公开(公告)号：US20150303156A1

公开(公告)日：2015-10-22

申请号：US14255935

申请日：2014-04-17

Applicant: NXP B.V.

Inventor： Tonny Kamphuis ,  Jan Gulpen ,  Jan Willem Bergman

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/29

CPC classification number: H01L24/06 ,  H01L23/293 ,  H01L23/3114 ,  H01L23/49805 ,  H01L23/49838 ,  H01L2224/05005 ,  H01L2224/05012 ,  H01L2224/0612 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2224/45099

Abstract: Embodiments of a packaged semiconductor device with no leads are disclosed. One embodiment includes a semiconductor chip and a no leads package structure defining a boundary and having a bottom surface and includes three or more pads exposed at the bottom surface of the package structure. Each of the pads is located in a single inline row.

Abstract translation: 公开了没有引线的封装半导体器件的实施例。 一个实施例包括限定边界并具有底表面的半导体芯片和无引线封装结构，并且包括暴露在封装结构的底表面处的三个或更多个焊盘。 每个垫片都位于一个单列排列中。