公开(公告)号：US20160178863A1

公开(公告)日：2016-06-23

申请号：US14910048

申请日：2014-07-03

Applicant: NITTO DENKO CORPORATION

Inventor： Naoyuki TANAKA ,  Yasuto ISHIMARU ,  Naoki SHIBATA ,  Yuichi TSUJITA

IPC: G02B6/42 ,  G02B6/13 ,  G02B6/122

CPC classification number: G02B6/4281 ,  G02B6/122 ,  G02B6/13 ,  G02B6/138 ,  G02B6/4214 ,  G02B6/4274 ,  G02B6/43

Abstract: An opto-electric hybrid module is provided which has a linear light-path core and an electric circuit including mounting pads and an electric circuit body provided on a surface of an under-cladding layer of an optical waveguide. An optical element is mounted with its electrodes in abutment against the mounting pads. The electric circuit body and a portion of the surface of the under-cladding layer other than a core formation portion and an electric circuit formation portion are covered with a stack including a core material layer and an over-cladding material layer. A surface portion of the stack present between the mounting pads and the electric circuit body is located at a lower height position than a surface portion of the stack present on the electric circuit body.

Abstract translation: 提供了一种光电混合模块，其具有线性光路芯和包括安装焊盘的电路和设置在光波导的下敷层的表面上的电路体。 光学元件安装有其电极邻接安装垫。 除了芯形成部分和电路形成部分之外，电路体和下包层的表面的一部分被包括芯材料层和上敷层材料层的叠层覆盖。 存在于安装焊盘和电路体之间的堆叠的表面部分位于比存在于电路主体上的堆叠的表面部分更低的高度位置处。

公开(公告)号：US20130243371A1

公开(公告)日：2013-09-19

申请号：US13775891

申请日：2013-02-25

Applicant: NITTO DENKO CORPORATION

Inventor： Yuichi TSUJITA ,  Yasuto ISHIMARU ,  Akihito MATSUTOMI ,  Naoyuki TANAKA ,  Yasufumi YAMAMOTO ,  Mayu OZAKI

IPC: G02B6/136

CPC classification number: G02B6/12004 ,  G02B6/136 ,  G02B6/138 ,  G02B6/4214 ,  G02B6/43

Abstract: An opto-electric hybrid board includes an electric circuit board, an optical waveguide, and a metal layer. The electric circuit board includes an insulative layer having front and back surfaces, and electrical interconnect lines formed on the front surface of the insulative layer. The optical waveguide includes a first cladding layer and cores, and the optical waveguide is formed on the back surface of the insulative layer of the electric circuit board. The metal layer is formed between the first cladding layer of the optical waveguide and the back surface of the insulative layer of the electric circuit board. Part of the opto-electric hybrid board is formed as a to-be-bent portion. The metal layer is partially removed in a portion corresponding to the to-be-bent portion. A first cladding layer of the optical waveguide fills a site where the metal layer is removed.

Abstract translation: 光电混合基板包括电路板，光波导和金属层。 电路板包括具有前表面和后表面的绝缘层，以及形成在绝缘层的前表面上的电互连线。 光波导包括第一包层和芯，并且光波导形成在电路板的绝缘层的背面上。 金属层形成在光波导的第一包层和电路板的绝缘层的背面之间。 光电混合板的一部分形成为弯曲部。 在对应于被弯曲部分的部分中部分去除金属层。 光波导的第一包层填充去除金属层的位置。