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公开(公告)号：US12237450B2
公开(公告)日：2025-02-25
申请号：US17478376
申请日：2021-09-17
Applicant: NICHIA CORPORATION
Inventor： Yasuo Kato , Kazuya Matsuda
IPC: H01L33/62 , H01L23/495 , H01L33/56
Abstract: A metallic structure for an optical semiconductor device including a conductive base body having disposed thereon metallic layers in the following order: a nickel or nickel alloy plated layer, a gold or gold alloy plated layer, and an indium or indium alloy plated layer, wherein the indium or indium alloy plated layer has a thickness in a range of 0.002 μm or more and 0.3 μm or less.
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公开(公告)号：US11264546B2
公开(公告)日：2022-03-01
申请号：US16584587
申请日：2019-09-26
Applicant: NICHIA CORPORATION
Inventor： Yasuo Kato , Kazuya Matsuda
Abstract: A metallic structure for an optical semiconductor device, including a base body having disposed thereon at least in part metallic layers in the following order; a nickel or nickel alloy plated layer, a gold or gold alloy plated layer, and a silver or silver alloy plated layer, wherein the silver or silver alloy plated layer has a thickness in a range of 0.001 μm or more and 0.01 μm or less.
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公开(公告)号：US11183619B2
公开(公告)日：2021-11-23
申请号：US16698324
申请日：2019-11-27
Applicant: NICHIA CORPORATION
Inventor： Hiroyuki Tanaka , Yasuo Kato , Kazuya Matsuda
Abstract: A method of manufacturing a light emitting device, including: providing a first structure including: providing a lead frame which includes providing a metal plate including a plurality of pairs of first and second metal parts, each metal part including an upper surface, a lower surface, and an end surface, the end surface of the first metal part and the end surface of the second metal part of each pair are opposite to each other, and a first region including the end surface, and disposing a mask of a resist film on the first region using an electrodeposition technique, disposing a first plated layer containing gold or gold alloy on a second region including the upper surface other than the first region on at least one of the upper surface, the lower surface, and the end surface of each of the first and second metal parts using a plating technique, and removing the resist film, providing a resin molded body molded integrally with the lead frame with parts of a lower surface of the lead frame being exposed, in which the first structure includes an upper surface defining a plurality of recesses each having an upward-facing surface, the first plated layer on the upper surface of the metal part is located at the upward-facing surface of each of the plurality of recesses; providing a second structure, the providing a second structure including; disposing at least one light-emitting element on the upward-facing surface each of the plurality of recesses, disposing a sealing member covering the at least one light-emitting element in each of the plurality of recesses; and separating the second structure into a plurality of discrete light emitting devices.
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公开(公告)号：US11152547B2
公开(公告)日：2021-10-19
申请号：US16584038
申请日：2019-09-26
Applicant: NICHIA CORPORATION
Inventor： Yasuo Kato , Kazuya Matsuda
IPC: H01L33/62 , H01L33/56 , H01L23/495
Abstract: A metallic structure for an optical semiconductor device including a conductive base body having disposed thereon metallic layers in the following order: a nickel or nickel alloy plated layer, a gold or gold alloy plated layer, and an indium or indium alloy plated layer, wherein the indium or indium alloy plated layer has a thickness in a range of 0.002 μm or more and 0.3 μm or less.
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公开(公告)号：US10483445B2
公开(公告)日：2019-11-19
申请号：US16043364
申请日：2018-07-24
Applicant: NICHIA CORPORATION
Inventor： Yasuo Kato
Abstract: A lead frame includes a base material and two or more silver-containing layers. The base material is composed of a metal. The two or more silver-containing layers are stacked on the base material. The two or more silver-containing layers includes an uppermost silver-containing layer containing sulfur, and a lower silver-containing layer. The lower silver-containing layer contains no selenium or the lower silver-containing layer is composed substantially only of silver. A method for manufacturing a light emitting device includes: preparing a lead frame; preparing a package including the lead frame; and mounting a light emitting element on the package. The lead frame is prepared by: providing a base material; forming an underlying metal on the base material by plating to form an underlayer; and forming two or more silver-containing stacked layers on the underlayer, the two or more silver-containing stacked layers including an uppermost silver-containing layer containing sulfur.
