公开(公告)号：US10338699B2

公开(公告)日：2019-07-02

申请号：US14751038

申请日：2015-06-25

Applicant: Microsoft Technology Licensing, LLC

Inventor： Kurt A. Jenkins

IPC: G09G5/00 ,  G06F3/0354 ,  B29D12/02 ,  B43K8/00 ,  B43K21/00 ,  B43K23/008 ,  B43K5/00 ,  B43K7/00 ,  G02C5/00 ,  G06F1/16 ,  G06F1/20 ,  D06N7/00 ,  G02C5/16 ,  G02C11/08

Abstract: The description relates to devices. One example device can involve a mesh structure with a density profile varying from a first end of the mesh structure to a second end of the mesh structure.

公开(公告)号：US10321615B2

公开(公告)日：2019-06-11

申请号：US15184907

申请日：2016-06-16

Applicant: Microsoft Technology Licensing, LLC

Inventor： Taylor Stellman ,  Andrew D. Delano ,  Lincoln Ghioni ,  Kurt A. Jenkins

IPC: H05K7/20 ,  G02F1/1333 ,  H01L51/52 ,  F21V8/00

Abstract: Described herein is a display module for an electronic device having a thermal management structure integrated on a backside of the display module. Also described herein are techniques for manufacturing a display module with an integrated thermal management structure. By integrating the thermal management structure on the backside of the display module, the display module itself becomes a passive thermal management solution for an electronic device. Accordingly, the thermal management structure described herein can be considered a part of the display component stack.

公开(公告)号：US10302847B2

公开(公告)日：2019-05-28

申请号：US14720205

申请日：2015-05-22

Applicant: Microsoft Technology Licensing, LLC

Inventor： Kurt A. Jenkins ,  Lincoln M. Ghioni

IPC: F21V7/04 ,  F21V8/00 ,  B29D11/00 ,  G02B27/01 ,  B29C45/37 ,  B29C45/73 ,  B29K69/00 ,  B29C45/00

Abstract: In one or more embodiments, micro light guides are constructed that include a wall and one or more features extending from or protruding into one or more surfaces of the wall. The microstructure light guide is defined by a mold and formed as a single article with uniform internal stresses. In at least some embodiments, the mold that defines the microstructure light guide employs pixelated mold portions that enable selective temperature adjustment of discrete regions of the mold portions to form the microstructure light guide.

公开(公告)号：US09575523B2

公开(公告)日：2017-02-21

申请号：US14603142

申请日：2015-01-22

Applicant: Microsoft Technology Licensing, LLC

Inventor： Kurt A. Jenkins ,  Edward Burress ,  Jaya Narain ,  Robert J. Bergeson ,  Andrew W. Hill ,  Taylor Stellman

IPC: H01L21/326 ,  G06F1/20 ,  G06F1/16 ,  G06F3/041 ,  G06F3/045 ,  H01L23/373 ,  H01L23/40

CPC classification number: G06F1/203 ,  G06F1/1626 ,  G06F1/1643 ,  G06F1/1658 ,  G06F3/041 ,  G06F3/0412 ,  G06F3/045 ,  H01L23/3675 ,  H01L23/3735 ,  H01L23/4006 ,  H01L2023/4068 ,  H01L2924/0002 ,  H05K7/2039 ,  H05K7/20436 ,  H01L2924/00

Abstract: The description relates to devices, such as computing devices. One example can include a sandwich structured composite housing. The example can also include a set of electronic components positioned over the sandwich structured composite housing. The set of electronic components can have a profile against the sandwich structured composite housing. The sandwich structured composite housing can have a corresponding negative profile.

Abstract translation: 该描述涉及诸如计算设备的设备。 一个例子可以包括三明治结构复合材料外壳。 该示例还可以包括位于夹层结构复合外壳上的一组电子部件。 该组电子部件可以具有抵抗夹层结构复合外壳的轮廓。 三明治结构复合外壳可以具有相应的负曲线。

公开(公告)号：US09411436B2

公开(公告)日：2016-08-09

申请号：US14033290

申请日：2013-09-20

Applicant: Microsoft Technology Licensing, LLC

Inventor： Timothy C. Shaw ,  Richard D. Harley ,  Xuezhong Wu ,  Bradley R. Martin ,  Kurt A. Jenkins

IPC: G02B6/26 ,  G06F3/0346 ,  G06F3/023 ,  H04M1/22 ,  G06F1/16

CPC classification number: G06F3/044 ,  G02B6/0011 ,  G02B6/0038 ,  G06F1/1632 ,  G06F1/1669 ,  G06F1/1683 ,  G06F3/0202 ,  G06F3/021 ,  G06F3/023 ,  G06F3/0346 ,  G06F3/0414 ,  H01H2219/062 ,  H04M1/22

Abstract: Input device backlighting techniques are described. In one or more implementations, an input device includes a light guide configured to transmit light, a sensor assembly having a plurality of sensors that are configured to detect proximity of an object as a corresponding one or more inputs, a connection portion configured to form a communicative coupling to a computing device to communicate the one or more inputs received by the sensor assembly to the computing device, and an outer layer. The outer layer has a plurality of indications of inputs formed using openings in the outer layer such that light from the light guide is configured to pass through the openings to function as a backlight. The outer layer also has a plurality of sub-layers arranged to have increasing levels of resistance to transmission of the light from the light guide, one to another.

Abstract translation: 描述输入设备背光技术。 在一个或多个实施方式中，输入设备包括被配置为透射光的光导，具有多个传感器的传感器组件，所述多个传感器被配置为检测作为对应的一个或多个输入的物体的接近度;连接部分，被配置为形成 与计算设备的通信耦合以将由传感器组件接收的一个或多个输入传送到计算设备，以及外层。 外层具有多个使用在外层中的开口形成的输入的指示，使得来自光导的光被配置成穿过开口以用作背光。 外层还具有多个子层，其被布置成具有对来自光导的光的传输阻力的增加的水平。