公开(公告)号：US20130243371A1

公开(公告)日：2013-09-19

申请号：US13775891

申请日：2013-02-25

Applicant: NITTO DENKO CORPORATION

Inventor： Yuichi TSUJITA ,  Yasuto ISHIMARU ,  Akihito MATSUTOMI ,  Naoyuki TANAKA ,  Yasufumi YAMAMOTO ,  Mayu OZAKI

IPC: G02B6/136

CPC classification number: G02B6/12004 ,  G02B6/136 ,  G02B6/138 ,  G02B6/4214 ,  G02B6/43

Abstract: An opto-electric hybrid board includes an electric circuit board, an optical waveguide, and a metal layer. The electric circuit board includes an insulative layer having front and back surfaces, and electrical interconnect lines formed on the front surface of the insulative layer. The optical waveguide includes a first cladding layer and cores, and the optical waveguide is formed on the back surface of the insulative layer of the electric circuit board. The metal layer is formed between the first cladding layer of the optical waveguide and the back surface of the insulative layer of the electric circuit board. Part of the opto-electric hybrid board is formed as a to-be-bent portion. The metal layer is partially removed in a portion corresponding to the to-be-bent portion. A first cladding layer of the optical waveguide fills a site where the metal layer is removed.

Abstract translation: 光电混合基板包括电路板，光波导和金属层。 电路板包括具有前表面和后表面的绝缘层，以及形成在绝缘层的前表面上的电互连线。 光波导包括第一包层和芯，并且光波导形成在电路板的绝缘层的背面上。 金属层形成在光波导的第一包层和电路板的绝缘层的背面之间。 光电混合板的一部分形成为弯曲部。 在对应于被弯曲部分的部分中部分去除金属层。 光波导的第一包层填充去除金属层的位置。