公开(公告)号：US20220291463A1

公开(公告)日：2022-09-15

申请号：US17633445

申请日：2020-08-07

Applicant: NITTO DENKO CORPORATION

Inventor： Naoyuki TANAKA ,  Koya OSUKA ,  Seiki TERAJI

IPC: G02B6/42

Abstract: An opto-electric composite transmission module includes a printed wiring board, an electrical connector provided on the printed wiring board, and an opto-electric hybrid board which is electrically connected to the printed wiring board via the electrical connector. The opto-electric hybrid board has a long shape. The opto-electric hybrid board includes an opto-electric conversion portion including a flexible wiring board, a metal support layer, and an optical waveguide film in order in a thickness direction, and an electrical connection portion disposed in one end portion in a longitudinal direction of the opto-electric hybrid board and including the flexible wiring board, and the metal support layer and/or the optical waveguide film. The electrical connection portion is inserted into the electrical connector.

公开(公告)号：US20240353636A1

公开(公告)日：2024-10-24

申请号：US18684491

申请日：2022-08-30

Applicant: NITTO DENKO CORPORATION

Inventor： Naoyuki TANAKA ,  Seiki TERAJI

IPC: G02B6/42

CPC classification number: G02B6/4278 ,  G02B6/4262 ,  G02B6/428

Abstract: A photoelectric conversion module plug includes a PCB, an electrical connector, an opto-electric hybrid board, an optical fiber, a photonic device, and a casing that accommodates them. The opto-electric hybrid board includes a core. The core includes a mirror surface. The electrical connector and the optical fiber are separately arranged in the first direction. The casing includes a first wall and a second wall that face each other at an interval in the thickness direction. The first wall has a first intermediate surface extending in a direction away from the second wall in the thickness direction. The first intermediate surface faces an electrical connector side in an arrangement direction in which the electrical connector and the optical fiber are arranged.

公开(公告)号：US20240347229A1

公开(公告)日：2024-10-17

申请号：US18631853

申请日：2024-04-10

Applicant: NITTO DENKO CORPORATION

Inventor： Koichi TSUDA ,  Kyohei INAMOTO ,  Naoyuki TANAKA ,  Hideharu KAJIZUKA ,  Takuya KOIZUMI

IPC: H01B11/06 ,  H01B11/22

CPC classification number: H01B11/06 ,  H01B11/22

Abstract: A shield tape is provided in a hybrid cable. The shield tape includes one pair of differential wirings and a shield tape. The shield tape surrounds the one pair of differential wirings. The shield tape includes a substrate layer and a shield layer. The substrate layer has insulating properties. The shield layer is disposed at the opposite side of the one pair of differential wirings with respect to the substrate layer.

公开(公告)号：US20230036358A1

公开(公告)日：2023-02-02

申请号：US17792620

申请日：2021-01-14

Applicant: NITTO DENKO CORPORATION

Inventor： Kazuaki SUZUKI ,  Naoyuki TANAKA ,  Naoto KONEGAWA

IPC: G02B6/42

Abstract: Provided is an opto-electric transmission composite module and an opto-electric hybrid board, both of which can suppress the reduction in the function of an optical element when a driver element generates heat. The opto-electric transmission composite module includes: an opto-electric hybrid board including an optical waveguide, and an electric circuit board including a first terminal for mounting an optical element; and a printed wiring board including a fourth terminal for mounting a driver element. The printed wiring board is electrically connected with the electric circuit board.

公开(公告)号：US20230061980A1

公开(公告)日：2023-03-02

申请号：US17797622

申请日：2021-02-12

Applicant: NITTO DENKO CORPORATION

Inventor： Kazuaki SUZUKI ,  Naoyuki TANAKA ,  Naoto KONEGAWA

IPC: G02B6/42 ,  H05K1/02

Abstract: An opto-electric hybrid board includes an optical waveguide, and an electric circuit board disposed on a one-side surface in the thickness direction of the optical waveguide. The electric circuit board includes a first terminal on which an optical element portion is mounted and a second terminal on which a driver element portion is mounted. The electric circuit board includes a metal supporting layer that overlaps the first terminal and the second terminal when the electric circuit board is projected in the thickness direction. The metal supporting layer has an opening portion that is located between the first terminal and the second terminal when the metal supporting layer is projected in the thickness direction.

公开(公告)号：US20160178863A1

公开(公告)日：2016-06-23

申请号：US14910048

申请日：2014-07-03

Applicant: NITTO DENKO CORPORATION

Inventor： Naoyuki TANAKA ,  Yasuto ISHIMARU ,  Naoki SHIBATA ,  Yuichi TSUJITA

IPC: G02B6/42 ,  G02B6/13 ,  G02B6/122

CPC classification number: G02B6/4281 ,  G02B6/122 ,  G02B6/13 ,  G02B6/138 ,  G02B6/4214 ,  G02B6/4274 ,  G02B6/43

Abstract: An opto-electric hybrid module is provided which has a linear light-path core and an electric circuit including mounting pads and an electric circuit body provided on a surface of an under-cladding layer of an optical waveguide. An optical element is mounted with its electrodes in abutment against the mounting pads. The electric circuit body and a portion of the surface of the under-cladding layer other than a core formation portion and an electric circuit formation portion are covered with a stack including a core material layer and an over-cladding material layer. A surface portion of the stack present between the mounting pads and the electric circuit body is located at a lower height position than a surface portion of the stack present on the electric circuit body.

