3.
    发明授权
    Electromagnetic wave absorbing thermally conductive composition and thermosoftening electromagnetic wave absorbing heat dissipation sheet and method of heat dissipation work 失效
    电磁波吸收导热组合物和热软化电磁波吸收散热片及散热工作方法

    公开(公告)号：US07417078B2

    公开(公告)日：2008-08-26

    申请号：US10250685

    申请日：2002-03-20

    申请人： Hironao Fujiki ,  Kazuhiko Tomaru ,  Ikuo Sakurai ,  Akio Suzuki ,  Kunihiko Mita

    发明人： Hironao Fujiki ,  Kazuhiko Tomaru ,  Ikuo Sakurai ,  Akio Suzuki ,  Kunihiko Mita

    IPC分类号： G21F1/10 ,  C08K3/10 ,  C08K3/22 ,  C08L83/06 ,  H05K7/20

    CPC分类号： H05K9/0083

    摘要： An electromagnetic wave absorbing heat conductive composition is used to form an electromagnetic wave absorbing heat dissipating article that is placed between a heat generating electronic component which, when operated, generates heat, reaches a temperature higher than room temperature and acts as an electromagnetic wave generating source, and a heat dissipating component. The composition is non-fluid at room temperature prior to operation of the electronic component, but acquires a low viscosity, softens or melts under heat generation during operation of the electronic component, to fluidize at least a surface of the composition so that the composition substantially fills any gaps between the electronic component and the heat-dissipating component.

    摘要翻译： 使用电磁波吸收导热组合物形成电磁波吸收散热物品，其放置在发热电子部件之间，发热电子部件在运转时发热，达到高于室温的温度，作为电磁波发生源 ，以及散热部件。 组合物在电子组件操作之前在室温下是非流体的，但是在电子部件的操作期间获得低粘度，在发热时软化或熔化，以使组合物的至少一个表面流化，使得组合物基本上 填充电子部件和散热部件之间的任何间隙。

    Heat-dissipating member, manufacturing method and installation method
    5.
    发明授权
    Heat-dissipating member, manufacturing method and installation method 失效
    散热构件，制造方法和安装方法

    公开(公告)号：US06940722B2

    公开(公告)日：2005-09-06

    申请号：US10347599

    申请日：2003-01-22

    申请人： Hiroaki Tetsuka ,  Kunihiko Mita ,  Kunihiro Yamada ,  Yoshitaka Aoki ,  Tsutomu Yoneyama

    发明人： Hiroaki Tetsuka ,  Kunihiko Mita ,  Kunihiro Yamada ,  Yoshitaka Aoki ,  Tsutomu Yoneyama

    IPC分类号： H01L23/427 ,  H05K7/20

    CPC分类号： H01L23/427 ,  F28F2013/006 ,  H01L2924/0002 ,  Y10T428/31663 ,  H01L2924/00

    摘要： A heat-dissipating member sandwiched between a heat dissipating electronic component which reaches a higher temperature than room temperature due to operation, and a heat-dissipating component for dissipating the heat produced from this heat dissipating electronic component. The heat-dissipating member of this invention has an interlayer comprising a metal foil and/or metal mesh having a thickness of 1-50 μm and heat conductivity of 10-500 W/mK, and a layer comprising a thermally-conducting composition containing 100 wt parts of a silicone resin and 1,000-3,000 wt parts of a thermally-conducting filler formed on both surfaces of the interlayer such that the overall thickness is within the range of 40-500 μm. This heat-dissipating member is non-fluid at room temperature, but due to the action of heat emitted when the electronic component operates, its viscosity decreases, and it softens or melts based on the phase transition of the resin and low melting point metal so that it is effectively in intimate contact with the boundary between the electronic component and heat-dissipating component without any gaps. The thermally-conducting filler contains a low melting point metal powder (1) having a melting temperature of 40-250° C. and a particle diameter of 0.1-100 μm, together with a thermally-conducting powder (2) having a melting temperature exceeding 250° C. and an average particle diameter of 0.1-100 μm, such that (1)/[(1)+(2)]=0.2-1.0.

