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公开(公告)号：US20150327398A1
公开(公告)日：2015-11-12
申请号：US14705076
申请日：2015-05-06
Applicant: MAGNA ELECTRONICS INC.
Inventor： Garret F. Achenbach , Brian A. Gorman , Brian F. Smith , Steven G. Gebauer
CPC classification number: B60R11/04 , B60R1/00 , H04N5/2257 , H04N7/181 , H05K7/2039
Abstract: A vehicle vision system includes a camera module configured to attach at an in-cabin surface of a windshield of a vehicle equipped with the vision system. The camera module includes a housing and an imager assembly. The imager assembly includes a structure and an imager and a lens. The imager is disposed at an imager circuit board of the imager assembly. A thermal element is configured to attach at the structure of the imager assembly and includes a support element and a thermal pad disposed at least partially along the support element. With the thermal element attached at the structure of the imager assembly, a first portion of the thermal pad is engaged with the imager circuit board, and wherein, with the imager assembly disposed at the housing of the camera module, a second portion of the thermal pad is engaged with the housing.
Abstract translation: 车辆视觉系统包括相机模块，该相机模块被配置为附接在装备有视觉系统的车辆的挡风玻璃的舱内表面。 相机模块包括壳体和成像器组件。 成像器组件包括结构和成像器和透镜。 成像器被放置在成像器组件的成像器电路板上。 热元件构造成附接在成像器组件的结构处，并且包括支撑元件和至少部分地沿支撑元件设置的热垫。 当热元件附接在成像器组件的结构处时，散热垫的第一部分与成像器电路板接合，并且其中，在成像器组件设置在相机模块的壳体处，第二部分热 垫与壳体接合。
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公开(公告)号：US20230339412A1
公开(公告)日：2023-10-26
申请号：US18347756
申请日：2023-07-06
Applicant: MAGNA ELECTRONICS INC.
Inventor： Garret F. Achenbach , Brian A. Gorman , Brian F. Smith , Steven G. Gebauer
CPC classification number: B60R11/04 , B60R1/00 , H04N7/181 , H04N23/57 , H05K7/2039
Abstract: A vehicular vision system includes a camera module having a housing that houses at least (i) electronic circuitry disposed at a main printed circuit board (PCB) and (ii) an imager assembly. The imager assembly includes an imaging array sensor, an imager PCB and a lens holder that includes an elongated lens barrel that houses at least one lens. Electronic circuitry is disposed at an upper side and at a lower side of the main PCB. Image data captured by the imaging array sensor is conveyed to electronic circuitry disposed at the main PCB. An electronic component of electronic circuitry disposed at the main PCB is in thermal conductivity with a thermal element, which is in thermal conductivity with a lower housing portion of the housing to enhance heat transfer from the electronic component to the lower housing portion of the camera housing.
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公开(公告)号：US20210188191A1
公开(公告)日：2021-06-24
申请号：US17249703
申请日：2021-03-10
Applicant: MAGNA ELECTRONICS INC.
Inventor： Garret F. Achenbach , Brian A. Gorman , Brian F. Smith , Steven G. Gebauer
Abstract: A vehicular vision system includes a camera module having a housing that houses at least (i) electronic circuitry disposed at a main printed circuit board (PCB) and (ii) an imager assembly. The imager assembly includes an imager, an imager PCB and a lens holder that includes an elongated lens barrel that houses at least one lens. Electronic circuitry is disposed at an upper side and at a lower side of the main PCB and includes an image processing chip. Image data captured by the imager is conveyed via a flexible cable to electronic circuitry disposed at the main PCB. An electronic component of electronic circuitry disposed at the main PCB is in thermal conductivity with a thermal element, which is in thermal conductivity with a lower housing portion of the housing to enhance heat transfer from the electronic component to the lower housing portion.
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公开(公告)号：US10214157B2
公开(公告)日：2019-02-26
申请号：US15899131
申请日：2018-02-19
Applicant: MAGNA ELECTRONICS INC.
Inventor： Garret F. Achenbach , Brian A. Gorman , Brian F. Smith , Steven G. Gebauer
Abstract: A camera module for a vehicular vision system includes a housing that houses at least (i) an imager assembly and (ii) electronic circuitry disposed at at least two printed circuit boards (PCBs). One of the electronic components of the electronic circuitry disposed at a first PCB includes an imager. A second PCB has electronic components of the electronic circuitry disposed at an upper side and at a lower side of the second PCB. The lower side of the second PCB opposes a lower housing portion and the upper side of the second PCB opposes an upper housing portion. The imager assembly includes a flexible cable that connects electronic components disposed at the first PCB with electronic components disposed at the second PCB. An electronic component is in thermal conductivity with a thermal element, which is in thermal conductivity with the housing.
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