Photographic films
    12.
    发明授权
    Photographic films 失效
    摄影胶片

    公开(公告)号:US4069053A

    公开(公告)日:1978-01-17

    申请号:US783443

    申请日:1977-03-31

    IPC分类号: G03C1/85 G03C1/95 G03C1/02

    摘要: A photographic film comprising a plastic support having first and second layers therein in that order, the first layer comprising a cellulose acetate together with a matting agent composed mainly of silicon dioxide of less than 1 .mu. in particle size, the second layer comprising a phosphoric acid ester, or an amine salt thereof of a C.sub.8 to C.sub.22 -higher alkyl alcohol. A light-sensitive emulsion layer is carried on the other side of the support.

    摘要翻译: 一种照相胶片,包括其中依次具有第一和第二层的塑料支撑体,所述第一层包含纤维素乙酸酯以及主要由小于1μm的粒径的二氧化硅组成的消光剂,所述第二层包含磷酸 酯或其C 8至C 22 - 高级烷基醇的胺盐。 感光乳剂层在载体的另一侧承载。

    Semiconductor Sensor
    13.
    发明授权
    Semiconductor Sensor 失效
    半导体传感器

    公开(公告)号:US07640807B2

    公开(公告)日:2010-01-05

    申请号:US11572384

    申请日:2005-07-07

    IPC分类号: G01P15/08

    摘要: A semiconductor sensor of the present invention is capable of preventing a diaphragm portion of the sensor from being damaged if a weight collides against a semiconductor integrated circuit substrate of the sensor and is further capable of preventing the diaphragm portion from being bent significantly even when a semiconductor sensor element of the sensor is disposed inside a distorted or deformed casing. A rear surface of the semiconductor integrated circuit substrate 7 is joined onto a wall surface of the casing 9 that defines a receiving chamber of the casing. A support portion of the semiconductor sensor element is joined onto a front surface 7a of the semiconductor integrated circuit substrate 7. A shock absorbing layer is formed on the front surface 7a of the semiconductor integrated circuit substrate 7 at least on a part thereof facing the weight 3 of the semiconductor sensor element 7, for suppressing the bouncing of the weight 3 when the weight 3 collides against the semiconductor integrated circuit substrate 7.

    摘要翻译: 如果本发明的半导体传感器如果重量与传感器的半导体集成电路基板碰撞而能够防止传感器的隔膜部分损坏,并且即使当半导体 传感器的传感器元件设置在变形或变形的壳体内。 半导体集成电路基板7的背面接合在壳体9的限定壳体的容纳室的壁面上。 半导体传感器元件的支撑部分接合到半导体集成电路基板7的前表面7a上。在半导体集成电路基板7的前表面7a上至少形成有面向重量的冲击吸收层 3,用于当重量3与半导体集成电路基板7碰撞时抑制重量3的弹跳。