公开(公告)号：US12237450B2

公开(公告)日：2025-02-25

申请号：US17478376

申请日：2021-09-17

Applicant: NICHIA CORPORATION

Inventor： Yasuo Kato ,  Kazuya Matsuda

IPC: H01L33/62 ,  H01L23/495 ,  H01L33/56

Abstract: A metallic structure for an optical semiconductor device including a conductive base body having disposed thereon metallic layers in the following order: a nickel or nickel alloy plated layer, a gold or gold alloy plated layer, and an indium or indium alloy plated layer, wherein the indium or indium alloy plated layer has a thickness in a range of 0.002 μm or more and 0.3 μm or less.

公开(公告)号：US11264546B2

公开(公告)日：2022-03-01

申请号：US16584587

申请日：2019-09-26

Applicant: NICHIA CORPORATION

Inventor： Yasuo Kato ,  Kazuya Matsuda

IPC: H01L33/62 ,  H01L33/60 ,  H01L33/48 ,  H01L33/50 ,  H01L33/56 ,  C09K11/77 ,  H01S5/0231

Abstract: A metallic structure for an optical semiconductor device, including a base body having disposed thereon at least in part metallic layers in the following order; a nickel or nickel alloy plated layer, a gold or gold alloy plated layer, and a silver or silver alloy plated layer, wherein the silver or silver alloy plated layer has a thickness in a range of 0.001 μm or more and 0.01 μm or less.

公开(公告)号：US11183619B2

公开(公告)日：2021-11-23

申请号：US16698324

申请日：2019-11-27

Applicant: NICHIA CORPORATION

Inventor： Hiroyuki Tanaka ,  Yasuo Kato ,  Kazuya Matsuda

IPC: H01L33/56 ,  H01L33/62 ,  H01L33/54 ,  H01L33/60 ,  H01L33/48

Abstract: A method of manufacturing a light emitting device, including: providing a first structure including: providing a lead frame which includes providing a metal plate including a plurality of pairs of first and second metal parts, each metal part including an upper surface, a lower surface, and an end surface, the end surface of the first metal part and the end surface of the second metal part of each pair are opposite to each other, and a first region including the end surface, and disposing a mask of a resist film on the first region using an electrodeposition technique, disposing a first plated layer containing gold or gold alloy on a second region including the upper surface other than the first region on at least one of the upper surface, the lower surface, and the end surface of each of the first and second metal parts using a plating technique, and removing the resist film, providing a resin molded body molded integrally with the lead frame with parts of a lower surface of the lead frame being exposed, in which the first structure includes an upper surface defining a plurality of recesses each having an upward-facing surface, the first plated layer on the upper surface of the metal part is located at the upward-facing surface of each of the plurality of recesses; providing a second structure, the providing a second structure including; disposing at least one light-emitting element on the upward-facing surface each of the plurality of recesses, disposing a sealing member covering the at least one light-emitting element in each of the plurality of recesses; and separating the second structure into a plurality of discrete light emitting devices.

公开(公告)号：US11152547B2

公开(公告)日：2021-10-19

申请号：US16584038

申请日：2019-09-26

Applicant: NICHIA CORPORATION

Inventor： Yasuo Kato ,  Kazuya Matsuda

IPC: H01L33/62 ,  H01L33/56 ,  H01L23/495

Abstract: A metallic structure for an optical semiconductor device including a conductive base body having disposed thereon metallic layers in the following order: a nickel or nickel alloy plated layer, a gold or gold alloy plated layer, and an indium or indium alloy plated layer, wherein the indium or indium alloy plated layer has a thickness in a range of 0.002 μm or more and 0.3 μm or less.

公开(公告)号：US12116516B2

公开(公告)日：2024-10-15

申请号：US17576221

申请日：2022-01-14

Applicant: NICHIA CORPORATION

Inventor： Yasuo Kato ,  Kazuya Matsuda

IPC: H01L23/495 ,  C09K11/77 ,  H01L33/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01S5/0232

CPC classification number: C09K11/7774 ,  H01L33/486 ,  H01L33/502 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01S5/0232 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A metallic structure for an optical semiconductor device, including a base body having disposed thereon at least in part metallic layers in the following order; a nickel or nickel alloy plated layer, a gold or gold alloy plated layer, and a silver or silver alloy plated layer, wherein the silver or silver alloy plated layer has a thickness in a range of 0.001 μm or more and 0.01 μm or less.

