公开(公告)号：US20110165772A1

公开(公告)日：2011-07-07

申请号：US13047377

申请日：2011-03-14

申请人： Michael Wayne Quillen ,  Loady Palmer Holbrook ,  Stephanie Ann Roane ,  Dale Edward O'Dell ,  John Cleaon Moore

发明人： Michael Wayne Quillen ,  Loady Palmer Holbrook ,  Stephanie Ann Roane ,  Dale Edward O'Dell ,  John Cleaon Moore

IPC分类号： H01L21/28 ,  H01L21/31

CPC分类号： G03F7/0048

摘要： Compositions and methods useful for the coating of polymeric materials onto substrates, for example, electronic device substrates such as semiconductor wafers, are provided. These compositions and methods are particularly suitable manipulating thickness of a polymeric coating in a single coating event. Such methods to control photoresist thickness are used to facilitate the layering of electronic circuitry in a three-dimensional fashion. Furthermore, the compositions of the present invention may be effectively used to deposit thick films of polymeric material in a uniform manner onto inorganic substrates which provides a significant benefit over conventional systems.

摘要翻译： 提供了可用于将聚合物材料涂覆到基底上的组合物和方法，例如电子器件基底如半导体晶片。 这些组合物和方法特别适合于在单一涂层事件中操纵聚合物涂层的厚度。 用于控制光致抗蚀剂厚度的这种方法用于促进以三维方式分层电子电路。 此外，本发明的组合物可以有效地用于以均匀的方式将聚合物材料的厚膜沉积到无机基底上，这提供了比传统系统显着的益处。

公开(公告)号：US20100151118A1

公开(公告)日：2010-06-17

申请号：US12336593

申请日：2008-12-17

申请人： Michael Wayne Quillen ,  Loady Palmer Holbrook, JR. ,  Stephanie Ann Roane ,  Dale Edward O'Dell ,  John Cleaon Moore

发明人： Michael Wayne Quillen ,  Loady Palmer Holbrook, JR. ,  Stephanie Ann Roane ,  Dale Edward O'Dell ,  John Cleaon Moore

IPC分类号： B05D5/12 ,  C09K3/00 ,  C08K5/101 ,  C08K5/07

CPC分类号： G03F7/0048

摘要： Compositions and methods useful for the coating of polymeric materials onto substrates, for example, electronic device substrates such as semiconductor wafers, are provided. These compositions and methods are particularly suitable manipulating thickness of a polymeric coating in a single coating event. Such methods to control photoresist thickness are used to facilitate the layering of electronic circuitry in a three-dimensional fashion. Furthermore, the compositions of the present invention may be effectively used to deposit thick films of polymeric material in a uniform manner onto inorganic substrates which provides a significant benefit over conventional systems.

摘要翻译： 提供了可用于将聚合物材料涂覆到基底上的组合物和方法，例如电子器件基底如半导体晶片。 这些组合物和方法特别适合于在单一涂层事件中操纵聚合物涂层的厚度。 用于控制光致抗蚀剂厚度的这种方法用于促进以三维方式分层电子电路。 此外，本发明的组合物可以有效地用于以均匀的方式将聚合物材料的厚膜沉积到无机基底上，这提供了比传统系统显着的益处。