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Patent Agency Ranking
公开(公告)号：US20160204321A1
公开(公告)日：2016-07-14
申请号：US14757843
申请日：2015-12-24
Applicant: NICHIA CORPORATION
Inventor： Ryoji Naka , Naofumi Sumitani , Yasuo Kato , Tomohide Miki
CPC classification number: H01L33/62 , H01L25/167 , H01L33/44 , H01L33/54 , H01L33/56 , H01L33/60 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49113 , H01L2224/8592 , H01L2924/0002 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
Abstract: A light emitting device includes a base having a first lead electrode and a second lead electrode. Each of the first lead electrode and the second lead electrode includes a reflecting layer which includes silver or silver alloy plating containing a sulfur-based gloss agent. A light emitting element is provided on one side of the base and is electrically connected to the first lead electrode and the second lead electrode. The reflecting layer is on the one side of the base. A sealer includes resin and is provided on the one side of the base to seal the light emitting element and at least a part of the first lead electrode and the second lead electrode. A light-transmissive protective film includes an inorganic matter and is provided between the reflecting layer and the sealer.
Abstract translation: 发光器件包括具有第一引线电极和第二引线电极的基极。 第一引线电极和第二引线电极中的每一个包括包含含有硫基光泽剂的银或银合金电镀的反射层。 发光元件设置在基座的一侧，并与第一引线电极和第二引线电极电连接。 反射层位于基底的一侧。 密封件包括树脂，并且设置在基座的一侧上，以密封发光元件和第一引线电极和第二引线电极的至少一部分。 透光保护膜包括无机物质，并且设置在反射层和密封剂之间。
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公开(公告)号：US10103302B2
公开(公告)日：2018-10-16
申请号：US14757843
申请日：2015-12-24
Applicant: NICHIA CORPORATION
Inventor： Ryoji Naka , Naofumi Sumitani , Yasuo Kato , Tomohide Miki
Abstract: A light emitting device includes a base having a first lead electrode and a second lead electrode. Each of the first lead electrode and the second lead electrode includes a reflecting layer which includes silver or silver alloy plating containing a sulfur-based gloss agent. A light emitting element is provided on one side of the base and is electrically connected to the first lead electrode and the second lead electrode. The reflecting layer is on the one side of the base. A sealer includes resin and is provided on the one side of the base to seal the light emitting element and at least a part of the first lead electrode and the second lead electrode. A light-transmissive protective film includes an inorganic matter and is provided between the reflecting layer and the sealer.
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公开(公告)号：US11257994B2
公开(公告)日：2022-02-22
申请号：US16720681
申请日：2019-12-19
Applicant: NICHIA CORPORATION
Inventor： Kazuya Matsuda , Yasuo Kato , Hiroyuki Tanaka
Abstract: A resin package defining a recess includes a first lead having an element-mounting region, a second lead having a wire-connecting region, and a resin body including first to third resin portions. The third resin portion surrounds the element-mounting region. Each of the first and second leads includes a first plating and a second plating covering at least a portion of the first plating. The wire-connecting region is located outward of the third resin portion. The element-mounting region is located on an outermost surface of the second plating. In a top view, the wire-connecting region is located laterally inward of a portion of the second plating of the second lead that has an outermost surface located higher than that of the first plating of the second lead.
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公开(公告)号：US10263166B2
公开(公告)日：2019-04-16
申请号：US15943432
申请日：2018-04-02
Applicant: NICHIA CORPORATION
Inventor： Masakazu Sakamoto , Yoshiki Sato , Yasuo Kato
Abstract: A light emitting device includes a light emitting element; a light reflecting member having an Ag-containing layer on a surface thereof; and a protective film having a thickness of 1 nm to 300 nm and covering a surface of the light reflecting member, the protective film covering a surface of the light reflecting member, in which the Ag-containing layer has a thickness of 0.1 μm to 0.5 μm.
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公开(公告)号：US11251334B2
公开(公告)日：2022-02-15
申请号：US16774565
申请日：2020-01-28
Applicant: NICHIA CORPORATION
Inventor： Hiroyuki Tanaka , Yasuo Kato , Kazuya Matsuda
IPC: H01L21/00 , H01L23/495 , H01L33/00 , H01L25/075
Abstract: A method of manufacturing light emitting devices, the method including: providing a first structure, the providing a first structure including: providing a lead frame, the providing a lead frame including: providing a metal plate having a plurality of pairs of first and second metal parts, each of the first and second metal parts including at least one first region and at least one second region; using an electrodeposition technique, disposing a mask of a resist film on the at least one first region; disposing a first plating containing silver or silver alloy on the at least one second region; and removing the resist film; molding a resin molded body in one piece with the lead frame with parts of a lower surface of the lead frame being exposed, in which, the first structure includes an upper surface defining a plurality of recesses each having an upward-facing surface, at least parts of the first plating being located at the upward-facing surface of each of the plurality of recesses; providing a second structure, the providing a second structure including: disposing at least one light-emitting element on the first plating located at the upward-facing surface of each of the plurality of recesses; and disposing a sealing member covering the at least one light-emitting element in each of the plurality of recesses; and separating the second structure into a plurality of individual light emitting devices.
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