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公开(公告)号：US20240318924A1
公开(公告)日：2024-09-26
申请号：US18504928
申请日：2023-11-08
Applicant: Meta Platforms Technologies, LLC
Inventor： BRIAN TOLENO , Michael Nikkhoo , Kiarash Vakhshouri
CPC classification number: F28F1/04 , F28F21/006 , F28F21/04 , F28F21/067 , G02B27/0176 , F28F2260/02
Abstract: An elongated heat pipe is described. In examples, the heat pipe may include a body comprising a polygonal-shaped cross-section and a RF compatible material, e.g., a ceramic, a polymer, glass, etc. The heat pipe may further include a working fluid disposed within the body.
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公开(公告)号：US11991870B1
公开(公告)日：2024-05-21
申请号：US17814184
申请日：2022-07-21
Applicant: Meta Platforms Technologies, LLC
Inventor： Michael Nikkhoo , Brian Toleno
CPC classification number: H05K7/20945 , G06F1/163 , G06F1/206
Abstract: An electronic device includes an electronic component, a thermal ground, and a thermal interface material having a first side coupled to the electronic component and a second side coupled to the thermal ground, such that the thermal interface material draws thermal energy from the electronic component and transfers thermal energy to the thermal ground. The thermal interface material includes a body comprising thermally conductive silicone, the body disposed in thermal contact with the electrical component, and the thermally conductive silicone having a first thermal conductivity, and a plurality of thermally conductive fibers disposed within the body of the thermal interface material, the thermally conductive fibers having a second thermal conductivity greater than the first thermal conductivity.
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公开(公告)号：US20240121882A1
公开(公告)日：2024-04-11
申请号：US18378010
申请日：2023-10-09
Applicant: Meta Platforms Technologies, LLC
Inventor： Brian Toleno , Michael Nikkhoo , Arman Boromand , Sheng Ye , Andrew John Ouderkirk , Jonathan Robert Peterson
CPC classification number: H05K1/0209 , H05K1/113 , H05K1/145 , H05K3/368 , H05K2201/10378
Abstract: A thermoplastic interposer formed of ordered polymer sheets that may be configured to act as an interconnect and as a thermal energy spreader. In examples, the thermoplastic interposer may include one or more extensions or wings to further dissipate heat. In examples, laser direct structuring (LDS) may be used to form or more through silicon vias (TSVs) or through-chip vias. In examples, the ordered polymer sheets may be extruded via a roll-to-roll process, stacked, and processed to form a laminate interposer structure that makes up the interposer. In examples, the thermoplastic interposer may be used in multi-layer structures interconnecting two or more board assemblies such as printed circuit boards (PCB)s.
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公开(公告)号：US12032171B1
公开(公告)日：2024-07-09
申请号：US17745633
申请日：2022-05-16
Applicant: Meta Platforms Technologies, LLC
Inventor： Michael Nikkhoo , Hunter Cantrell , Brian Toleno , Shobhit Verma , Igor Markovsky
CPC classification number: G02B27/0176 , G06F1/163 , G06F1/1681 , G06F1/203 , H05K7/20436
Abstract: A method and system to conduct thermal energy between two hinged portions of an electric device. In examples, the method employs a thermal hinge system configured to transfer or spread thermal energy, and optionally electrical energy, through a mechanical articulation or hinge in an electronic device. A thermal hinge may include a thermally conductive living hinge, complementary and/or mating thermal interface components, or a combination of both.
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公开(公告)号：US20230354566A1
公开(公告)日：2023-11-02
申请号：US18167052
申请日：2023-02-09
Applicant: Meta Platforms Technologies, LLC
Inventor： Arman Boromand , Giti Karimi Moghaddam , Ryan Fleming , Michael Nikkhoo , Alex Ockfen , Sheng Ye , Andrew John Ouderkirk , Hongtao Guo
CPC classification number: H05K7/20963 , B32B7/12 , B32B27/32 , B32B27/08 , B32B7/035 , B32B2551/00 , B32B2250/242 , B32B2307/414 , B32B2307/302 , B32B2307/54 , B32B2307/732 , B32B2307/204 , B32B2307/206 , B32B2307/516 , B32B2307/518
Abstract: A polymer laminate includes a plurality of ultra-high molecular weight polyethylene thin films, where each polyethylene thin film has an in-plane thermal conductivity of at least approximately 5 W/mK and an in-plane elastic modulus of at least approximately 20 GPa. The polymer laminate may be incorporated into an eyewear device and may be configured to disperse heat during operation thereof in a manner effective to improve the functionality and/or wearability of the device.
