公开(公告)号：US20230066542A1

公开(公告)日：2023-03-02

申请号：US17404402

申请日：2021-08-17

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a peripheral cooling unit (PCU) is to be located at a periphery of a datacenter, so that it can suction air from a hot aisle that is between at least two rows of racks and can cool at least one part of such air using a primary coolant, with at least one part of cooled air to be circulated to such racks, and with a primary coolant to cool secondary coolant that is to be distributed to at least one cold plate.

公开(公告)号：US20220369514A1

公开(公告)日：2022-11-17

申请号：US17318837

申请日：2021-05-12

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, flow controllers are associated with cold plates and have direct and bypass ports, so that when direct ports are disabled for removal of a first cold plate, bypass ports are enabled to bypass a first cold plate and to enable a second cold plate to be continuously cooled by a datacenter cooling system.

公开(公告)号：US20220369510A1

公开(公告)日：2022-11-17

申请号：US17318797

申请日：2021-05-12

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a refrigerant distribution unit (RDU) distributes first refrigerant from a refrigerant reservoir to one or more cold plates to extract heat from at least one computing device and also interfaces between a first refrigerant cooling loop having a first refrigerant and a second refrigerant cooling loop, so that a second refrigerant cooling loop uses second refrigerant to dissipate at least part of such heat through a second condenser unit to an ambient environment.

公开(公告)号：US20220346284A1

公开(公告)日：2022-10-27

申请号：US17238362

申请日：2021-04-23

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20 ,  G06N3/04 ,  G06N3/08

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, one or more flow controllers is associated with a cold plate and with a thermosyphon condenser that is elevated with respect to a cold plate so that two-phase fluid is enabled for gravity-assisted downflow in a liquid phase to a cold plate for absorption of heat and is enabled for buoyancy-driven upflow through a riser tube into a thermosyphon condenser for dissipation of heat of at least one computing device.

公开(公告)号：US20220330458A1

公开(公告)日：2022-10-13

申请号：US17224890

申请日：2021-04-07

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20 ,  G05B15/02

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a cold plate is coupled to a condenser section of a heat pipe and to a primary computing device, with the heat pipe coupled to an auxiliary computing device at an evaporator section of the heat pipe, so that the cold plate draws heat from the primary computing device and from the heat pipe.

公开(公告)号：US20220256736A1

公开(公告)日：2022-08-11

申请号：US17729787

申请日：2022-04-26

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20

Abstract: A cold plate that is configurable and for a datacenter liquid cooling system is disclosed. The cold plate includes a first section, a second section, and an intermediate layer, which is changeable and has first channels to enable flow of a coolant through the intermediate layer, and has second channels or at least one adapted second channel to concentrate the coolant or the flow of the coolant to at least one area within the configurable cold plate corresponding to at least a heat generating feature of an associated computing device.

公开(公告)号：US20220256735A1

公开(公告)日：2022-08-11

申请号：US17729764

申请日：2022-04-26

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20

Abstract: A cold plate that is configurable and for a datacenter liquid cooling system is disclosed. The cold plate includes a first section, a second section, and an intermediate layer, which is changeable and has first channels to enable flow of a coolant through the intermediate layer, and has second channels or at least one adapted second channel to concentrate the coolant or the flow of the coolant to at least one area within the configurable cold plate corresponding to at least a heat generating feature of an associated computing device.

公开(公告)号：US20220232739A1

公开(公告)日：2022-07-21

申请号：US17154708

申请日：2021-01-21

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a cold plate has microchannels and a heat pipe to support a first fluid in an active mode of operation of a cold plate that uses microchannels, and to support a second fluid in a passive mode of operation of a cold plate that uses a heat pipe.

公开(公告)号：US20220210955A1

公开(公告)日：2022-06-30

申请号：US17138509

申请日：2020-12-30

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a modular unit is swappable or hot-swappable and has a heat exchanger, a variable speed fan, and at least one flow controller to pass fluid through microchannels of a cold plate, so that the fluid extracts heat from at least one computing device and so that fluid through a heat exchanger enables dissipation of heat by forced air from a variable speed fan.

公开(公告)号：US20220206547A1

公开(公告)日：2022-06-30

申请号：US17137661

申请日：2020-12-30

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: G06F1/20 ,  G06N3/04 ,  G05B19/416

Abstract: Systems and methods for cooling a computer environment are disclosed. In at least one embodiment, one or more neural networks can be used to adjust one or more flow control valves, of a liquid cooling system for a data center, to control a variation in liquid flow rate across the data center.