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公开(公告)号：US20180340855A1
公开(公告)日：2018-11-29
申请号：US15604194
申请日：2017-05-24
CPC分类号： G01L19/141 , B29C45/14336 , B29K2705/00 , B29L2031/36 , G01L5/0004 , G01L5/0038 , G01L9/0052 , G01L19/0069 , G01L19/0627
摘要： A force sensor may comprise a universal housing for holding a sense die. Typically, the universal housing may comprise a top wall, a bottom wall, two side walls, and a back wall. The housing may comprise an aperture located on the top wall to allow for interaction of an actuation element with an external force and the surface of the sense die. Additionally, the universal housing may comprise a cavity/opening to allow for the insertion of the sense die. Generally, the bottom wall of the housing may comprise one or more electrical connections for alignment with the bond pads on the sense die. The electrical connections may comprise electrical traces formed by laser selective plating and/or insert molded studs. Typically, the electrical connections may be formed after the universal housing is formed by injection molding to allow for customization based on a Customer's specific application.
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公开(公告)号：US20180105417A1
公开(公告)日：2018-04-19
申请号：US15782758
申请日：2017-10-12
发明人： Michael J. SEDDON
CPC分类号： B81B7/008 , B81B3/0021 , B81B2201/0264 , B81B2203/0127 , B81B2207/012 , B81B2207/07 , B81B2207/096 , B81C1/00246 , G01L9/0048 , G01L9/0052 , G01L9/0054 , G01L9/0055 , G01L9/06 , G01L13/025 , G01L19/0069
摘要： Implementations of absolute pressure sensor devices may include a microelectromechanical system (MEMS) absolute pressure sensor coupled over a controller die. The MEMS absolute pressure sensor may be mechanically coupled to the controller die and may also be configured to electrically couple with the controller die. A perimeter of the controller die may be one of the same size and larger than a perimeter of the MEMS absolute pressure sensor. The controller die may be configured to electrically couple with a module through an electrical connector.
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公开(公告)号：US20170313578A1
公开(公告)日：2017-11-02
申请号：US15647107
申请日：2017-07-11
申请人： mCube, Inc.
发明人： Chien Chen LEE , Tzu Feng CHANG
CPC分类号： B81B7/0074 , B81B3/0035 , B81B3/0062 , B81B3/0072 , B81B7/0032 , B81B7/0045 , B81B7/0048 , B81B7/0051 , B81B7/0054 , B81B7/0077 , B81B2201/0235 , B81B2201/0242 , B81B2201/025 , B81B2201/0264 , B81B2207/012 , B81C1/00134 , B81C1/00158 , B81C1/0023 , B81C1/00261 , B81C1/00269 , B81C2203/0792 , G01C19/5719 , G01C19/5783 , G01L1/00 , G01L9/0042 , G01L19/0069 , G01L19/147 , G01P15/0802 , G01R33/02 , H04R2201/003
摘要： A method and structure for a PLCSP (Package Level Chip Scale Package) MEMS package. The method includes providing a MEMS chip having a CMOS substrate and a MEMS cap housing at least a MEMS device disposed upon the CMOS substrate. The MEMS chip is flipped and oriented on a packaging substrate such that the MEMS cap is disposed above a thinner region of the packaging substrate and the CMOS substrate is bonding to the packaging substrate at a thicker region, wherein bonding regions on each of the substrates are coupled. The device is sawed to form a package-level chip scale MEMS package.
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公开(公告)号：US09726565B2
公开(公告)日：2017-08-08
申请号：US14388713
申请日：2013-03-20
申请人： Robert Bosch GmbH
发明人： Michael Schlitzkus , Stefan Lehenberger , Dmitriy Aranovich , Robert Hengler , Christian Pfleger , Philip Martin Lenk , Peter Diesel
CPC分类号： G01L19/148 , G01D11/245 , G01L19/0069 , G01L19/0084 , G01L19/147 , H05K1/02 , H05K5/0091 , H05K2201/10151
摘要： A support unit for a circuit board in a sensor unit comprises a main body that defines an outer contour and includes a first joining geometry and a second joining geometry. The first joining geometry is configured to at least one of guide and electrically contact external contact elements, and includes contact receiving pockets configured to guide the external contact elements, and at least one reinforcement web that separates two adjacent contact receiving pockets. The second joining geometry is configured to join the support unit to the circuit board. The first joining geometry defines at least in part an external interface via which at least one electrical output signal of the circuit board is tapped.
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公开(公告)号：US09638600B2
公开(公告)日：2017-05-02
申请号：US14501934
申请日：2014-09-30
申请人： Rosemount Inc.
CPC分类号： G01L19/0084 , G01L9/0041 , G01L9/0075 , G01L13/00 , G01L19/0069 , G01L19/0092 , H01L2224/48091 , H01L2924/00014
摘要： A process fluid pressure sensor assembly includes a pressure sensor configured to sense a pressure of a process fluid. The assembly includes a pressure sensor body formed of an insulating material. The pressure sensor includes a plurality of electrical contact pads which couple to a pressure sensing element of the body of the pressure sensor. An interconnect body is configured to fit over an end of the pressure sensor body. A plurality of electrical connectors carried in the interconnect body are in electrical contact with the plurality of electrical contact pads. A wiring harness attaches to the interconnect body and includes a plurality of wires which are electrically connected to the plurality of electrical connectors.
