公开(公告)号：US10510683B2

公开(公告)日：2019-12-17

申请号：US15718919

申请日：2017-09-28

Applicant: Tsinghua University ,  NUCTECH COMPANY LIMITED

Inventor： Wenjian Zhang ,  Qingjun Zhang ,  Yuanjing Li ,  Zhiqiang Chen ,  Ziran Zhao ,  Yinong Liu ,  Yaohong Liu ,  Xiang Zou ,  Huishao He ,  Shuwei Li ,  Nan Bai

IPC: H01L25/00 ,  H01L23/00 ,  H01L31/024 ,  H01L31/18 ,  H01L23/15 ,  H01L23/498 ,  H01L31/02 ,  H01L31/0203 ,  H01L27/146

Abstract: The present disclosure proposes a packaging structure for a metallic bonding based opto-electronic device and a manufacturing method thereof. According to the embodiments, the packaging structure for an opto-electronic device may comprise an opto-electronic chip and a packaging base. The opto-electronic chip comprises: a substrate having a first substrate surface and a second substrate surface opposite to each other; an opto-electronic device formed on the substrate; and electrodes for the opto-electronic device which are formed on the first substrate surface. The packaging base has a first base surface and a second base surface opposite to each other, and comprises conductive channels extending from the first base surface to the second base surface. The opto-electronic chip is stacked on the packaging base in such a manner that the first substrate surface faces the packaging base, and the electrodes formed on the first substrate surface of the opto-electronic chip are bonded with corresponding conductive channels in the packaging base.

公开(公告)号：US09983321B2

公开(公告)日：2018-05-29

申请号：US15258209

申请日：2016-09-07

Applicant: Nuctech Company Limited ,  TSINGHUA UNIVERSITY

Inventor： Qingjun Zhang ,  Yuanjing Li ,  Zhiqiang Chen ,  Ziran Zhao ,  Yinong Liu ,  Yaohong Liu ,  Xiang Zou ,  Huishao He ,  Shuwei Li ,  Jianping Chang ,  Wenjian Zhang

IPC: G01T7/00 ,  G01J1/02

CPC classification number: G01T7/00 ,  G01J1/0271 ,  G01J2001/0276

Abstract: The invention discloses a safety inspection detector and a goods safety inspection system. The safety inspection detector at least comprises a circuit board, a first housing, a second housing, a detection module and a connecting interface. The detection module and the connecting interface are mounted on the circuit board. The first housing is pressed and connected to a first surface of the circuit board, and the second housing is pressed and connected to a second surface of the circuit board. The first housing and the second housing can hermetically wrap the detection module and electronic devices on the circuit board, but bypass the connecting interface to realize leading-out and connection with related interconnected cables by utilizing the connecting interface. The housings can be used for sealing and protecting sensitive electronic devices in the detector, thus being moisture proof and preventing interference.