公开(公告)号：US20210167046A1

公开(公告)日：2021-06-03

申请号：US17106630

申请日：2020-11-30

Applicant: NICHIA CORPORATION

Inventor： Eiko MINATO ,  Masaaki KATSUMATA

IPC: H01L25/075 ,  H01L33/50 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62

Abstract: A surface-emitting light source includes: light-emitting modules; a wiring substrate including a base member having a surface at a light-emitting modules side and a rear surface opposite to that, a wiring layer on the rear surface of the base member and including wiring pads being portions of the wiring layer, electrically-conductive members each supplied across corresponding two or more of a plurality of vias in each of the wiring pads, and a covering layer covering the wiring layer and defining openings in each of which a portion of a corresponding one of the wiring pads is exposed; and an adhesive layer between the light-emitting modules and the wiring substrate. Each light-emitting module has an array of light emitting devices. The covering layer defines the openings at locations corresponding to the wiring pads with an area dimension smaller than respective area dimensions of the wiring pads.

公开(公告)号：US20200343407A1

公开(公告)日：2020-10-29

申请号：US16857959

申请日：2020-04-24

Applicant: NICHIA CORPORATION

Inventor： Eiko MINATO ,  Koji TAGUCHI ,  Yumiko KAMESHIMA ,  Masaaki KATSUMATA

IPC: H01L33/00 ,  H01L25/075 ,  H01L33/62 ,  H01L33/24

Abstract: A method for manufacturing a light-emitting module includes a step of providing a bonded board including a board including, on a first surface, a circuit pattern and wiring pads that are continuous with the circuit pattern and each have bottomed holes and light-emitting segments connected on a second surface of the board with an adhesive sheet interposed therebetween and including an array of light-emitting devices; a step of supplying electrically conductive paste inside the bottomed holes and on portions of the surface of the wiring pad around the bottomed holes through openings of a mask; and a step of performing thermal compression to harden the electrically conductive paste such that the thickness of the electrically conductive paste on the portions of the surface of the wiring pad is smaller than the electrically conductive paste at the timing of being disposed through the openings of the mask.