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Patent Agency Ranking
公开(公告)号：US20230309265A1
公开(公告)日：2023-09-28
申请号：US17701577
申请日：2022-03-22
Applicant: Meta Platforms Technologies, LLC
Inventor： Michael Nikkhoo , Brian Toleno
IPC: H05K7/20
CPC classification number: H05K7/20336
Abstract: A thermal system configured to mechanically bend and provide a thermal conduit to transfer heat through an electronic device, and an electronic device having a bent or curved profile or a mechanical articulation or coupler between a first location and a second location, and equipped with a thermal system configured to extend through or along the bent or curved profile or mechanical articulation or coupler of the electronic device and transfer heat from the first location of the electronic device to the second location of the electronic device
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公开(公告)号：US20230200019A1
公开(公告)日：2023-06-22
申请号：US17556719
申请日：2021-12-20
Applicant: Meta Platforms Technologies, LLC
Inventor： Michael Nikkhoo , Brian Toleno
CPC classification number: H05K7/20436 , G06F1/163 , G06F1/206
Abstract: A flexible thermal conduit includes a first material extending along an axial length of the thermal conduit, the first material having a first thermal conductivity, a second material encasing at least a portion of the first material, the second material having a second thermal conductivity that is less than the first thermal conductivity, and a thermally conductive silicone molded over at least a portion of the first material and the second material such that the thermally conductive silicone forms the first end and the second end of the thermal conduit. The thermal conduit may be used in electronic device, such as a wearable device, to transmit heat from a heat source (e.g., a processor) to a thermal ground (e.g., a housing).
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公开(公告)号：US20240361085A1
公开(公告)日：2024-10-31
申请号：US18388801
申请日：2023-11-10
Applicant: Meta Platforms Technologies, LLC
Inventor： Brian Toleno , Michael Nikkhoo , Kiarash Vakhshouri , Ustun Duman , Arman Boromand
CPC classification number: F28D15/04 , F28F21/006
Abstract: An elongated heat pipe or vapor chamber is described. In examples, the heat pipe may include a tubular body comprising a hollow glass tube or fiber. The heat pipe may further include a wick within the tubular body and a working fluid within the tubular body. The wick may be made of glass, polymer, metal, etc. The wick may be an elongated cylinder disposed within the tubular body and, some cases, may be bonded to an inner floor of the tubular body. In examples, the wick may have an outer diameter substantially equal to an inner diameter of the tubular body. In examples, the wick may have a substantially cross-shaped cross section or may have a helical shape.
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公开(公告)号：US12108576B1
公开(公告)日：2024-10-01
申请号：US17853512
申请日：2022-06-29
Applicant: Meta Platforms Technologies, LLC
Inventor： Michael Nikkhoo , Brian Toleno
CPC classification number: H05K7/20445 , G04C3/008 , H05K7/205 , G06F1/203 , H05K1/0204
Abstract: A wearable device includes a housing having a cavity and a thermal interposer disposed within the cavity of the housing and thermally coupled to the housing to draw thermal energy from one or more electrical components of the wearable device and to transfer the thermal energy to the housing.
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公开(公告)号：US20240098877A1
公开(公告)日：2024-03-21
申请号：US17848092
申请日：2022-06-23
Applicant: Meta Platforms Technologies, LLC
Inventor： Michael Nikkhoo , Brian Toleno , Patrick Codd
CPC classification number: H05K1/0207 , H05K7/20309 , H05K7/20336
Abstract: An interposer equipped with a heat spreader and a multi-board system for an electronic device that includes an interposer equipped with a heat spreader between at least two boards. In examples, the interposer may include a heat spreader having an active portion and, optionally, a passive portion. In examples, the active portion may include a vapor chamber, heat pipe, or isothermal plate. In examples, the passive portion may thermally couple the active portion to a heat dissipation device such as a heat sink and/or an outer frame of the electronic device.
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