公开(公告)号：US20210090916A1

公开(公告)日：2021-03-25

申请号：US16842347

申请日：2020-04-07

Applicant: LG ELECTRONICS INC.

Inventor： Inbum YANG ,  Junghun RHO ,  Imdeok JUNG ,  Bongwoon CHOI

IPC: H01L21/67 ,  H01L21/683 ,  H01L25/075

Abstract: Discussed is a device for self-assembling semiconductor light-emitting diodes includes a substrate chuck that is provided in an assembly chamber and supports a substrate and disposes the substrate at an assembly position, wherein the substrate chuck sucks or injects a gas present between the substrate and a fluid during loading and unloading of the substrate.

公开(公告)号：US20210090909A1

公开(公告)日：2021-03-25

申请号：US16842323

申请日：2020-04-07

Applicant: LG ELECTRONICS INC.

Inventor： Inbum YANG ,  Junghun RHO ,  Imdeok JUNG ,  Bongwoon CHOI

IPC: H01L21/67 ,  H01L25/075 ,  H01L21/68

Abstract: Discussed is a device for self-assembling semiconductor light-emitting including: a chip supply part to supply the semiconductor light-emitting diodes to the substrate in cooperation with magnets disposed in a plurality of rows to form the magnetic field, wherein the chip supply part includes: a chip accommodating part to accommodate the semiconductor light-emitting diodes; a vertical moving part to adjust a distance between the chip supply part and the magnets; a horizontal moving part to move the chip supply part such that the chip accommodating part is alternately overlapped with a part of the magnets; and a controller to drive the vertical and horizontal moving parts to control a position of the chip supply part, and the controller moves the chip supply part in at least one of a horizontal direction and a vertical direction at a predetermined path and a plurality of points existing on the predetermined path.