公开(公告)号：US20190184911A1

公开(公告)日：2019-06-20

申请号：US16283920

申请日：2019-02-25

Applicant: MAGNA ELECTRONICS INC.

Inventor： Garret F. Achenbach ,  Brian A. Gorman ,  Brian F. Smith ,  Steven G. Gebauer

IPC: B60R11/04 ,  H04N5/225 ,  H05K7/20 ,  H04N7/18 ,  B60R1/00

CPC classification number: B60R11/04 ,  B60R1/00 ,  H04N5/2257 ,  H04N7/181 ,  H05K7/2039

Abstract: A camera module for a vehicular vision system includes a housing that houses at least (i) electronic circuitry disposed at a main printed circuit board (PCB) and (ii) an imager assembly. The imager assembly includes an imager and an imager PCB. Electronic circuitry is disposed at an upper side and at a lower side of the main PCB. The lower side of the main PCB faces a lower housing portion and the upper side of the main PCB faces an upper housing portion. The imager assembly includes a flexible cable that connects electronic circuitry disposed at the imager PCB with electronic circuitry disposed at the main PCB. An electronic component of electronic circuitry disposed at the main PCB is in thermal conductivity with a thermal element, which is in thermal conductivity with the lower housing portion. The thermal element includes a thermally conductive resilient material.

公开(公告)号：US20150327398A1

公开(公告)日：2015-11-12

申请号：US14705076

申请日：2015-05-06

Applicant: MAGNA ELECTRONICS INC.

Inventor： Garret F. Achenbach ,  Brian A. Gorman ,  Brian F. Smith ,  Steven G. Gebauer

IPC: H05K7/20 ,  H04N7/18 ,  B60R1/00

CPC classification number: B60R11/04 ,  B60R1/00 ,  H04N5/2257 ,  H04N7/181 ,  H05K7/2039

Abstract: A vehicle vision system includes a camera module configured to attach at an in-cabin surface of a windshield of a vehicle equipped with the vision system. The camera module includes a housing and an imager assembly. The imager assembly includes a structure and an imager and a lens. The imager is disposed at an imager circuit board of the imager assembly. A thermal element is configured to attach at the structure of the imager assembly and includes a support element and a thermal pad disposed at least partially along the support element. With the thermal element attached at the structure of the imager assembly, a first portion of the thermal pad is engaged with the imager circuit board, and wherein, with the imager assembly disposed at the housing of the camera module, a second portion of the thermal pad is engaged with the housing.

Abstract translation: 车辆视觉系统包括相机模块，该相机模块被配置为附接在装备有视觉系统的车辆的挡风玻璃的舱内表面。 相机模块包括壳体和成像器组件。 成像器组件包括结构和成像器和透镜。 成像器被放置在成像器组件的成像器电路板上。 热元件构造成附接在成像器组件的结构处，并且包括支撑元件和至少部分地沿支撑元件设置的热垫。 当热元件附接在成像器组件的结构处时，散热垫的第一部分与成像器电路板接合，并且其中，在成像器组件设置在相机模块的壳体处，第二部分热 垫与壳体接合。

公开(公告)号：US11964617B2

公开(公告)日：2024-04-23

申请号：US18347756

申请日：2023-07-06

Applicant: MAGNA ELECTRONICS INC.

Inventor： Garret F. Achenbach ,  Brian A. Gorman ,  Brian F. Smith ,  Steven G. Gebauer

IPC: B60R11/04 ,  B60R1/00 ,  H04N7/18 ,  H04N23/57 ,  H05K7/20

CPC classification number: B60R11/04 ,  B60R1/00 ,  H04N7/181 ,  H04N23/57 ,  H05K7/2039

Abstract: A vehicular vision system includes a camera module having a housing that houses at least (i) electronic circuitry disposed at a main printed circuit board (PCB) and (ii) an imager assembly. The imager assembly includes an imaging array sensor, an imager PCB and a lens holder that includes an elongated lens barrel that houses at least one lens. Electronic circuitry is disposed at an upper side and at a lower side of the main PCB. Image data captured by the imaging array sensor is conveyed to electronic circuitry disposed at the main PCB. An electronic component of electronic circuitry disposed at the main PCB is in thermal conductivity with a thermal element, which is in thermal conductivity with a lower housing portion of the housing to enhance heat transfer from the electronic component to the lower housing portion of the camera housing.