    摘要翻译： 夹在由于操作而达到比室温高的温度的散热电子部件之间的散热部件，以及用于散发由该散热电子部件产生的热量的散热部件。 本发明的散热构件具有中间层，其包含厚度为1-50μm，导热率为10-500W / mK的金属箔和/或金属网，以及包括含有100 重量份硅树脂和1000-3,000重量份形成在中间层的两个表面上的导热填料，使得总厚度在40-500μm的范围内。 该散热构件在室温下为非流体，但是由于电子部件运转时发出的热量的作用，其粘度降低，并且基于树脂和低熔点金属的相变而软化或熔化，因此 它有效地与电子部件和散热部件之间的边界紧密接触而没有任何间隙。 导热性填料含有熔融温度为40〜250℃，粒径为0.1〜100μm的低熔点金属粉末（1），以及具有熔融温度的导热性粉末（2） 超过250℃，平均粒径为0.1-100μm，使得（1）/ [（1）+（2）] = 0.2-1.0。

    Heat conductive composite sheet and process for producing same
    6.
    发明授权
    Heat conductive composite sheet and process for producing same 有权
    导热复合片及其制造方法

    公开(公告)号：US07279224B2

    公开(公告)日：2007-10-09

    申请号：US10643978

    申请日：2003-08-20

    申请人： Yoshitaka Aoki ,  Tsutomu Yoneyama ,  Kunihiko Mita

    发明人： Yoshitaka Aoki ,  Tsutomu Yoneyama ,  Kunihiko Mita

    IPC分类号： B32B25/20

    CPC分类号： B32B25/20 ,  B32B25/02 ,  B32B27/20 ,  H01L23/3737 ,  H01L2924/0002 ,  Y10T428/31663 ,  H01L2924/00

    摘要： A heat conductive composite sheet comprising (a) a heat softening, heat conductive layer containing a silicone resin and a heat conductive filler, and (b) a heat conductive silicone rubber layer containing a heat conductive filler is ideally suited to use as a heat radiating structure provided between a heat generating electronic component and a heat radiating component such as a heat sink or a circuit board, for the purposes of radiating heat away from the heat generating electronic component and thus cooling it. This heat conductive composite sheet not only offers good thermal conductivity, but if an installed heat conductive member formed from this type of heat conductive composite sheet needs to be removed temporarily to enable the electronic component such as a CPU to be repaired or replaced, the electronic component is not removed together with the heat conductive member.

    摘要翻译： 一种导热性复合片，其特征在于，包括：（a）含有硅树脂的热软化导热层和导热性填料，（b）含有导热性填料的导热性硅橡胶层，理想地适用于散热 在发热电子部件和诸如散热器或电路板的散热部件之间提供的结构，用于将热量从发热电子部件散热并因此冷却。 该导热性复合片不仅具有良好的导热性，而且，如果需要临时移除由这种导热性复合片形成的导热性部件，能够修复或更换CPU等电子部件， 部件不与导热部件一起被去除。

    Electroconductive silicone rubber composition and cured silicone rubber article thereof
    8.
    发明授权
    Electroconductive silicone rubber composition and cured silicone rubber article thereof 失效
    电绝缘硅橡胶组合物及其固化硅橡胶制品

    公开(公告)号：US5082596A

    公开(公告)日：1992-01-21

    申请号：US416379

    申请日：1989-10-03

    申请人： Takeshi Fukuda ,  Kunihiko Mita

    发明人： Takeshi Fukuda ,  Kunihiko Mita

    IPC分类号： C08K3/04 ,  C08L83/04 ,  H01B1/24

    CPC分类号： H01B1/24 ,  C08K3/04 ,  C08L83/04 ,  C08G77/20 ,  C08G77/70

    摘要： An electroconductive silicone rubber having a high electroconductivity and retaining the good workability in compounding and molding and excellent properties inherent in silicone rubbers in general can be obtained by compounding a curable organopolysiloxane composition comprising a gum-like diorganopolysiloxane, carbon black as a conductivity-imparting agent and a curing agent with a cured silicone rubber powder of spherical particle configuration having specified particle diameter and specified sphericity which partially replaces the diorganopolysiloxane gum.

    摘要翻译： 通常，通过将包含胶状二有机聚硅氧烷，炭黑的可固化的有机基聚硅氧烷组合物作为导电性赋予剂，可以获得具有高导电性并且在复合和模制中保持良好可加工性和优异的硅橡胶固有性能的导电硅橡胶 以及固化剂，其具有球形颗粒构型的固化的硅橡胶粉末，其具有特定的粒径和特定的球形度，其部分替代二有机聚硅氧烷胶。