公开(公告)号：US10073085B2

公开(公告)日：2018-09-11

申请号：US14008348

申请日：2012-03-29

申请人： Mitsuru Akashi ,  Michiya Matsusaki ,  Takeshi Sakura ,  Koji Hashimoto ,  Yuji Shirakata ,  Satoshi Hirakawa

发明人： Mitsuru Akashi ,  Michiya Matsusaki ,  Takeshi Sakura ,  Koji Hashimoto ,  Yuji Shirakata ,  Satoshi Hirakawa

IPC分类号： G01N33/50 ,  C12N5/071

CPC分类号： G01N33/5088 ,  C12N5/0698 ,  C12N2502/094 ,  C12N2502/1192 ,  C12N2502/1323 ,  C12N2502/28 ,  C12N2503/06 ,  C12N2533/52 ,  C12N2533/54

摘要： Provided is a novel method capable of producing an artificial skin model. A method for producing an artificial skin model includes: providing coated cells (1), each of which is obtained by covering the surface of a cell (3) with a coating film (2) containing an extracellular matrix component; forming a dermis tissue layer (7), in which the coated cells (1) are laminated, by culturing the coated cells (1); and forming an epidermis layer (12) by arranging epidermis cells (8) on the dermis tissue layer (7).

公开(公告)号：US20140024010A1

公开(公告)日：2014-01-23

申请号：US14008348

申请日：2012-03-29

申请人： Mitsuru Akashi ,  Michiya Matsusaki ,  Takeshi Sakura ,  Koji Hashimoto ,  Yuji Shirakata ,  Satoshi Hirakawa

发明人： Mitsuru Akashi ,  Michiya Matsusaki ,  Takeshi Sakura ,  Koji Hashimoto ,  Yuji Shirakata ,  Satoshi Hirakawa

IPC分类号： G01N33/50

CPC分类号： G01N33/5088 ,  C12N5/0698 ,  C12N2502/094 ,  C12N2502/1192 ,  C12N2502/1323 ,  C12N2502/28 ,  C12N2503/06 ,  C12N2533/52 ,  C12N2533/54

摘要： Provided is a novel method capable of producing an artificial skin model. A method for producing an artificial skin model includes: providing coated cells (1), each of which is obtained by covering the surface of a cell (3) with a coating film (2) containing an extracellular matrix component; forming a dermis tissue layer (7), in which the coated cells (1) are laminated, by culturing the coated cells (1); and forming an epidermis layer (12) by arranging epidermis cells (8) on the dermis tissue layer (7).

摘要翻译： 提供了一种能够生产人造皮肤模型的新方法。 一种生产人造皮肤模型的方法包括：提供涂覆细胞（1），每个涂覆细胞通过用包含细胞外基质组分的涂膜（2）覆盖细胞（3）的表面而获得; 通过培养所述被覆细胞（1），形成层叠所述被覆细胞（1）的真皮组织层（7）。 以及通过在真皮组织层（7）上布置表皮细胞（8）形成表皮层（12）。

公开(公告)号：US20090039504A1

公开(公告)日：2009-02-12

申请号：US12173495

申请日：2008-07-15

申请人： Toru Kimura ,  Yuji Shirakata

发明人： Toru Kimura ,  Yuji Shirakata

IPC分类号： H01L23/36

CPC分类号： H05K7/2049 ,  H01L23/16 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00

摘要： The present invention is intended to obtain a semiconductor device that is reduced in size, weight, and cost and improved in performance stability and productivity.The semiconductor device includes a semiconductor module in which a semiconductor element is sealed with a resin, a reinforcing beam fixed to an upper surface of the semiconductor module via a plate-like spring, and a frame part to which both ends of the reinforcing beam are fixed, the frame part being disposed in such a fashion as to enclose from four directions an outer periphery of the semiconductor module, plate-like spring, and the reinforcing beam.

摘要翻译： 本发明旨在获得尺寸，重量和成本降低且性能稳定性和生产率提高的半导体器件。 半导体器件包括半导体元件，其中半导体元件被树脂密封，经由板状弹簧固定到半导体模块的上表面的加强梁和加强梁的两端的框架部分 固定，框架部分以从四个方向包围半导体模块，板状弹簧和加强梁的外周的方式设置。

公开(公告)号：US07880299B2

公开(公告)日：2011-02-01

申请号：US12173495

申请日：2008-07-15

申请人： Toru Kimura ,  Yuji Shirakata

发明人： Toru Kimura ,  Yuji Shirakata

IPC分类号： H01L23/34

CPC分类号： H05K7/2049 ,  H01L23/16 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00

摘要： The present invention is intended to obtain a semiconductor device that is reduced in size, weight, and cost and improved in performance stability and productivity.The semiconductor device includes a semiconductor module in which a semiconductor element is sealed with a resin, a reinforcing beam fixed to an upper surface of the semiconductor module via a plate-like spring, and a frame part to which both ends of the reinforcing beam are fixed, the frame part being disposed in such a fashion as to enclose from four directions an outer periphery of the semiconductor module, plate-like spring, and the reinforcing beam.

摘要翻译： 本发明旨在获得尺寸，重量和成本降低且性能稳定性和生产率提高的半导体器件。 半导体器件包括半导体元件，其中半导体元件被树脂密封，经由板状弹簧固定到半导体模块的上表面的加强梁和加强梁的两端的框架部分 固定，框架部分以从四个方向包围半导体模块，板状弹簧和加强梁的外周的方式设置。