公开(公告)号：US20150219499A1

公开(公告)日：2015-08-06

申请号：US14173149

申请日：2014-02-05

Applicant: Lam Research Corporation

Inventor： Ole Waldmann ,  Eric A. Pape ,  Robert Griffith O'Neill ,  Francisco Martinez

IPC: G01J5/02 ,  H01L21/66 ,  H01L21/67 ,  H01L21/683 ,  H01L21/3065 ,  G01N35/00

CPC classification number: G01J5/02 ,  G01J5/0007 ,  G01J5/025 ,  G01J5/10 ,  G01J2005/0048 ,  H01L21/67109 ,  H01L21/67248 ,  H01L21/6831

Abstract: A method for calculating power input to at least one thermal control element of an electrostatic chuck includes: setting the at least one thermal control element to a first predetermined power level; measuring a first temperature of the at least one thermal control element when the at least one thermal control element is powered at the first predetermined power level; setting the at least one thermal control element to a second predetermined power level; measuring a second temperature of the at least one thermal control element when the at least one thermal control element is powered at the second predetermined power level; calculating a difference between the first temperature and the second temperature; calculating a system response of the at least one thermal control element based on the difference; inverting the system response; and calibrating the at least one thermal control element based on the inverted system response.

Abstract translation: 一种用于计算静电卡盘的至少一个热控元件的功率输入的方法，包括：将所述至少一个热控制元件设置为第一预定功率水平; 当所述至少一个热控元件以所述第一预定功率水平供电时，测量所述至少一个热控元件的第一温度; 将所述至少一个热控制元件设置到第二预定功率水平; 当所述至少一个热控元件以所述第二预定功率电平供电时，测量所述至少一个热控元件的第二温度; 计算第一温度和第二温度之间的差; 基于所述差异来计算所述至少一个热控制元件的系统响应; 反转系统响应; 以及基于所述反向系统响应来校准所述至少一个热控制元件。

公开(公告)号：US20150168962A1

公开(公告)日：2015-06-18

申请号：US14109020

申请日：2013-12-17

Applicant: Lam Research Corporation

Inventor： Ole Waldmann ,  Eric A. Pape ,  Carlos Leal-Verdugo ,  Keith William Gaff

IPC: G05D23/19 ,  G05B19/418

CPC classification number: G05B19/418 ,  H01L21/67103 ,  H01L21/67248

Abstract: A method of determining thermal stability of an upper surface of a substrate support assembly comprises recording time resolved pre-process temperature data of the substrate before performing a plasma processing process while powering an array of thermal control elements to achieve a desired spatial and temporal temperature of the upper surface. A substrate is processed while powering the array of thermal control elements to achieve a desired spatial and temporal temperature of the upper surface of the assembly, and time resolved post-process temperature data of the assembly is recorded after processing the substrate. The post-process temperature data is recorded while powering the thermal control elements to achieve a desired spatial and temporal temperature of the upper surface. The post-process temperature data is compared to the pre-process temperature data to determine whether the data is within a desired tolerance range.

Abstract translation: 确定衬底支撑组件的上表面的热稳定性的方法包括在执行等离子体处理过程之前记录衬底的时间分辨的预处理温度数据，同时为热控制元件的阵列供电以实现期望的空间和时间温度 上表面。 处理衬底，同时为热控制元件阵列供电，以实现组件的上表面的期望的空间和时间温度，并且在处理衬底之后记录组件的时间分辨的后处理温度数据。 记录后处理温度数据，同时为热控制元件供电以实现上表面的期望的空间和时间温度。 将后处理温度数据与预处理温度数据进行比较，以确定数据是否在期望的公差范围内。