公开(公告)号：US20230339412A1

公开(公告)日：2023-10-26

申请号：US18347756

申请日：2023-07-06

Applicant: MAGNA ELECTRONICS INC.

Inventor： Garret F. Achenbach ,  Brian A. Gorman ,  Brian F. Smith ,  Steven G. Gebauer

IPC: H04N7/18 ,  B60R11/04 ,  H04N23/57 ,  H05K7/20 ,  B60R1/00

CPC classification number: B60R11/04 ,  B60R1/00 ,  H04N7/181 ,  H04N23/57 ,  H05K7/2039

Abstract: A vehicular vision system includes a camera module having a housing that houses at least (i) electronic circuitry disposed at a main printed circuit board (PCB) and (ii) an imager assembly. The imager assembly includes an imaging array sensor, an imager PCB and a lens holder that includes an elongated lens barrel that houses at least one lens. Electronic circuitry is disposed at an upper side and at a lower side of the main PCB. Image data captured by the imaging array sensor is conveyed to electronic circuitry disposed at the main PCB. An electronic component of electronic circuitry disposed at the main PCB is in thermal conductivity with a thermal element, which is in thermal conductivity with a lower housing portion of the housing to enhance heat transfer from the electronic component to the lower housing portion of the camera housing.

公开(公告)号：US20210188191A1

公开(公告)日：2021-06-24

申请号：US17249703

申请日：2021-03-10

Applicant: MAGNA ELECTRONICS INC.

Inventor： Garret F. Achenbach ,  Brian A. Gorman ,  Brian F. Smith ,  Steven G. Gebauer

IPC: B60R11/04 ,  H05K7/20 ,  B60R1/00 ,  H04N7/18 ,  H04N5/225

Abstract: A vehicular vision system includes a camera module having a housing that houses at least (i) electronic circuitry disposed at a main printed circuit board (PCB) and (ii) an imager assembly. The imager assembly includes an imager, an imager PCB and a lens holder that includes an elongated lens barrel that houses at least one lens. Electronic circuitry is disposed at an upper side and at a lower side of the main PCB and includes an image processing chip. Image data captured by the imager is conveyed via a flexible cable to electronic circuitry disposed at the main PCB. An electronic component of electronic circuitry disposed at the main PCB is in thermal conductivity with a thermal element, which is in thermal conductivity with a lower housing portion of the housing to enhance heat transfer from the electronic component to the lower housing portion.

公开(公告)号：US10288724B2

公开(公告)日：2019-05-14

申请号：US14946856

申请日：2015-11-20

Applicant: MAGNA ELECTRONICS INC.

Inventor： Hasib Hassan ,  Dale R. Benton ,  John Lu ,  Brian A. Gorman

IPC: G01S11/02 ,  G01S11/06 ,  G01S11/08

Abstract: A method of estimating a distance between a mobile unit and a vehicle includes providing a time of flight subsystem including circuitry incorporated in the mobile unit and circuitry incorporated in the vehicle, and generating a time of flight distance signal by periodically transmitting a time of flight signal between the mobile unit and the vehicle and measuring the time taken for transmission of the time of flight signal therebetween. A travel sensor is disposed at the mobile unit and generates a travel sensor signal. A value of a distance estimate signal is initialized based on the time of flight distance signal. A movement of the mobile unit is determined based on variance in the travel sensor signal. The initialized value of the initialized distance estimate signal is changed or increased or decreased based upon determination of movement of the mobile unit.

公开(公告)号：US10214157B2

公开(公告)日：2019-02-26

申请号：US15899131

申请日：2018-02-19

Applicant: MAGNA ELECTRONICS INC.

Inventor： Garret F. Achenbach ,  Brian A. Gorman ,  Brian F. Smith ,  Steven G. Gebauer

IPC: H04N9/47 ,  H04N7/18 ,  B60R11/04 ,  H05K7/20 ,  B60R1/00 ,  H04N5/225

Abstract: A camera module for a vehicular vision system includes a housing that houses at least (i) an imager assembly and (ii) electronic circuitry disposed at at least two printed circuit boards (PCBs). One of the electronic components of the electronic circuitry disposed at a first PCB includes an imager. A second PCB has electronic components of the electronic circuitry disposed at an upper side and at a lower side of the second PCB. The lower side of the second PCB opposes a lower housing portion and the upper side of the second PCB opposes an upper housing portion. The imager assembly includes a flexible cable that connects electronic components disposed at the first PCB with electronic components disposed at the second PCB. An electronic component is in thermal conductivity with a thermal element, which is in thermal conductivity with the housing.