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12 条记录 (耗时 0.034 秒)

    CARRIER SOLVENT COMPOSITIONS, COATINGS COMPOSITIONS, AND METHODS TO PRODUCE THICK POLYMER COATINGS
    1.
    发明申请
    CARRIER SOLVENT COMPOSITIONS, COATINGS COMPOSITIONS, AND METHODS TO PRODUCE THICK POLYMER COATINGS 审中-公开
    载体溶剂组合物，涂料组合物和生产厚聚合物涂料的方法

    公开(公告)号：US20100151118A1

    公开(公告)日：2010-06-17

    申请号：US12336593

    申请日：2008-12-17

    申请人： Michael Wayne Quillen ,  Loady Palmer Holbrook, JR. ,  Stephanie Ann Roane ,  Dale Edward O'Dell ,  John Cleaon Moore

    发明人： Michael Wayne Quillen ,  Loady Palmer Holbrook, JR. ,  Stephanie Ann Roane ,  Dale Edward O'Dell ,  John Cleaon Moore

    IPC分类号： B05D5/12 ,  C09K3/00 ,  C08K5/101 ,  C08K5/07

    CPC分类号： G03F7/0048

    摘要： Compositions and methods useful for the coating of polymeric materials onto substrates, for example, electronic device substrates such as semiconductor wafers, are provided. These compositions and methods are particularly suitable manipulating thickness of a polymeric coating in a single coating event. Such methods to control photoresist thickness are used to facilitate the layering of electronic circuitry in a three-dimensional fashion. Furthermore, the compositions of the present invention may be effectively used to deposit thick films of polymeric material in a uniform manner onto inorganic substrates which provides a significant benefit over conventional systems.

    摘要翻译： 提供了可用于将聚合物材料涂覆到基底上的组合物和方法，例如电子器件基底如半导体晶片。 这些组合物和方法特别适合于在单一涂层事件中操纵聚合物涂层的厚度。 用于控制光致抗蚀剂厚度的这种方法用于促进以三维方式分层电子电路。 此外，本发明的组合物可以有效地用于以均匀的方式将聚合物材料的厚膜沉积到无机基底上，这提供了比传统系统显着的益处。

    CARRIER SOLVENT COMPOSITIONS, COATINGS COMPOSITIONS, AND METHODS TO PRODUCE THICK POLYMER COATINGS
    2.
    发明申请
    CARRIER SOLVENT COMPOSITIONS, COATINGS COMPOSITIONS, AND METHODS TO PRODUCE THICK POLYMER COATINGS 审中-公开
    载体溶剂组合物，涂料组合物和生产厚聚合物涂料的方法

    公开(公告)号：US20110165772A1

    公开(公告)日：2011-07-07

    申请号：US13047377

    申请日：2011-03-14

    申请人： Michael Wayne Quillen ,  Loady Palmer Holbrook ,  Stephanie Ann Roane ,  Dale Edward O'Dell ,  John Cleaon Moore

    发明人： Michael Wayne Quillen ,  Loady Palmer Holbrook ,  Stephanie Ann Roane ,  Dale Edward O'Dell ,  John Cleaon Moore

    IPC分类号： H01L21/28 ,  H01L21/31

    CPC分类号： G03F7/0048

    摘要： Compositions and methods useful for the coating of polymeric materials onto substrates, for example, electronic device substrates such as semiconductor wafers, are provided. These compositions and methods are particularly suitable manipulating thickness of a polymeric coating in a single coating event. Such methods to control photoresist thickness are used to facilitate the layering of electronic circuitry in a three-dimensional fashion. Furthermore, the compositions of the present invention may be effectively used to deposit thick films of polymeric material in a uniform manner onto inorganic substrates which provides a significant benefit over conventional systems.

    摘要翻译： 提供了可用于将聚合物材料涂覆到基底上的组合物和方法，例如电子器件基底如半导体晶片。 这些组合物和方法特别适合于在单一涂层事件中操纵聚合物涂层的厚度。 用于控制光致抗蚀剂厚度的这种方法用于促进以三维方式分层电子电路。 此外，本发明的组合物可以有效地用于以均匀的方式将聚合物材料的厚膜沉积到无机基底上，这提供了比传统系统显着的益处。

    COMPOSITIONS AND METHODS FOR REMOVING ORGANIC SUBSTANCES
    10.
    发明申请
    COMPOSITIONS AND METHODS FOR REMOVING ORGANIC SUBSTANCES 失效
    用于去除有机物质的组合物和方法

    公开(公告)号：US20100242998A1

    公开(公告)日：2010-09-30

    申请号：US12413085

    申请日：2009-03-27

    申请人： Michael Wayne Quillen ,  Dale Edward O'Dell ,  Zachary Philip Lee ,  John Cleaon Moore

    发明人： Michael Wayne Quillen ,  Dale Edward O'Dell ,  Zachary Philip Lee ,  John Cleaon Moore

    IPC分类号： B08B3/08 ,  G03F7/42

    CPC分类号： C08L81/00 ,  C11D7/34 ,  C11D7/5022 ,  C11D11/0047 ,  G03F7/423 ,  G03F7/425 ,  G03F7/426

    摘要： Compositions and methods useful for the removal of organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. A method is presented which applies a minimum volume of the composition as a coating to the inorganic substrate whereby sufficient heat is added and immediately rinsed with water to achieve complete removal. These compositions and methods are particularly suitable for removing and completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices.

    摘要翻译： 提供了可用于从基底去除有机物质的组合物和方法，例如电子器件基底如微电子晶片或平板显示器。 提出了一种方法，其将组合物的最小体积作为涂层施加到无机基底上，由此添加足够的热量并立即用水冲洗以实现完全去除。 这些组合物和方法特别适用于从电子装置中除去和完全溶解正极和负极品种的光致抗蚀剂以及热固性聚合物。