公开(公告)号：US10411169B2

公开(公告)日：2019-09-10

申请号：US15886726

申请日：2018-02-01

Applicant: NICHIA CORPORATION

Inventor： Mitsuhiro Isono ,  Kensuke Maehara ,  Kazuya Matsuda ,  Takaaki Kato

IPC: H01L33/48 ,  H01L33/54 ,  H01L33/62 ,  H01L33/50 ,  H01L33/56 ,  H01L33/60 ,  H01L33/46

Abstract: A light emitting device includes: a resin package including: a first lead including: at least one notch extending from an upper surface of the first lead to a lower surface of the first lead, a first groove formed in the upper surface of the first lead, and at least one second groove connecting the first groove with the at least one notch, and a second lead, and a resin body including: a first resin portion, a second resin portion, a part of the second resin portion being disposed in the first groove, a third resin portion disposed between the first lead and the second lead, and a first resin connecting portion connecting the first resin portion with the second resin portion, at least a part of the first resin connecting portion being disposed in the at least one second groove; a light emitting element; and a light reflecting member.

公开(公告)号：US11257994B2

公开(公告)日：2022-02-22

申请号：US16720681

申请日：2019-12-19

Applicant: NICHIA CORPORATION

Inventor： Kazuya Matsuda ,  Yasuo Kato ,  Hiroyuki Tanaka

IPC: H01L33/56 ,  H01L33/48 ,  H01L33/46 ,  H01L33/62

Abstract: A resin package defining a recess includes a first lead having an element-mounting region, a second lead having a wire-connecting region, and a resin body including first to third resin portions. The third resin portion surrounds the element-mounting region. Each of the first and second leads includes a first plating and a second plating covering at least a portion of the first plating. The wire-connecting region is located outward of the third resin portion. The element-mounting region is located on an outermost surface of the second plating. In a top view, the wire-connecting region is located laterally inward of a portion of the second plating of the second lead that has an outermost surface located higher than that of the first plating of the second lead.

公开(公告)号：US10950764B2

公开(公告)日：2021-03-16

申请号：US16200635

申请日：2018-11-26

Applicant: NICHIA CORPORATION

Inventor： Atsushi Bando ,  Kazuya Matsuda

IPC: H01L25/075 ,  H01L33/54 ,  H01L33/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L25/16 ,  H01L27/02

Abstract: A light-emitting device includes: a first light-emitting element and a second light-emitting element, each having a peak emission wavelength in a range of 430 nm to 480 nm; and a sealing member covering the first light-emitting element and the second light-emitting element, the sealing member containing a first fluorescent material. The first light-emitting element and the second light-emitting element are configured to be individually driven. The sealing member includes a protruding portion at an upper surface thereof. The first light-emitting element is disposed in a first region, which is located under the protruding portion. The second light-emitting element is disposed in a second region, which is located under the upper surface of the sealing member at a position different from the first region.

公开(公告)号：US12074262B2

公开(公告)日：2024-08-27

申请号：US17489475

申请日：2021-09-29

Applicant: NICHIA CORPORATION

Inventor： Kazuya Matsuda ,  Atsushi Bando

IPC: H01L33/50 ,  H01L33/54 ,  H01L33/62

CPC classification number: H01L33/504 ,  H01L33/507 ,  H01L33/54 ,  H01L33/62

Abstract: A light-emitting device includes: a first light-emitting element and a second light-emitting element, each configured to be independently driven; a wall portion located between the first light-emitting element and the second light-emitting element; a first light-transmissive member separated from the second light-emitting element by the wall portion and covering at least a portion of lateral surfaces of the first light-emitting element, wherein the first light-transmissive member contains a first wavelength converting member; and a second light-transmissive member covering the first light-emitting element, the second light-emitting element, and the first light-transmissive member in a plan view, wherein the second light-transmissive member contains a second wavelength converting member. A peak emission wavelength of the first wavelength converting member is longer than a peak emission wavelength of the second wavelength converting member.

公开(公告)号：US11158776B2

公开(公告)日：2021-10-26

申请号：US16922868

申请日：2020-07-07

Applicant: NICHIA CORPORATION

Inventor： Kazuya Matsuda ,  Naofumi Sumitani

IPC: H01L33/62 ,  H01L23/495

Abstract: A lead frame includes a plurality of unit structures, an outer frame, a plurality of extending portions, and a plurality of coupling portions. The unit structures each includes a first lead portion and a second lead portion aligned in a first direction, and grouped into first and second groups including a plurality of the unit structures aligned in the first direction. The extending portions each includes a first extending portion extending in the second direction and connecting the first lead portions of the unit structures in the first and second groups a second extending portion connecting the second lead portions of the unit structures in the first and second groups. The coupling portions connect all the first extending portions and the second extending portions. At least one of the extending portions located at one of ends in the first direction is not directly connected to the outer frame.