公开(公告)号：US12013284B2

公开(公告)日：2024-06-18

申请号：US18067066

申请日：2022-12-16

Applicant: SENSORTEK TECHNOLOGY CORP.

Inventor： Yu-Min Lin ,  Feng-Jung Hsu

IPC: G01J1/02 ,  G01J1/04

CPC classification number: G01J1/0271 ,  G01J1/0459 ,  G01J2001/0276 ,  G01J1/0474

Abstract: An optical sensor module and a packaging method thereof are disclosed, wherein the optical sensor module comprises a substrate having a light sensing element; and a housing made of a transparent material. The housing is connected to the substrate and covers the light sensing element. The housing has a light-receiving area facing the light sensing element, and the inner surface of the housing toward the substrate is provided with a light-shielding coating in a portion outside of the light-receiving area. In this way, optical components such as the light sensor can be effectively protected, and still retain the effect of avoiding noise light interference with the light sensor module.

公开(公告)号：US20240167870A1

公开(公告)日：2024-05-23

申请号：US18410646

申请日：2024-01-11

Applicant: OPHIR OPTRONICS SOLUTIONS LTD.

Inventor： Oleg ZINOVIEV ,  Karol SANILEVICI ,  Alexandr SUPERFIN

IPC: G01J1/42 ,  G01J1/02 ,  G01J1/04

CPC classification number: G01J1/4257 ,  G01J1/0271 ,  G01J1/0403 ,  G01J1/0407

Abstract: The present application discloses an apparatus and method configured to measure characteristics of high power beams of laser energy used in material processing. In one embodiment, the apparatus includes a housing having a first compartment and a second compartment separated from each other to reduce the transfer of thermal energy between them. Optical modules having optical sensors configured to measure characteristics of the high power beam are mounted in the first compartment. A removable and replaceable beam dump configured to absorb most of the high power beam is positioned in the second compartment. The removability/replaceability of the beam dump enables operation of the apparatus without active cooling of the beam dump assembly, simplifying the apparatus and protecting the optical sensors in the first compartment.

公开(公告)号：US11698297B2

公开(公告)日：2023-07-11

申请号：US17020733

申请日：2020-09-14

Applicant: BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.

Inventor： Chaoxi Chen

IPC: G01J1/42 ,  G01J1/02 ,  G06F1/16 ,  H05K5/00 ,  H04M1/02 ,  H04M1/72454 ,  G09G3/36 ,  G06F3/041

CPC classification number: G01J1/4204 ,  G01J1/0271 ,  G06F1/1647 ,  G06F1/1652 ,  G06F1/1677 ,  H04M1/0214 ,  H04M1/0241 ,  H04M1/0268 ,  H05K5/0017 ,  G06F1/1684 ,  G06F3/0416 ,  G09G3/36 ,  G09G2320/0626 ,  H04M1/72454 ,  H05K2201/05

Abstract: The present disclosure relates to a method and device for detecting ambient light, an electronic device and a storage medium. The electronic device includes: a first screen, the first screen being a foldable flexible screen; multiple light sensors, orientations of light sensing surfaces of the multiple light sensors being different; and at least one processor electronically connected with the first screen and the light sensors respectively and configured to select a target light sensor from the multiple light sensors according to a present state of the first screen and obtain target detection data representing present ambient brightness according to detection data of the target light sensor.

公开(公告)号：US20190133423A1

公开(公告)日：2019-05-09

申请号：US15804261

申请日：2017-11-06

Applicant: KARL STORZ Endovision, Inc.

Inventor： Dashiell Birnkrant ,  Naushad Kasim ,  Margus Lohk ,  Indrek-Toomas Polluks

IPC: A61B1/04 ,  G01J1/02 ,  G01J1/42 ,  G01J1/04

CPC classification number: A61B1/04 ,  A61B1/00096 ,  A61B1/0011 ,  A61B1/00188 ,  A61B1/051 ,  G01J1/0271 ,  G01J1/0477 ,  G01J1/42

Abstract: An image sensor module includes a circuit board, an image sensor, and a turning prism. The circuit board has first and second side sections each extending in a respective plane transverse to a plane of a center section to define a module interior volume. The image sensor has a bottom plane mounted on an inner face of the circuit board within the module interior volume. The turning prism has a mounting surface secured to a top plane of the image sensor. An electronic component arrangement is operatively mounted on the inner face of the circuit board between the image sensor and a circuit board rearward end. A number of wires providing power and data connections to the circuit board are operatively connected to contacts located on the circuit board in the interior volume between the electronic component arrangement and the circuit board rearward end.

公开(公告)号：US10060787B2

公开(公告)日：2018-08-28

申请号：US15398397

申请日：2017-01-04

Applicant: L'ORÉAL

Inventor： Guive Balooch ,  Rafal Pielak ,  Yunzhou Shi

IPC: G01J1/50 ,  G01J1/02 ,  G01J1/42 ,  G01J3/46

CPC classification number: G01J1/0233 ,  G01J1/0219 ,  G01J1/0238 ,  G01J1/0266 ,  G01J1/0271 ,  G01J1/029 ,  G01J1/4228 ,  G01J1/429 ,  G01J1/50 ,  G01J2001/0257 ,  G01J2001/0276 ,  G01J2001/428 ,  G01J2003/466

Abstract: A system is provided for determining personal ultra-violet (UV) radiation measurements, comprising: a measurement device configured to measure UV irradiation; and a terminal device configured to receive or capture an output of the measured UV irradiation from the measurement device and to determine a specific user's personal UV exposure risk level based on at least the measured sun irradiation and information of a skin type of the specific user. The measurement device configured to measure UV radiation exposure includes a surface that includes a plurality of different sections that each have a different sensitivity to UV radiation exposure, and each of the plurality of different sections are configured to display a different color in response to the UV radiation exposure.