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公开(公告)号：US09638596B2
公开(公告)日：2017-05-02
申请号：US14248324
申请日：2014-04-08
申请人： Wai Yew Lo
发明人： Wai Yew Lo
IPC分类号： G01L9/00 , H01L23/495 , H01L25/04 , G01L19/00 , G01L19/06
CPC分类号： G01L9/0052 , B81B2201/0228 , B81B2201/0264 , G01L19/0069 , G01L19/06 , H01L23/49503 , H01L23/4951 , H01L23/49513 , H01L25/041 , H01L2224/16245 , H01L2224/48091 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： A cavity-down pressure sensor device has a pressure-sensing die that is electrically connected to a master control unit (MCU) using face-to-face bonding. Connecting the pressure-sensing die in this manner avoids the need to wire bond the pressure-sensing die to the master control unit.
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公开(公告)号：US09631997B2
公开(公告)日：2017-04-25
申请号：US13893970
申请日：2013-05-14
发明人： Klaus Elian
CPC分类号： G01L19/0069 , G01L19/147 , G01L19/148
摘要： An apparatus for measuring a pressure includes a semiconductor die and a circuit board. The semiconductor die includes a micro-mechanical element generating a measurement signal indicating information on an external pressure applied to the micro-mechanical element. The semiconductor die further includes an output interface providing the measurement signal. The circuit board includes at least one electrically-conductive line and an opening. The semiconductor die is attached to the circuit board, so that the micro-mechanical element faces the whole of the circuit board and the at least on electrically-conductive line is connected to the output interface.
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公开(公告)号：US09568388B2
公开(公告)日：2017-02-14
申请号：US14451926
申请日：2014-08-05
申请人： Cory Z. Bousquet , June Park
发明人： Cory Z. Bousquet , June Park
CPC分类号： G01L19/0061 , G01L19/0069 , G01L19/147 , G01L19/148 , G01R1/06716 , H01R13/2421
摘要： A small form factor Microfused Silicon Strain gage (MSG) sensor incorporates an offset spring and feed-in features. A pressure sensor includes a spring having first and second coiled sections offset by a coiled center section in a middle that is used to make offset contact between two electrical contact pads.
摘要翻译： 一个小尺寸的Microfused硅应变计（MSG）传感器包含一个偏置弹簧和馈入功能。 压力传感器包括弹簧，弹簧具有第一和第二螺旋部分，其中间部分被卷绕的中心部分偏移，该中心部分用于在两个电接触焊盘之间进行偏移接触。
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公开(公告)号：US20170030791A1
公开(公告)日：2017-02-02
申请号：US15215712
申请日：2016-07-21
申请人： KISTLER HOLDING AG
发明人： REINHOLD BUCK , MARTIN GIGER
IPC分类号： G01L23/10
CPC分类号： G01L23/10 , B23K1/0016 , B23K20/02 , B23K20/023 , G01L9/008 , G01L19/0069 , G01L19/04 , G01L19/148 , G01M15/08
摘要： A piezoelectric pressure sensor includes a membrane for detecting a pressure profile, a piezoelectric sensor on which polarization charges are produced by the detected pressure profile, an electrode arrangement receiving and transmitting the generated polarization charges as signals via a charge output. The sensor further includes an electrical connecting element and an electrical signal conductor. The electrical connecting element is electrically and mechanically connected to the electrical signal conductor. The charge output is connected to the electrical connecting element in certain areas and transmits signals through the electrical connecting element into the electrical signal conductor.
摘要翻译： 一种压电压力传感器，包括用于检测压力分布的膜，压电传感器，通过检测到的压力分布产生极化电荷;电极装置，经由电荷输出接收并传输产生的极化电荷作为信号。 传感器还包括电连接元件和电信号导体。 电连接元件电连接和机械连接到电信号导体。 电荷输出在某些区域连接到电连接元件，并通过电连接元件将信号传输到电信号导体中。
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公开(公告)号：US20170030786A1
公开(公告)日：2017-02-02
申请号：US15221812
申请日：2016-07-28
申请人： KISTLER HOLDING AG
发明人： REINHOLD BUCK , MARTIN GIGER , PHILIP GRAF
CPC分类号： G01L23/10 , B23K1/0016 , B23K20/02 , B23K20/023 , G01L9/008 , G01L19/0069 , G01L19/04 , G01L19/148 , G01M15/08
摘要： A pressure sensor includes a sensor assembly and an evaluation unit. The sensor assembly includes a sensor and an electrode arrangement. The sensor generates signals under the action of a pressure profile, and the electrode arrangement transmits the signals to the evaluation unit. The evaluation unit includes an electric circuit board that is connected to the electrode arrangement by material bonding.
摘要翻译： 压力传感器包括传感器组件和评估单元。 传感器组件包括传感器和电极装置。 传感器在压力分布的作用下产生信号，电极装置将信号发送到评估单元。 评估单元包括通过材料接合连接到电极装置的电路板。
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