公开(公告)号：US20180170279A1

公开(公告)日：2018-06-21

申请号：US15899131

申请日：2018-02-19

Applicant: MAGNA ELECTRONICS INC.

Inventor： Garret F. Achenbach ,  Brian A. Gorman ,  Brian F. Smith ,  Steven G. Gebauer

IPC: B60R11/04 ,  H05K7/20 ,  B60R1/00 ,  H04N5/225 ,  H04N7/18

CPC classification number: B60R11/04 ,  B60R1/00 ,  H04N5/2257 ,  H04N7/181 ,  H05K7/2039

Abstract: A camera module for a vehicular vision system includes a housing that houses at least (i) an imager assembly and (ii) electronic circuitry disposed at at least two printed circuit boards (PCBs). One of the electronic components of the electronic circuitry disposed at a first PCB includes an imager. A second PCB has electronic components of the electronic circuitry disposed at an upper side and at a lower side of the second PCB. The lower side of the second PCB opposes a lower housing portion and the upper side of the second PCB opposes an upper housing portion. The imager assembly includes a flexible cable that connects electronic components disposed at the first PCB with electronic components disposed at the second PCB. An electronic component is in thermal conductivity with a thermal element, which is in thermal conductivity with the housing.

公开(公告)号：US20220355745A1

公开(公告)日：2022-11-10

申请号：US17813050

申请日：2022-07-18

Applicant: MAGNA ELECTRONICS INC.

Inventor： Garret F. Achenbach ,  Brian A. Gorman ,  Brian F. Smith ,  Steven G. Gebauer

IPC: B60R11/04 ,  H05K7/20 ,  B60R1/00 ,  H04N7/18 ,  H04N5/225

Abstract: A vehicular vision system includes a camera module having a housing that houses at least (i) electronic circuitry disposed at a main printed circuit board (PCB) and (ii) an imager assembly. The imager assembly includes an imaging array sensor, an imager PCB and a lens holder that includes an elongated lens barrel that houses at least one lens. Electronic circuitry is disposed at an upper side and at a lower side of the main PCB. Image data captured by the imaging array sensor is conveyed via a flexible cable to electronic circuitry disposed at the main PCB. An electronic component of electronic circuitry disposed at the main PCB is in thermal conductivity with a thermal element, which is in thermal conductivity with a lower housing portion of the housing to enhance heat transfer from the electronic component to the lower housing portion of the camera housing.

公开(公告)号：US10946813B2

公开(公告)日：2021-03-16

申请号：US16806100

申请日：2020-03-02

Applicant: MAGNA ELECTRONICS INC.

Inventor： Garret F. Achenbach ,  Brian A. Gorman ,  Brian F. Smith ,  Steven G. Gebauer

IPC: B60R11/04 ,  H05K7/20 ,  B60R1/00 ,  H04N7/18 ,  H04N5/225

Abstract: A vehicular vision system includes a camera module having a housing that houses at least (i) electronic circuitry disposed at a main printed circuit board (PCB) and (ii) an imager assembly. The imager assembly includes an imager, an imager PCB and a lens barrel. Electronic circuitry is disposed at an upper side and at a lower side of the main PCB. The lower side of the main PCB faces a lower housing portion and the upper side of the main PCB faces an upper housing portion. A flexible cable electrically connects electronic circuitry disposed at the imager PCB with electronic circuitry disposed at the main PCB. An electronic component of electronic circuitry disposed at the main PCB is in thermal conductivity with a thermal element, which is in thermal conductivity with the lower housing portion to enhance heat transfer from the electronic component to the lower housing portion.

公开(公告)号：US10576908B2

公开(公告)日：2020-03-03

申请号：US16283920

申请日：2019-02-25

Applicant: MAGNA ELECTRONICS INC.

Inventor： Garret F. Achenbach ,  Brian A. Gorman ,  Brian F. Smith ,  Steven G. Gebauer

IPC: H04N9/47 ,  H04N7/18 ,  B60R11/04 ,  H05K7/20 ,  B60R1/00 ,  H04N5/225

Abstract: A camera module for a vehicular vision system includes a housing that houses at least (i) electronic circuitry disposed at a main printed circuit board (PCB) and (ii) an imager assembly. The imager assembly includes an imager and an imager PCB. Electronic circuitry is disposed at an upper side and at a lower side of the main PCB. The lower side of the main PCB faces a lower housing portion and the upper side of the main PCB faces an upper housing portion. The imager assembly includes a flexible cable that connects electronic circuitry disposed at the imager PCB with electronic circuitry disposed at the main PCB. An electronic component of electronic circuitry disposed at the main PCB is in thermal conductivity with a thermal element, which is in thermal conductivity with the lower housing portion. The thermal element includes a thermally conductive resilient material.

