公开(公告)号：US20240332447A1

公开(公告)日：2024-10-03

申请号：US18695344

申请日：2021-10-18

Applicant: LG ELECTRONICS INC.

Inventor： Junghun RHO ,  Imdeok JUNG ,  Bongwoon CHOI

IPC: H01L33/00 ,  H01L21/67 ,  H01L21/68 ,  H01L23/00 ,  H01L25/075

CPC classification number: H01L33/00 ,  H01L21/67121 ,  H01L21/68 ,  H01L24/97 ,  H01L25/0753

Abstract: The assembly apparatus comprises: a main frame; a magnet head arranged on the main frame so that a semiconductor light-emitting element is self-assembled on a panel; and a vibration isolator arranged on the main frame to offset vibration of the magnet head, wherein the magnet head comprises a magnet plate assembly, which includes a magnet applying an attractive force to the semiconductor light-emitting element, and the vibration isolator comprises a weight positioned on the magnet plate assembly and may minimize the transmission, to the main frame, of vibration generated by the magnet head.

公开(公告)号：US20230061671A1

公开(公告)日：2023-03-02

申请号：US17793244

申请日：2020-02-13

Applicant: LG ELECTRONICS INC.

Inventor： Inbum YANG ,  Junghun RHO ,  Sangsik JUNG ,  Bongwoon CHOI

IPC: H01L33/00 ,  H01L25/075

Abstract: The present invention relates to a display device manufacturing method and, particularly, to a chip tray for supplying a micro-LED. The present invention provides a chip tray for carrying semiconductor light emitting diodes in a fluid received in an assembly chamber. The chip tray includes a tray unit for receiving a plurality of semiconductor light emitting diodes; a chip alignment unit disposed on one side of the tray unit and having a plurality of magnets; and a transfer unit configured to move the tray unit and the chip alignment unit, wherein the transfer unit can vertically move one of the tray unit and the chip alignment unit with respect to the other one thereof.

公开(公告)号：US20220284559A1

公开(公告)日：2022-09-08

申请号：US17597433

申请日：2019-07-09

Applicant: LG ELECTRONICS INC.

Inventor： Seunghwan SEOK ,  Hyohyung LEE ,  Inbum YANG ,  Bongwoon CHOI

IPC: G06T7/00 ,  G01N21/95 ,  H01L27/15 ,  H01L33/00 ,  H01L33/44

Abstract: The present invention relates to an automatic display pixel inspection system and method and, particularly, to an automatic inspection system and method for inspecting defects occurring in the process of assembling semiconductor light emitting devices in a fluid.

公开(公告)号：US20240395577A1

公开(公告)日：2024-11-28

申请号：US18695403

申请日：2021-10-18

Applicant: LG ELECTRONICS INC.

Inventor： Junghun RHO ,  Imdeok JUNG ,  Bongwoon CHOI

IPC: H01L21/67 ,  H01L21/687 ,  H01L25/16

Abstract: The present embodiment comprises: a chip tray accommodated in a chamber; a chip bath in which a plurality of LED chips are accommodated; a magnet head which adsorbs/isolates an LED chip by a magnetic force; and a head transport mechanism which transports the magnet head to a first position of the chip bath and a second position of the chip tray, wherein the magnet head comprises: a magnet housing in which a magnet is accommodated; a moving-up/down member which moves up and down the magnet housing; a driving source which moves up and down the moving-up/down member; and a glass to/from which an LED chip is adsorbed or isolated.

公开(公告)号：US20230266379A1

公开(公告)日：2023-08-24

申请号：US18041166

申请日：2020-08-24

Applicant: LG ELECTRONICS INC.

Inventor： Inbum YANG ,  Sangsik JUNG ,  Junghun RHO ,  Bongwoon CHOI

IPC: G01R31/26 ,  H01L25/075

CPC classification number: G01R31/2601 ,  H01L25/0753

Abstract: A chip removing apparatus for a repair process of a μLED display comprises: a stage unit on which a substrate having at least one chip arranged thereon is mounted; a film stage on which an adhesive film is mounted such that the adhesive film is located on the substrate; a head having a pin which pressurizes the adhesive film such that the chip is attached to the lower surface of the adhesive film; and a head driver for moving the head.

公开(公告)号：US20230163007A1

公开(公告)日：2023-05-25

申请号：US17799111

申请日：2020-02-19

Applicant: LG ELECTRONICS INC.

