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1.发明公开公开(公告)号：US20230219500A1
公开(公告)日：2023-07-13
申请号：US18153440
申请日：2023-01-12
Applicant: Magna Electronics Inc.
Inventor： Garret F. Achenbach , Martin J. Reckker , Steven G. Gebauer , Jianguo Wang
Abstract: A vehicular camera module includes a housing for mounting at a vehicular windshield, a processor printed circuit board (processor PCB) disposed in the housing, and an imager assembly. The imager assembly includes (i) a lens barrel accommodating a lens, (ii) an imager printed circuit board (imager PCB), and (iii) a flexible electrical ribbon cable that electrically connects the imager PCB to the processor PCB. An imager is disposed at a first side of the imager PCB. The imager PCB includes an imager portion at which the imager is disposed and attaching portions at respective outboard ends. At least one stress relieving portion is established at the imager PCB between the imager portion and each of the attaching portions. With the lens barrel received through an aperture of the housing, the attaching portions of the imager PCB are attached at the housing via respective fasteners.
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公开(公告)号：US11697382B2
公开(公告)日：2023-07-11
申请号：US17813050
申请日：2022-07-18
Applicant: MAGNA ELECTRONICS INC.
Inventor： Garret F. Achenbach , Brian A. Gorman , Brian F. Smith , Steven G. Gebauer
CPC classification number: B60R11/04 , B60R1/00 , H04N7/181 , H04N23/57 , H05K7/2039
Abstract: A vehicular vision system includes a camera module having a housing that houses at least (i) electronic circuitry disposed at a main printed circuit board (PCB) and (ii) an imager assembly. The imager assembly includes an imaging array sensor, an imager PCB and a lens holder that includes an elongated lens barrel that houses at least one lens. Electronic circuitry is disposed at an upper side and at a lower side of the main PCB. Image data captured by the imaging array sensor is conveyed via a flexible cable to electronic circuitry disposed at the main PCB. An electronic component of electronic circuitry disposed at the main PCB is in thermal conductivity with a thermal element, which is in thermal conductivity with a lower housing portion of the housing to enhance heat transfer from the electronic component to the lower housing portion of the camera housing.
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公开(公告)号：US09896039B2
公开(公告)日：2018-02-20
申请号：US14705076
申请日：2015-05-06
Applicant: MAGNA ELECTRONICS INC.
Inventor： Garret F. Achenbach , Brian A. Gorman , Brian F. Smith , Steven G. Gebauer
CPC classification number: B60R11/04 , B60R1/00 , H04N5/2257 , H04N7/181 , H05K7/2039
Abstract: A vehicle vision system includes a camera module configured to attach at an in-cabin surface of a windshield of a vehicle equipped with the vision system. The camera module includes a housing and an imager assembly. The imager assembly includes a structure and an imager and a lens. The imager is disposed at an imager circuit board of the imager assembly. A thermal element is configured to attach at the structure of the imager assembly and includes a support element and a thermal pad disposed at least partially along the support element. With the thermal element attached at the structure of the imager assembly, a first portion of the thermal pad is engaged with the imager circuit board, and wherein, with the imager assembly disposed at the housing of the camera module, a second portion of the thermal pad is engaged with the housing.
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4.发明授权公开(公告)号：US12208739B2
公开(公告)日：2025-01-28
申请号：US18153440
申请日：2023-01-12
Applicant: Magna Electronics Inc.
Inventor： Garret F. Achenbach , Martin J. Reckker , Steven G. Gebauer , Jianguo Wang
Abstract: A vehicular camera module includes a housing for mounting at a vehicular windshield, a processor printed circuit board (processor PCB) disposed in the housing, and an imager assembly. The imager assembly includes (i) a lens barrel accommodating a lens, (ii) an imager printed circuit board (imager PCB), and (iii) a flexible electrical ribbon cable that electrically connects the imager PCB to the processor PCB. An imager is disposed at a first side of the imager PCB. The imager PCB includes an imager portion at which the imager is disposed and attaching portions at respective outboard ends. At least one stress relieving portion is established at the imager PCB between the imager portion and each of the attaching portions. With the lens barrel received through an aperture of the housing, the attaching portions of the imager PCB are attached at the housing via respective fasteners.
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公开(公告)号：US20230247275A1
公开(公告)日：2023-08-03
申请号：US18162767
申请日：2023-02-01
Applicant: Magna Electronics Inc.
Inventor： Rene Dreiocker , Steven V. Byme , Jonathan D. Conger , Garret F. Achenbach , Andreas Weis
Abstract: A vehicular camera module includes a camera housing having a front housing portion and a rear housing portion, a lens barrel accommodating a lens, and an imager printed circuit board (PCB). The lens barrel is attached at the front housing portion and extends through an aperture of the front housing portion. With an imager aligned with the lens, the imager PCB is adhesively attached at an inner end of the lens barrel. With the lens barrel and a connector PCB attached at the front housing portion, the connector PCB is spaced from the imager printed circuit board. Circuitry of the imager PCB is electrically connected to circuitry of the connector PCB via a flexible electrical connector. The rear housing portion includes a receiving portion configured to receive the electrical connector when the front housing portion is attached at the rear housing portion during assembly of the vehicular camera module.
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Patent Agency Ranking
公开(公告)号：US20190184911A1
公开(公告)日：2019-06-20
申请号：US16283920
申请日：2019-02-25
Applicant: MAGNA ELECTRONICS INC.