公开(公告)号：US11697382B2

公开(公告)日：2023-07-11

申请号：US17813050

申请日：2022-07-18

Applicant: MAGNA ELECTRONICS INC.

Inventor： Garret F. Achenbach ,  Brian A. Gorman ,  Brian F. Smith ,  Steven G. Gebauer

IPC: B60R11/04 ,  H05K7/20 ,  B60R1/00 ,  H04N7/18 ,  H04N23/57

CPC classification number: B60R11/04 ,  B60R1/00 ,  H04N7/181 ,  H04N23/57 ,  H05K7/2039

Abstract: A vehicular vision system includes a camera module having a housing that houses at least (i) electronic circuitry disposed at a main printed circuit board (PCB) and (ii) an imager assembly. The imager assembly includes an imaging array sensor, an imager PCB and a lens holder that includes an elongated lens barrel that houses at least one lens. Electronic circuitry is disposed at an upper side and at a lower side of the main PCB. Image data captured by the imaging array sensor is conveyed via a flexible cable to electronic circuitry disposed at the main PCB. An electronic component of electronic circuitry disposed at the main PCB is in thermal conductivity with a thermal element, which is in thermal conductivity with a lower housing portion of the housing to enhance heat transfer from the electronic component to the lower housing portion of the camera housing.

公开(公告)号：US09896039B2

公开(公告)日：2018-02-20

申请号：US14705076

申请日：2015-05-06

Applicant: MAGNA ELECTRONICS INC.

Inventor： Garret F. Achenbach ,  Brian A. Gorman ,  Brian F. Smith ,  Steven G. Gebauer

IPC: H04N9/47 ,  B60R11/04 ,  H05K7/20 ,  B60R1/00 ,  H04N7/18 ,  H04N5/225

CPC classification number: B60R11/04 ,  B60R1/00 ,  H04N5/2257 ,  H04N7/181 ,  H05K7/2039

Abstract: A vehicle vision system includes a camera module configured to attach at an in-cabin surface of a windshield of a vehicle equipped with the vision system. The camera module includes a housing and an imager assembly. The imager assembly includes a structure and an imager and a lens. The imager is disposed at an imager circuit board of the imager assembly. A thermal element is configured to attach at the structure of the imager assembly and includes a support element and a thermal pad disposed at least partially along the support element. With the thermal element attached at the structure of the imager assembly, a first portion of the thermal pad is engaged with the imager circuit board, and wherein, with the imager assembly disposed at the housing of the camera module, a second portion of the thermal pad is engaged with the housing.

公开(公告)号：US20160077200A1

公开(公告)日：2016-03-17

申请号：US14946856

申请日：2015-11-20

Applicant: MAGNA ELECTRONICS INC.

Inventor： Hasib Hassan ,  Dale R. Benton ,  John Lu ,  Brian A. Gorman

IPC: G01S11/02

CPC classification number: G01S11/02 ,  G01S11/06 ,  G01S11/08

Abstract: A method of estimating a distance between a mobile unit and a vehicle includes providing a time of flight subsystem including circuitry incorporated in the mobile unit and circuitry incorporated in the vehicle, and generating a time of flight distance signal by periodically transmitting a time of flight signal between the mobile unit and the vehicle and measuring the time taken for transmission of the time of flight signal therebetween. A travel sensor is disposed at the mobile unit and generates a travel sensor signal. A value of a distance estimate signal is initialized based on the time of flight distance signal. A movement of the mobile unit is determined based on variance in the travel sensor signal. The initialized value of the initialized distance estimate signal is changed or increased or decreased based upon determination of movement of the mobile unit.

Abstract translation: 估计移动单元和车辆之间的距离的方法包括提供飞行时间子系统，包括并入移动单元中的电路和并入车辆中的电路，并且通过周期性地发送飞行时间信号来产生飞行距离信号的时间 在移动单元和车辆之间并且测量其间的飞行时间信号的传输所花费的时间。 移动传感器设置在移动单元处并产生行驶传感器信号。 距离估计信号的值基于飞行距离信号的时间被初始化。 基于行驶传感器信号的变化确定移动单元的移动。 基于移动单元的移动的确定，初始化的距离估计信号的初始化值被改变或增加或减少。