公开(公告)号：US20240098877A1

公开(公告)日：2024-03-21

申请号：US17848092

申请日：2022-06-23

Applicant: Meta Platforms Technologies, LLC

Inventor： Michael Nikkhoo ,  Brian Toleno ,  Patrick Codd

IPC: H05K1/02 ,  H05K7/20

CPC classification number: H05K1/0207 ,  H05K7/20309 ,  H05K7/20336

Abstract: An interposer equipped with a heat spreader and a multi-board system for an electronic device that includes an interposer equipped with a heat spreader between at least two boards. In examples, the interposer may include a heat spreader having an active portion and, optionally, a passive portion. In examples, the active portion may include a vapor chamber, heat pipe, or isothermal plate. In examples, the passive portion may thermally couple the active portion to a heat dissipation device such as a heat sink and/or an outer frame of the electronic device.

公开(公告)号：US20240077259A1

公开(公告)日：2024-03-07

申请号：US18233224

申请日：2023-08-11

Applicant: Meta Platforms Technologies, LLC

Inventor： Kiarash Vakhshouri ,  Ustun Duman ,  Michael Nikkhoo

IPC: F28D15/02 ,  F28F19/04

CPC classification number: F28D15/02 ,  F28F19/04 ,  F28F2245/02 ,  F28F2245/04

Abstract: A heat pipe comprises a first substrate and an evaporator portion comprising a plurality of raised features on a surface of the first substrate. The heat pipe also comprises a condenser portion including a coating of an organic compound on the surface of the first substrate, wherein the coating of the organic compound on the surface of the first substrate in the condenser portion has a carbon content in a range of 1% to 15%. The heat pipe further comprises a second substrate bonded to the first substrate and a working fluid between the first substrate and the second substrate.

公开(公告)号：US11839054B1

公开(公告)日：2023-12-05

申请号：US17482229

申请日：2021-09-22

Applicant: Meta Platforms Technologies, LLC

Inventor： Brian Toleno ,  Michael Nikkhoo ,  Patrick Codd

IPC: G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  H05K7/20 ,  H05K1/14 ,  H05K7/06 ,  H05K7/02 ,  H01L25/065

CPC classification number: H05K7/20336 ,  H01L25/0657 ,  H05K1/144 ,  H05K7/023 ,  H05K7/06

Abstract: A multi-board system for an electronic device that includes an heat spreader between at least two boards. In examples, the multi-board system may include a stack-PCB architecture on one side of the heat spreader and one or more boards on an opposite side of the heat spreader from the stack-PCB. The heat spreader may comprise a vapor chamber and/or include a graphite layer or core to transfer heat along a length of the heat spreader.