Inventor： Garret F. Achenbach , Brian A. Gorman , Brian F. Smith , Steven G. Gebauer
CPC classification number: B60R11/04 , B60R1/00 , H04N5/2257 , H04N7/181 , H05K7/2039
Abstract: A camera module for a vehicular vision system includes a housing that houses at least (i) electronic circuitry disposed at a main printed circuit board (PCB) and (ii) an imager assembly. The imager assembly includes an imager and an imager PCB. Electronic circuitry is disposed at an upper side and at a lower side of the main PCB. The lower side of the main PCB faces a lower housing portion and the upper side of the main PCB faces an upper housing portion. The imager assembly includes a flexible cable that connects electronic circuitry disposed at the imager PCB with electronic circuitry disposed at the main PCB. An electronic component of electronic circuitry disposed at the main PCB is in thermal conductivity with a thermal element, which is in thermal conductivity with the lower housing portion. The thermal element includes a thermally conductive resilient material.
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公开(公告)号：US10112552B2
公开(公告)日：2018-10-30
申请号：US15062525
申请日：2016-03-07
Applicant: MAGNA ELECTRONICS INC.
Inventor： Tom Toma , Alan M. Cordeiro , Ove J. Salomonsson , Garret F. Achenbach
Abstract: A vision system of a vehicle includes a camera disposed at a vehicle windshield and viewing through the windshield and exterior of the vehicle. A light-absorbing hiding layer is established at the windshield at an area at which the camera is disposed and includes an portion established therethrough, with the portion aligned with the camera such that the camera views through the windshield via the portion. The portion comprises a wider central region and narrower upper and lower regions. The wider central region of the portion provides a wide angle field of view of the camera at a region ahead of the vehicle and the narrower lower region of the portion reduces the field of view at regions near to and sidewards from the front of the vehicle. An image processor is operable to process image data captured by the camera for a machine vision function or driver assistance system.
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公开(公告)号：US20150327398A1
公开(公告)日：2015-11-12
申请号：US14705076
申请日：2015-05-06
Applicant: MAGNA ELECTRONICS INC.
Inventor： Garret F. Achenbach , Brian A. Gorman , Brian F. Smith , Steven G. Gebauer
CPC classification number: B60R11/04 , B60R1/00 , H04N5/2257 , H04N7/181 , H05K7/2039
Abstract: A vehicle vision system includes a camera module configured to attach at an in-cabin surface of a windshield of a vehicle equipped with the vision system. The camera module includes a housing and an imager assembly. The imager assembly includes a structure and an imager and a lens. The imager is disposed at an imager circuit board of the imager assembly. A thermal element is configured to attach at the structure of the imager assembly and includes a support element and a thermal pad disposed at least partially along the support element. With the thermal element attached at the structure of the imager assembly, a first portion of the thermal pad is engaged with the imager circuit board, and wherein, with the imager assembly disposed at the housing of the camera module, a second portion of the thermal pad is engaged with the housing.
Abstract translation: 车辆视觉系统包括相机模块，该相机模块被配置为附接在装备有视觉系统的车辆的挡风玻璃的舱内表面。 相机模块包括壳体和成像器组件。 成像器组件包括结构和成像器和透镜。 成像器被放置在成像器组件的成像器电路板上。 热元件构造成附接在成像器组件的结构处，并且包括支撑元件和至少部分地沿支撑元件设置的热垫。 当热元件附接在成像器组件的结构处时，散热垫的第一部分与成像器电路板接合，并且其中，在成像器组件设置在相机模块的壳体处，第二部分热 垫与壳体接合。
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公开(公告)号：US20230339412A1
公开(公告)日：2023-10-26
申请号：US18347756
申请日：2023-07-06
Applicant: MAGNA ELECTRONICS INC.
Inventor： Garret F. Achenbach , Brian A. Gorman , Brian F. Smith , Steven G. Gebauer
CPC classification number: B60R11/04 , B60R1/00 , H04N7/181 , H04N23/57 , H05K7/2039
Abstract: A vehicular vision system includes a camera module having a housing that houses at least (i) electronic circuitry disposed at a main printed circuit board (PCB) and (ii) an imager assembly. The imager assembly includes an imaging array sensor, an imager PCB and a lens holder that includes an elongated lens barrel that houses at least one lens. Electronic circuitry is disposed at an upper side and at a lower side of the main PCB. Image data captured by the imaging array sensor is conveyed to electronic circuitry disposed at the main PCB. An electronic component of electronic circuitry disposed at the main PCB is in thermal conductivity with a thermal element, which is in thermal conductivity with a lower housing portion of the housing to enhance heat transfer from the electronic component to the lower housing portion of the camera housing.
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公开(公告)号：US20230331152A1
公开(公告)日：2023-10-19
申请号：US18337484
申请日：2023-06-20
Applicant: MAGNA ELECTRONICS INC.
Inventor： Garret F. Achenbach , Brian J. Winden , Christopher L. Van Dan Elzen
CPC classification number: B60R1/00 , B60R1/04 , B60R1/12 , B60R11/04 , H04N23/51 , H04N23/54 , H04N23/55 , H04N23/57 , B60K2370/152 , B60K2370/173 , B60K2370/21 , B60K2370/777 , H04N23/52 , Y10T29/49169
Abstract: A vehicular camera system includes a camera module having an imager assembly, a main circuit board and a camera housing. The imager assembly includes (i) an imager disposed on an imager circuit board and (ii) a lens holder having a lens assembly that includes a lens barrel accommodating a lens. The imager assembly includes a flexible ribbon cable that electrically connects to an electrical connector at a multilayered PCB of the main circuit board. The camera housing includes an upper cover and a lower cover and includes a forward portion and a rearward portion. The main circuit board is accommodated within the forward and rearward portions, and the imager is disposed at the rearward portion and is not disposed at the forward portion of the camera housing. The lens holder is attached at the upper cover of the camera housing.
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