公开(公告)号：US11839054B1

公开(公告)日：2023-12-05

申请号：US17482229

申请日：2021-09-22

Applicant: Meta Platforms Technologies, LLC

Inventor： Brian Toleno ,  Michael Nikkhoo ,  Patrick Codd

IPC: G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  H05K7/20 ,  H05K1/14 ,  H05K7/06 ,  H05K7/02 ,  H01L25/065

CPC classification number: H05K7/20336 ,  H01L25/0657 ,  H05K1/144 ,  H05K7/023 ,  H05K7/06

Abstract: A multi-board system for an electronic device that includes an heat spreader between at least two boards. In examples, the multi-board system may include a stack-PCB architecture on one side of the heat spreader and one or more boards on an opposite side of the heat spreader from the stack-PCB. The heat spreader may comprise a vapor chamber and/or include a graphite layer or core to transfer heat along a length of the heat spreader.