摘要:
An MOS-controlled, lateral SCR device including a semiconductor substrate of a first doping type; a first well region formed in the substrate and being of a second doping type which is different from the first doping type; a second well region formed in the substrate, being of the second doping type, and being spaced apart from the first well region so as to define an intermediate region separating the first and second well regions from each other; a first region formed within the first well region and extending into the intermediate region between the first and second well regions, the first region being of the second doping type; a second region formed within the second well region and extending into the intermediate region between the first and second well regions, the second region being of the second doping type; and a control gate bridging over the intermediate region between the first and second regions.
摘要:
In this invention, a whole-chip ESD protection scheme with the SCR string or the SCR/diode-mixed string are proposed to protect the mixed-voltage CMOS IC's against the ESD damage. The SCR string or the SCR/diode-mixed string is placed between the separated power lines. The ESD current is arranged to be discharged through the SCR string or the SCR/diode-mixed string and the ESD clamps between the power lines. Therefore, the internal circuits and the interface circuits between the circuits with different power supplies can be prevented from ESD damages. The number of the SCR's or the diodes in the SCR string or the SCR/diode-mixed string connected between the different power lines is dependent on the voltage difference between the different power supplies in the mixed-voltage CMOS IC's. When the IC is in the normal operating conditions, such SCR string or the SCR/diode-mixed string between the different power lines is kept off to maintain the independence of the power supplies in the mixed-voltage COMS IC.
摘要:
In this invention, a new whole-chip ESD protection scheme with the ESD buses has been proposed to solve the ESD protection issue of the CMOS IC having a large number of separated power lines. Multiple ESD buses, which are formed by the wide metal lines, have been added into the CMOS IC having a large number of separated power lines. The bi-directional ESD-connection cells are connected between the separated power lines and the ESD buses, but not between the separated power lines. The ESD current on the CMOS IC with more separated power lines are all conducted into the ESD buses, therefore the ESD current can be conducted by the ESD buses away from the internal circuits and quickly discharged through the designed ESD protection devices to ground. By using this new whole-chip ESD protection scheme with the ESD buses, the CMOS IC having more separated power lines can be still safely protected against ESD damages.
摘要:
CMOS VLSI chips with pin counts greater than 100 often have multiple power pins to supply sufficient current for circuit operations. In mixed voltage ICs there are separated power pins with different power supplies for specified power operations, and in these ICs the power supplies for the digital and analog circuits are often separated due to noise considerations. In such ICs with separated power pins, the interface circuits between the circuits with different power pins are vulnerable to ESD (electrostatic discharge) stress. Even though there are suitable ESD protection circuits around the input and output pins of the IC, unexpected ESD damage still happens to the interface circuits between the circuits with different power pins, so that a whole-chip ESD protection arrangement using bi-directional SCRs is provided to protect the CMOS ICs against ESD damage. The bi-directional SCRs are placed between the separated power lines of the CMOS IC to provide ESD current discharging paths between the separated power lines. Thus, the vulnerable internal circuits and interface circuits between the different power pins are rendered remote from the ESD damage. The present ESD protection arrangement can be applied to chips having multiple or mixed-voltage power pins.
摘要:
The cascode LVTSCR includes two or more SCRs (silicon controlled rectifiers). Each SCR has an anode, a control gate, and a cathode. The SCRs are cascoded in series by coupling the control gates of same type SCRs in common and coupling the cathode of one SCR to the anode of next SCR in series. The holding voltage of the cascode LVTSCR can be designed to be greater than VDD voltage level of the IC. Therefore, the cascode LVTSCR has no latchup problem in the CMOS IC's. The electrostatic discharge (ESD) protection circuit in the present invention includes a cascode LVTSCR (low-voltage triggering silicon controlled rectifier) with an anode and a cathode coupled between power supplies, and a detecting circuit coupled between the power supplies for detecting an electrostatic charge to trigger the control gates of the cascode LVTSCR for dissipating the electrostatic discharge. The ESD protection circuit including the cascode LVTSCR can sustain high ESD stress but without causing the latchup problem in the CMOS IC's.
摘要:
An electrostatic discharge (ESD) circuit for protecting a semiconductor integrated circuit (IC) device is disclosed. One ESD circuit is located between each I/O buffering pad that connects to one lead pin and the internal circuitry of IC. The ESD circuit is connected to both power terminals. The ESD circuit comprises first and second low-voltage-trigger SCRs (LVTSCRs), each having an anode, a cathode, an anode gate and a cathode gate. The anode and anode gate of the first SCR are connected to a first power terminal, the cathode of the first SCR is connected to its I/O buffering pad, and the cathode gate of the first SCR is connected to the second power terminal. The ESD circuit further comprises a PMOS transistor having drain, source, gate, and bulk terminals. The PMOS transistor's gate, source and bulk terminals are connected to the first power terminal, the PMOS transistor drain terminal is connected to the cathode gate of the first SCR. The cathode and cathode gate of the second SCR are connected to the second power terminals. The anode of the second SCR is connected to its associated I/O buffering pads. The anode gate of the second SCR is connected to the first power terminal. The ESD circuit also comprises an NMOS transistor having drain, source, gate, and bulk terminals. The NMOS transistor's gate, source and bulk terminals are connected to the second power terminals. The NMOS transistor's drain terminal is connected to the anode gate of the second SCR.
摘要:
The present invention comprises an ESD clamp circuit used in an integrated circuit with plural power supply. The ESD clamp circuit, connected between core voltage source and low voltage source, is fabricated by a process which fabricates core circuit. The ESD clamp circuit has a low trigger voltage, so it can conduct large current to protect the core circuit before the core circuit is damaged.