Inventor： Inbum YANG ,  Junghun RHO ,  Youngkyu KIM ,  Bongwoon CHOI

IPC: H01L21/677 ,  H01L33/00

CPC classification number: H01L21/67721 ,  H01L33/005 ,  H01L21/67333

Abstract: The present invention relates to a method of manufacturing a display device, and more particularly, to a chip dispenser for supplying a micro-LED. The present invention provides a chip dispenser including a body part for accommodating the fluid and the semiconductor light emitting device, and discharging the accommodated fluid and the semiconductor light emitting device, a pressure controller for varying the pressure inside the body; and a stirring part disposed in at least one of the inside and outside of the body, agitating the fluid accommodated in the body and the pressure controller increases the internal pressure of the body part so that the fluid and the semiconductor light emitting device are discharged to the outside in a state in which the agitating part stirs the fluid.

公开(公告)号：US20220301902A1

公开(公告)日：2022-09-22

申请号：US17835712

申请日：2022-06-08

Applicant: LG ELECTRONICS INC.

Inventor： Inbum YANG ,  Junghun RHO ,  Imdeok JUNG ,  Bongwoon CHOI

IPC: H01L21/67 ,  H01L21/683 ,  H01L25/075

Abstract: Discussed is a device for self-assembling semiconductor light-emitting diodes for placing the semiconductor light-emitting diodes at predetermined positions on a substrate by using an electric field and a magnetic field, the substrate being accommodated in an assembly chamber accommodating a fluid, the device including a substrate chuck configured to dispose the substrate at an assembly position, wherein the substrate chuck includes a substrate support part configured to support the substrate on which an assembly electrode is formed, a rotating part configured to support the substrate support part, and a controller configured to control driving of the substrate chuck, wherein the substrate support part includes micro-holes for injecting a gas between the fluid and the substrate, and wherein the controller controls whether the gas is injected through the micro-holes according to whether the substrate is raised or lowered.

公开(公告)号：US20220328716A1

公开(公告)日：2022-10-13

申请号：US17761839

申请日：2020-02-13

Applicant: LG ELECTRONICS INC.

Inventor： Inbum YANG ,  Junghun RHO ,  Sangsik JUNG ,  Bongwoon CHOI

IPC: H01L33/00 ,  H01L21/67 ,  H01L21/673

Abstract: Discussed is an assembly chamber containing a fluid. The assembly chamber includes a bottom portion, a side wall portion formed at a predetermined height on the bottom portion and disposed to surround the bottom portion, and a partition wall part formed on the bottom portion and extending from one inner surface of a plurality of inner surfaces provided in the side wall portion to another inner surface facing the one inner surface. The vertical height of at least a portion of the partition wall part is variable with respect to the bottom portion.

公开(公告)号：US20210252671A1

公开(公告)日：2021-08-19

申请号：US15930853

申请日：2020-05-13

Applicant: LG ELECTRONICS INC.

Inventor： Inbum YANG ,  Imdeok JUNG ,  Junghun RHO ,  Bongwoon CHOI

IPC: B25B5/02 ,  H01L21/687

Abstract: Discussed is a substrate chuck for self-assembling micro LEDs. The substrate chuck can include a first frame having a hole at a central portion thereof, a second frame having a hole at a central portion thereof and disposed to overlap the first frame, a frame transfer part configured to transfer the second frame so that the second frame presses the substrate while the substrate is disposed between the first and second frames, and an auxiliary clamp configured to additionally press the second frame toward the substrate while the second frame is pressing on the substrate.

公开(公告)号：US20210090929A1

公开(公告)日：2021-03-25

申请号：US16857818

申请日：2020-04-24

Applicant: LG ELECTRONICS INC.

Inventor： Inbum YANG ,  Imdeok JUNG ,  Junghun RHO ,  Bongwoon CHOI

IPC: H01L21/68 ,  H01L33/00 ,  H01L25/075 ,  H01L21/67 ,  H01L21/50

Abstract: Discussed is a substrate chuck for allowing one surface of a substrate to be in contact with a fluid, the substrate chuck including a first frame having a hole at a central portion thereof; a second frame having a hole at a central portion thereof and disposed to overlap the first frame; and a frame transfer part configured to vertically move the second frame with respect to the first frame, wherein the first frame includes: a bottom portion at which the hole is formed; and a sidewall portion formed on a peripheral edge of the bottom portion, and wherein a height of the sidewall portion is greater than a depth at which the substrate is placed into the fluid.