公开(公告)号：US20240332447A1

公开(公告)日：2024-10-03

申请号：US18695344

申请日：2021-10-18

Applicant: LG ELECTRONICS INC.

Inventor： Junghun RHO ,  Imdeok JUNG ,  Bongwoon CHOI

IPC: H01L33/00 ,  H01L21/67 ,  H01L21/68 ,  H01L23/00 ,  H01L25/075

CPC classification number: H01L33/00 ,  H01L21/67121 ,  H01L21/68 ,  H01L24/97 ,  H01L25/0753

Abstract: The assembly apparatus comprises: a main frame; a magnet head arranged on the main frame so that a semiconductor light-emitting element is self-assembled on a panel; and a vibration isolator arranged on the main frame to offset vibration of the magnet head, wherein the magnet head comprises a magnet plate assembly, which includes a magnet applying an attractive force to the semiconductor light-emitting element, and the vibration isolator comprises a weight positioned on the magnet plate assembly and may minimize the transmission, to the main frame, of vibration generated by the magnet head.

公开(公告)号：US20240395577A1

公开(公告)日：2024-11-28

申请号：US18695403

申请日：2021-10-18

Applicant: LG ELECTRONICS INC.

Inventor： Junghun RHO ,  Imdeok JUNG ,  Bongwoon CHOI

IPC: H01L21/67 ,  H01L21/687 ,  H01L25/16

Abstract: The present embodiment comprises: a chip tray accommodated in a chamber; a chip bath in which a plurality of LED chips are accommodated; a magnet head which adsorbs/isolates an LED chip by a magnetic force; and a head transport mechanism which transports the magnet head to a first position of the chip bath and a second position of the chip tray, wherein the magnet head comprises: a magnet housing in which a magnet is accommodated; a moving-up/down member which moves up and down the magnet housing; a driving source which moves up and down the moving-up/down member; and a glass to/from which an LED chip is adsorbed or isolated.

公开(公告)号：US20220301902A1

公开(公告)日：2022-09-22

申请号：US17835712

申请日：2022-06-08

Applicant: LG ELECTRONICS INC.

Inventor： Inbum YANG ,  Junghun RHO ,  Imdeok JUNG ,  Bongwoon CHOI

IPC: H01L21/67 ,  H01L21/683 ,  H01L25/075

Abstract: Discussed is a device for self-assembling semiconductor light-emitting diodes for placing the semiconductor light-emitting diodes at predetermined positions on a substrate by using an electric field and a magnetic field, the substrate being accommodated in an assembly chamber accommodating a fluid, the device including a substrate chuck configured to dispose the substrate at an assembly position, wherein the substrate chuck includes a substrate support part configured to support the substrate on which an assembly electrode is formed, a rotating part configured to support the substrate support part, and a controller configured to control driving of the substrate chuck, wherein the substrate support part includes micro-holes for injecting a gas between the fluid and the substrate, and wherein the controller controls whether the gas is injected through the micro-holes according to whether the substrate is raised or lowered.

公开(公告)号：US20210252671A1

公开(公告)日：2021-08-19

申请号：US15930853

申请日：2020-05-13

Applicant: LG ELECTRONICS INC.

Inventor： Inbum YANG ,  Imdeok JUNG ,  Junghun RHO ,  Bongwoon CHOI

IPC: B25B5/02 ,  H01L21/687

Abstract: Discussed is a substrate chuck for self-assembling micro LEDs. The substrate chuck can include a first frame having a hole at a central portion thereof, a second frame having a hole at a central portion thereof and disposed to overlap the first frame, a frame transfer part configured to transfer the second frame so that the second frame presses the substrate while the substrate is disposed between the first and second frames, and an auxiliary clamp configured to additionally press the second frame toward the substrate while the second frame is pressing on the substrate.

公开(公告)号：US20210090929A1

公开(公告)日：2021-03-25

申请号：US16857818

申请日：2020-04-24

Applicant: LG ELECTRONICS INC.

Inventor： Inbum YANG ,  Imdeok JUNG ,  Junghun RHO ,  Bongwoon CHOI

IPC: H01L21/68 ,  H01L33/00 ,  H01L25/075 ,  H01L21/67 ,  H01L21/50

Abstract: Discussed is a substrate chuck for allowing one surface of a substrate to be in contact with a fluid, the substrate chuck including a first frame having a hole at a central portion thereof; a second frame having a hole at a central portion thereof and disposed to overlap the first frame; and a frame transfer part configured to vertically move the second frame with respect to the first frame, wherein the first frame includes: a bottom portion at which the hole is formed; and a sidewall portion formed on a peripheral edge of the bottom portion, and wherein a height of the sidewall portion is greater than a depth at which the substrate is placed into the fluid.

公开(公告)号：US20210090924A1

公开(公告)日：2021-03-25

申请号：US16818296

申请日：2020-03-13

Applicant: LG ELECTRONICS INC.