Abstract translation: 提供了一种光电混合模块，其具有线性光路芯和包括安装焊盘的电路和设置在光波导的下敷层的表面上的电路体。 光学元件安装有其电极邻接安装垫。 除了芯形成部分和电路形成部分之外，电路体和下包层的表面的一部分被包括芯材料层和上敷层材料层的叠层覆盖。 存在于安装焊盘和电路体之间的堆叠的表面部分位于比存在于电路主体上的堆叠的表面部分更低的高度位置处。

公开(公告)号：US20130243371A1

公开(公告)日：2013-09-19

申请号：US13775891

申请日：2013-02-25

Applicant: NITTO DENKO CORPORATION

Inventor： Yuichi TSUJITA ,  Yasuto ISHIMARU ,  Akihito MATSUTOMI ,  Naoyuki TANAKA ,  Yasufumi YAMAMOTO ,  Mayu OZAKI

IPC: G02B6/136

CPC classification number: G02B6/12004 ,  G02B6/136 ,  G02B6/138 ,  G02B6/4214 ,  G02B6/43

Abstract: An opto-electric hybrid board includes an electric circuit board, an optical waveguide, and a metal layer. The electric circuit board includes an insulative layer having front and back surfaces, and electrical interconnect lines formed on the front surface of the insulative layer. The optical waveguide includes a first cladding layer and cores, and the optical waveguide is formed on the back surface of the insulative layer of the electric circuit board. The metal layer is formed between the first cladding layer of the optical waveguide and the back surface of the insulative layer of the electric circuit board. Part of the opto-electric hybrid board is formed as a to-be-bent portion. The metal layer is partially removed in a portion corresponding to the to-be-bent portion. A first cladding layer of the optical waveguide fills a site where the metal layer is removed.

Abstract translation: 光电混合基板包括电路板，光波导和金属层。 电路板包括具有前表面和后表面的绝缘层，以及形成在绝缘层的前表面上的电互连线。 光波导包括第一包层和芯，并且光波导形成在电路板的绝缘层的背面上。 金属层形成在光波导的第一包层和电路板的绝缘层的背面之间。 光电混合板的一部分形成为弯曲部。 在对应于被弯曲部分的部分中部分去除金属层。 光波导的第一包层填充去除金属层的位置。

公开(公告)号：US20230341642A1

公开(公告)日：2023-10-26

申请号：US17788955

申请日：2020-12-23

Applicant: NITTO DENKO CORPORATION

Inventor： Naoyuki TANAKA ,  Seiki TERAJI ,  Koya OSUKA

IPC: G02B6/42

CPC classification number: G02B6/4293 ,  G02B6/4277 ,  G02B6/4283

Abstract: An opto-electric hybrid board that sequentially includes an optical waveguide and an electric circuit boardtoward one side in a thickness direction. The electric circuit boardincludes a metal supporting layer, an insulating base layerdisposed on a one-side surface in the thickness direction of the metal supporting layer, a plurality of conductive layers sequentially disposed at one side in the thickness direction, and an intermediate insulating layerdisposed between the conductive layers . At least one layer selected from the group consisting of the metal supporting layer and the conductive layers is electrically insulated from the other layers.

公开(公告)号：US20230100122A1

公开(公告)日：2023-03-30

申请号：US17913735

申请日：2021-03-25

Applicant: NITTO DENKO CORPORATION

Inventor： Naoyuki TANAKA ,  Koya OSUKA

IPC: G02B6/42

Abstract: Provided is a photoelectric conversion module plug that includes a photoelectric hybrid board, a circuit board, an optical connector, and a plug case that houses them. At least a part of the photoelectric hybrid board faces the circuit board. The plug case has a thickness T2 in a facing direction between the photoelectric hybrid board and the circuit board. The ratio of the thickness T1 of the optical connector with respect to the thickness T2 of the plug case is 30% or more. The plug case has side walls having uneven region portions respectively and at least a part of the optical connector is located between the uneven region portions. An optical cable according to the present invention includes the module plugs and an optical cable that optically connects between these module plugs.

公开(公告)号：US20230046449A1

公开(公告)日：2023-02-16

申请号：US17794143

申请日：2021-01-19

Applicant: NITTO DENKO CORPORATION

Inventor： Kazuaki SUZUKI ,  Naoyuki TANAKA ,  Naoto KONEGAWA

IPC: G02B6/42

Abstract: Provided is optical module as a photoelectric conversion module that includes a photoelectric hybrid board, a light-receiving/emitting element, a driving element, and a heat dissipating sheet. The light-receiving/emitting element and the driving element are mounted on one surface in a thickness direction of the photoelectric hybrid board. The heat dissipating sheet is in contact with the light-receiving/emitting element and the driving element from a side opposite to the photoelectric hybrid board. The driving element has a greater height above the photoelectric hybrid board than the light-receiving/emitting element.