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11.发明授权Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other 有权微结构包括彼此机械相互连接的微结构波导元件和/或IC芯片公开(公告)号：US09306255B1
公开(公告)日：2016-04-05
申请号：US14211749
申请日：2014-03-14
Applicant: Nuvotronics, LLC
Inventor： Jean-Marc Rollin , J. Robert Reid , David Sherrer , Will Stacy , Ken Vanhille , J. Marcus Oliver , Tim Smith
CPC classification number: H01P11/001 , H01P1/045 , H01P3/00 , H01P3/06 , H01P5/02 , H01P5/107 , H05K1/00
Abstract: Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems.
Abstract translation: 用于互连的结构和方法以及芯片，组件和3D系统之间和之间的相关对齐和组装机制。
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12.发明申请公开(公告)号：US20160072171A1
公开(公告)日：2016-03-10
申请号：US14680345
申请日：2015-04-07
Applicant: NUVOTRONICS, LLC
Inventor： David Sherrer
IPC: H01P3/06
CPC classification number: H01P3/06 , H01P5/026 , H01P11/005 , Y10T29/49016 , Y10T29/49123
Abstract: Provided are coaxial transmission line microstructures formed by a sequential build process, and methods of forming such microstructures. The microstructures include a transition structure for transitioning between the coaxial transmission line and an electrical connector. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.
Abstract translation: 提供通过顺序构建工艺形成的同轴传输线微结构以及形成这种微结构的方法。 微结构包括用于在同轴传输线和电连接器之间转变的过渡结构。 微结构对于传输电磁能和其他电子信号的装置具有特别的适用性。
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