公开(公告)号：US20180229579A1

公开(公告)日：2018-08-16

申请号：US15856903

申请日：2017-12-28

Applicant: Hyundai Motor Company ,  Kia Motors Corporation ,  Omron Automotive Electronic Korea Co., Ltd

Inventor： Kwang-Ok HAN ,  Yong-Chul Kim ,  Gyu-Suk Han ,  Kwang-Joon Han ,  Sang-Hyun Kim ,  Jang-Won Lee

IPC: B60H1/00 ,  G01J1/42

CPC classification number: B60H1/0075 ,  G01J1/0242 ,  G01J1/0271 ,  G01J1/4228 ,  G01J2001/4266

Abstract: A vehicle detector assembly for detecting solar radiation may include a housing, a fixed plate fixed to an upper surface of the housing in a flat form, a plurality of photo detectors bonded to a surface of the fixed plate, each being connected to a lead having a uniform one-directional inclination structure, and a detector cap fastened to the housing and transmitting sunlight.

公开(公告)号：US20180226514A1

公开(公告)日：2018-08-09

申请号：US15746342

申请日：2016-07-22

Applicant: ams AG

Inventor： Harald ETSCHMAIER ,  Gregor TOSCHKOFF ,  Thomas BODNER ,  Franz SCHRANK

IPC: H01L31/0203 ,  H01L31/02 ,  H01L23/00

CPC classification number: H01L31/0203 ,  G01J1/0204 ,  G01J1/0271 ,  G01J5/045 ,  H01L24/13 ,  H01L31/02005 ,  H01L31/02327 ,  H01L31/153 ,  H01L31/173 ,  H01L2224/13025

Abstract: A method of producing an optical sensor at wafer-level, comprising the steps of providing a wafer having a main top surface and a main back surface and arrange at or near the top surface of the wafer at least one first integrated circuit having at least one light sensitive component. Furthermore, providing in the wafer at least one through-substrate via for electrically contacting the top surface and back surface and forming a first mold structure by wafer-level molding a first mold material over the top surface of the wafer, such that the first mold structure at least partly encloses the first integrated circuit. Finally, forming a second mold structure by wafer-level molding a second mold material over the first mold structure, such that the second mold structure at least partly encloses the first mold structure.

公开(公告)号：US10012530B2

公开(公告)日：2018-07-03

申请号：US14212603

申请日：2014-03-14

Applicant: Gentex Corporation

Inventor： Luke W. Koops ,  Kristopher R. Green

IPC: G01J1/02 ,  B60S1/56

CPC classification number: G01J1/0252 ,  B60S1/56 ,  G01J1/0271

Abstract: A light sensing device for a vehicle. A housing defines a light sensor cavity and a lens cover. A light sensor is positioned in the light sensor cavity and is surrounded by a gasket assembly. A manifold is configured to receive and store a fluid. A first fluid dispensing assembly extends from the manifold through the gasket assembly. The first fluid dispensing assembly is juxtapositioned above the lens cover and is configured to trickle the fluid downwardly over the manifold at a predetermined flow rate. A second fluid dispensing assembly extends from the manifold through the gasket assembly. The second fluid dispensing assembly is juxtapositioned laterally adjacent to the lens cover and is configured to expel fluid that blows across the lens cover as the vehicle moves.

公开(公告)号：US20180180467A1

公开(公告)日：2018-06-28

申请号：US15389890

申请日：2016-12-23

Applicant: Ricardo Ordonez

Inventor： Ricardo Ordonez

IPC: G01J1/02 ,  G01J1/42 ,  F21V23/04

CPC classification number: F21V23/0464 ,  G01J1/0228 ,  G01J1/0271 ,  G01J1/0403

Abstract: A photocell cover, including a jacket that defines a jacket cavity and a jacket opening, that is operable to be used by the user at any time of day and in any level of ambient light. The invention achieves this object by providing a photocell cover to cover a photocell and its housing, blocking any ambient light from reaching the photocell, in order to provide an environment in which the photocell can be tested. The jacket cavity and jacket opening receive a housing of a photocell and simulate a low level of ambient light in the area surrounding the photocell in order to test the functionality of the photocell. The method of using the photocell cover allows the user to test the photocell during any time of day or night, including from a ground level position.

公开(公告)号：US20180164409A1

公开(公告)日：2018-06-14

申请号：US15882074

申请日：2018-01-29

Applicant: DAPA INC.

Inventor： TING-YI CHEN

IPC: G01S7/481 ,  G01J1/42 ,  G01S17/08 ,  G01J1/02 ,  H01L25/16 ,  H01L31/167 ,  H01L31/02

CPC classification number: G01S7/4813 ,  G01J1/02 ,  G01J1/0271 ,  G01J1/42 ,  G01J1/4204 ,  G01S7/4814 ,  G01S7/4816 ,  G01S17/023 ,  G01S17/026 ,  G01S17/08 ,  H01L24/48 ,  H01L25/16 ,  H01L25/165 ,  H01L25/167 ,  H01L31/02005 ,  H01L31/02019 ,  H01L31/0203 ,  H01L31/02325 ,  H01L31/167 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/1433

Abstract: A complex optical proximity sensor includes a substrate, a light emitter coupled to the substrate, an application-specific integrated circuit chip coupled to the substrate and embedded in a proximity sensor, a barrier disposed between the application-specific integrated circuit chip and the light emitter, and an ambient light detection chip manufactured in advance and then coupled to the application-specific integrated circuit chip thereon with a pre-determined height. The elements are disposed within a limited area of an aperture and, with a manufacturing method of the complex optical proximity sensor, the detection angle of the ambient light is thereby maximized and the detection angle of the proximity sensor is thereby minimized.