Inventor： Inbum YANG ,  Junghun RHO ,  Imdeok JUNG ,  Bongwoon CHOI

IPC: H01L21/677 ,  H01L33/00 ,  H01L25/075

Abstract: Discussed are a device for self-assembling semiconductor light-emitting diodes, in which the device includes an assembly chamber having a space for accommodating a fluid; a magnetic field forming part having at least one magnet for applying a magnetic force to the semiconductor light-emitting diodes dispersed in the fluid and a moving part for changing positions of the at least one magnet so that the semiconductor light-emitting diodes move in the fluid; and a substrate chuck having a substrate support part configured to support a substrate, and a vertical moving part for lowering the substrate so that one surface of the substrate is in contact with the fluid in a state in which the substrate is supported by the substrate support part, wherein the vertical moving part provided at the substrate chuck lowers the substrate on to the fluid so that a force of buoyancy by the fluid is applied to the substrate.

公开(公告)号：US20230361077A1

公开(公告)日：2023-11-09

申请号：US18038136

申请日：2020-11-23

Applicant: LG ELECTRONICS INC.

Inventor： Byungjun KANG ,  Imdeok JUNG ,  Philwon YOON ,  Sungyun PARK ,  Dohwan YANG ,  Junghoon KIM

IPC: H01L23/00 ,  H01L21/683 ,  H01L21/677 ,  H01L21/67 ,  H01L25/075

CPC classification number: H01L24/97 ,  H01L21/6835 ,  H01L21/67742 ,  H01L21/67144 ,  H01L21/67754 ,  H01L21/67757 ,  H01L25/0753 ,  H01L2224/95085 ,  H01L2224/95101 ,  H01L2224/95144 ,  H01L2924/12041 ,  H01L2224/97

Abstract: Discussed is a self-assembly apparatus that can include a chamber, at least one first supply part configured to supply a fluid to the chamber, a mounting part disposed on a first side of the chamber to mount a substrate to be inclined with respect to a horizontal plane of the chamber, the substrate having an assembly surface, and a magnet module disposed on an opposite surface of the substrate opposite to the assembly surface of the substrate, wherein the mounting part is configured to: insert the substrate into an upper side of the chamber, guide the inserted substrate from the upper side of the chamber toward a lower side of the chamber, and fix the guided substrate to the lower side of the chamber

公开(公告)号：US20220139747A1

公开(公告)日：2022-05-05

申请号：US17579289

申请日：2022-01-19

Applicant: LG ELECTRONICS INC.

Inventor： Inbum YANG ,  Junghun RHO ,  Imdeok JUNG ,  Bongwoon CHOI

IPC: H01L21/677 ,  H01L25/075 ,  H01L33/00

Abstract: Discussed is a device for self-assembling semiconductor light-emitting diodes, the device including an assembly chamber having a space for accommodating a fluid; and a substrate chuck having a substrate support part configured to support a substrate, and a vertical moving part for lowering the substrate so that one surface of the substrate is in contact with the fluid in a state in which the substrate is supported by the substrate support part.

公开(公告)号：US20210090928A1

公开(公告)日：2021-03-25

申请号：US16818222

申请日：2020-03-13

Applicant: LG ELECTRONICS INC.

Inventor： Inbum YANG ,  Junghun RHO ,  Imdeok JUNG ,  Bongwoon CHOI

IPC: H01L21/68 ,  H01L33/00 ,  H01L25/075 ,  H01L21/677

Abstract: Discussed is a substrate chuck including: a substrate support part for supporting a substrate having an assembly electrode; a vertical moving part which moves the substrate so that one surface of the substrate comes in contact with a fluid in a state in which the substrate is supported by the substrate support; an electrode connection part for applying power to the assembly electrode to generate an electric field so that semiconductor light-emitting diodes are placed at the predetermined positions of the substrate in a process of moving the semiconductor light-emitting diodes by a position change of at least one magnet; and a rotating part for rotating the substrate support part around a rotating shaft so that the substrate is placed in an upward or downward direction, wherein the rotating shaft is spaced apart from a center of the substrate support part at a predetermined distance.

公开(公告)号：US20210090925A1

公开(公告)日：2021-03-25

申请号：US16818469

申请日：2020-03-13

Applicant: LG ELECTRONICS INC.

Inventor： Inbum YANG ,  Sangsik JUNG ,  Imdeok JUNG ,  Bongwoon CHOI

IPC: H01L21/677 ,  H01L33/00 ,  H01L25/075

Abstract: Discussed is a device for self-assembling semiconductor light-emitting diodes, in which the device includes an assembly chamber having a space for accommodating a fluid; a magnetic field forming part having at least one magnet for applying a magnetic force to the semiconductor light-emitting diodes dispersed in the fluid and a moving part for changing positions of the at least one magnet so that the semiconductor light-emitting diodes move in the fluid; a substrate chuck having a substrate support part configured to support a substrate, and a vertical moving part for lowering the substrate so that one surface of the substrate is in contact with the fluid in a state in which the substrate is supported by the substrate support part; and a controller for controlling a movement of the magnetic field forming part and the substrate chuck, wherein the controller controls a depth at which the substrate is submerged in the fluid based on a degree of warping of the substrate.