公开(公告)号：US20180269164A1

公开(公告)日：2018-09-20

申请号：US15906098

申请日：2018-02-27

Applicant: MEDIATEK INC.

Inventor： Tzu-Hung LIN ,  Chia-Cheng CHANG ,  I-Hsuan PENG ,  Nai-Wei LIU

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/043 ,  H01L23/31 ,  H01L25/065

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a substrate having a first surface and a second surface opposite thereto. The substrate includes a wiring structure. The semiconductor package structure also includes a first semiconductor die disposed over the first surface of the substrate and electrically coupled to the wiring structure. The semiconductor package structure further includes a second semiconductor die disposed over the first surface of the substrate and electrically coupled to the wiring structure. The first semiconductor die and the second semiconductor die are separated by a molding material. In addition, the semiconductor package structure includes a first hole and a second hole formed on the second surface of the substrate.