公开(公告)号：US11257990B2

公开(公告)日：2022-02-22

申请号：US16143349

申请日：2018-09-26

Applicant: Nichia Corporation

Inventor： Atsushi Bando ,  Kazuya Matsuda

IPC: H01L33/50 ,  H01L25/075 ,  H01L27/15 ,  H01L33/52 ,  H01L33/20 ,  H01L33/58 ,  H01L33/62

Abstract: A light emitting device includes: a first light emitting element and a second light emitting element, each having a peak emission wavelength in a range of 430 nm to 480 nm; a first light transmissive member disposed on an upper face of the first light emitting element and containing a first phosphor; a second light transmissive member disposed on an upper face of the second light emitting element; and an encapsulant covering the first light transmissive member and the second light transmissive member and containing a second phosphor. The first light emitting element and the second light emitting element are configured to be independently driven. A chromaticity of light exiting from the first light transmissive member differs from a chromaticity of light exiting from the second light transmissive member.

公开(公告)号：US11251334B2

公开(公告)日：2022-02-15

申请号：US16774565

申请日：2020-01-28

Applicant: NICHIA CORPORATION

Inventor： Hiroyuki Tanaka ,  Yasuo Kato ,  Kazuya Matsuda

IPC: H01L21/00 ,  H01L23/495 ,  H01L33/00 ,  H01L25/075

Abstract: A method of manufacturing light emitting devices, the method including: providing a first structure, the providing a first structure including: providing a lead frame, the providing a lead frame including: providing a metal plate having a plurality of pairs of first and second metal parts, each of the first and second metal parts including at least one first region and at least one second region; using an electrodeposition technique, disposing a mask of a resist film on the at least one first region; disposing a first plating containing silver or silver alloy on the at least one second region; and removing the resist film; molding a resin molded body in one piece with the lead frame with parts of a lower surface of the lead frame being exposed, in which, the first structure includes an upper surface defining a plurality of recesses each having an upward-facing surface, at least parts of the first plating being located at the upward-facing surface of each of the plurality of recesses; providing a second structure, the providing a second structure including: disposing at least one light-emitting element on the first plating located at the upward-facing surface of each of the plurality of recesses; and disposing a sealing member covering the at least one light-emitting element in each of the plurality of recesses; and separating the second structure into a plurality of individual light emitting devices.