公开(公告)号：US5196919A

公开(公告)日：1993-03-23

申请号：US623601

申请日：1990-12-07

申请人： Nobuaki Miyauchi ,  Hiroshi Yonemasu ,  Bakji Cho

发明人： Nobuaki Miyauchi ,  Hiroshi Yonemasu ,  Bakji Cho

IPC分类号： H01L21/48 ,  H01L21/52 ,  H01L23/00 ,  H01L23/04

CPC分类号： H01L23/564 ,  H01L21/4803 ,  H01L21/52 ,  H01L23/04 ,  H01L2924/0002 ,  H01L2924/09701

摘要： A protective shield is provided on the UV transparent window of a ceramic lid for a EPROM integrated circuit package so as to prevent accumulation of foreign particulate matter thereon during the manufacture of the package.

摘要翻译： 在用于EPROM集成电路封装的陶瓷盖的UV透明窗上设置防护罩，以防止在制造封装期间其上的异物颗粒物质的积聚。

公开(公告)号：US5137767A

公开(公告)日：1992-08-11

申请号：US574663

申请日：1990-08-29

申请人： Nobuaki Miyauchi ,  Hiroshi Yonemasu ,  Bakji Cho ,  Chong-Il Park

发明人： Nobuaki Miyauchi ,  Hiroshi Yonemasu ,  Bakji Cho ,  Chong-Il Park

IPC分类号： G11C16/18

CPC分类号： G11C16/18 ,  Y10T428/239 ,  Y10T428/24331 ,  Y10T428/24851 ,  Y10T428/24868 ,  Y10T428/30

摘要： A partially coated assembly structure and a method for making a ceramic lid for a hermetically sealed package for an EPROM circuit are disclosed. The assembly structure includes, in combination, a ceramic lid, a UV transparent lens, and two fixtures for supporting the lens in the lid. The two fixtures are coated with a non-lens wetting film in predetermined areas where contact is made between the fixtures and the lens, and between the fixtures and the lid. The UV transparent lens is hermetically sealed to the ceramic lid by firing the assembly structure. The assembly structure prevents the lens from attracting foreign particulate matter during firing, thereby leaving the surfaces of the lens clean. The method provides a ceramic lid having a UV transparent lens hermetically sealed thereto, which finds wide use in integrated circuit packages for high-density EPROM's because of the untainted surfaces of the lens.

摘要翻译： 公开了一种部分涂覆的组装结构和用于制造用于EPROM电路的密封封装的陶瓷盖的方法。 组合结构包括陶瓷盖，UV透明透镜和用于将透镜支撑在盖中的两个固定装置。 两个固定装置在固定装置和透镜之间以及固定装置和盖子之间接触的预定区域中涂覆非透镜润湿膜。 UV透明透镜通过烧结组装结构而密封在陶瓷盖上。 组装结构防止了镜头在烧制过程中吸引外来颗粒物，从而使透镜的表面清洁。 该方法提供了一种具有密封在其上的UV透明透镜的陶瓷盖，其由于透镜的未被保持的表面而被广泛用于高密度EPROM的集成电路封装中。