公开(公告)号：US20240312673A1

公开(公告)日：2024-09-19

申请号：US18676913

申请日：2024-05-29

申请人： SAMTEC, INC.

发明人： Shashi Chuganey ,  Yasuo Sasaki ,  Scott McMorrow ,  Francisco Noyola ,  Cindy Lee Diegel ,  James Alexander Moss

IPC分类号： H01B11/18 ,  H01B7/02 ,  H01B7/08 ,  H01B7/18 ,  H01B7/22 ,  H01B11/00 ,  H01B11/20 ,  H01P3/06 ,  H05K9/00

CPC分类号： H01B11/1821 ,  H01B7/02 ,  H01B7/0861 ,  H01B7/0892 ,  H01B7/1895 ,  H01B7/226 ,  H01B11/002 ,  H01B11/183 ,  H01B11/203 ,  H05K9/0098 ,  H01B7/187 ,  H01B7/188 ,  H01P3/06

摘要： Electrical cables and optical waveguides are disclosed as including an electrically insulative foam. The electrically insulative foam can coat at least one electrical conductor of the electrical cable. The electrically insulative foam can coat the optical fiber of the waveguide. The electrically insulative foam can also define a waveguide.

公开(公告)号：US20240235035A9

公开(公告)日：2024-07-11

申请号：US18278944

申请日：2021-02-26

申请人： TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)

发明人： Marthinus Da Silveira ,  Neil McGowan

IPC分类号： H01Q9/04 ,  H01P3/06 ,  H01Q21/06

CPC分类号： H01Q9/0485 ,  H01P3/06 ,  H01Q21/068

摘要： Embodiments of a radio frequency feedline structure. A first printed circuit board (PCB) includes upper and lower metal layers and at least one cutout defining an upper portion of an open channel. The upper and lower metal layers are electrically connected by vias on opposite walls of the cutout. A second PCB includes upper and lower metal layers and elongated slots defining a suspended signal path within the open channel. The upper and lower metal layers are electrically connected by vias. A third PCB includes upper and lower metal layers and at least one cutout defining a lower portion of the open channel. The upper and lower metal layers are electrically connected by vias on opposite walls of the cutout. Respective upper and lower ground planes are electrically connected to the upper metal layer of the first PCB and the lower metal layer of the third PCB.

公开(公告)号：US20240186671A1

公开(公告)日：2024-06-06

申请号：US18060746

申请日：2022-12-01

申请人： International Business Machines Corporation

发明人： Layne A. Berge ,  Matthew Doyle ,  Kyle Schoneck ,  Thomas W. Liang ,  John R. Dangler ,  Matthew A. Walther ,  Jason J. Bjorgaard ,  Trevor Timpane

IPC分类号： H01P1/20 ,  H01P3/06 ,  H01P11/00

CPC分类号： H01P1/20 ,  H01P3/06 ,  H01P11/005

摘要： One or more devices and/or methods provided herein relate to a method for fabricating a filtering electronic device having a co-integrated impedance modification element and signal transmission line. An electronic structure can comprise a signal transmission line, and an impedance modification element adjacent to and external to the signal transmission line, wherein the impedance modification element comprises a structure having differentiated sections, along the signal transmission line, that provide corresponding differentiated impedances. In an embodiment, the impedance modification element can comprise a plurality of impedance sub-elements spaced apart from one another along and adjacent to the signal transmission line to facilitate the different impedances.

公开(公告)号：US20240154288A1

公开(公告)日：2024-05-09

申请号：US18387400

申请日：2023-11-06

申请人： PPC BROADBAND, INC.

发明人： Daniel DAOUST ,  Jordan CAVINESS

IPC分类号： H01P3/06 ,  H01P1/02

CPC分类号： H01P3/06 ,  H01P1/022

摘要： An angled coaxial cable adapter may include a housing portion structurally configured to include a first RF signal wave receiving portion and a second RF signal wave receiving portion and a conductive portion structurally configured to pass an RF signal through the first RF signal wave receiving portion and the second RF signal wave receiving portion. The first RF signal wave receiving portion may be configured to be disposed at an angle relative to the second RF signal wave receiving portion, and the conductive portion may be structurally configured to include a bend. The RF signal wave blocking portion may be structurally configured to block the first RF signal wave and the second RF signal wave from interfering with one another so as to reduce potential noise when a signal changes direction at the bend of the conductive element such that the adapter can provide an enhanced RF signal.

公开(公告)号：US20240088537A1

公开(公告)日：2024-03-14

申请号：US17941250

申请日：2022-09-09

申请人： United States of America as represented by the Administrator of NASA

发明人： Manohar Deshpande ,  Eleanya Onuma

IPC分类号： H01P5/08 ,  H01P3/00 ,  H01P3/06

CPC分类号： H01P5/08 ,  H01P3/003 ,  H01P3/06

摘要： This application describes an apparatus and system for a Wide band end launcher to convert a signal in a coaxial line to a CPW line. The apparatus uses a transition zone which gradually tapers in two inclined planes from the coaxial line to the CPW line, connecting the central conductor of the coaxial line to the central conductor of the CPW line. In addition, the outer conductor of the coaxial line is connected to the ground plates of the CPW line. This allows for high bandwidth transfers between the two types of lines for accurate measurements and other purposes.

公开(公告)号：US20230291087A1

公开(公告)日：2023-09-14

申请号：US18158196

申请日：2023-01-23

申请人： Qorvo US, Inc.

发明人： John Kitt

IPC分类号： H01P5/16 ,  H01Q23/00 ,  H01P3/06 ,  H03F3/19

CPC分类号： H01P5/16 ,  H01Q23/00 ,  H01P3/06 ,  H03F3/19

摘要： Power-combining devices and, more particularly, antenna structures for spatial power-combining devices are disclosed. Spatial power-combining devices include amplifier assemblies with amplifiers and antenna structures supported by body structures. Body structures may include inner surfaces that are closer to a center axis of the spatial power-combining device where the inner surfaces have peripheral edges that are inset from remainders of the body structures. Antenna structures are disclosed that are arranged within inset portions such that the antenna structures are bounded on one end by the body structures. When assembled, a portion of a coaxial waveguide section that engages with the amplifier assemblies may bound opposing ends of the antenna structures. By not having body structures bound both ends of antenna structures, amplifier assembly design may be improved to allow smaller sizes for higher frequency operation along with improved manufacturability.

公开(公告)号：US20230215602A1

公开(公告)日：2023-07-06

申请号：US18182715

申请日：2023-03-13

申请人： SAMTEC, INC.

发明人： Shashi Chuganey ,  Yasuo Sasaki ,  Scott McMorrow ,  Francisco Noyola ,  Cindy Lee Diegel ,  James Alexander Moss

IPC分类号： H01B11/18 ,  H01B11/00 ,  H01B7/08 ,  H01B7/22 ,  H01B7/02 ,  H05K9/00 ,  H01B11/20 ,  H01B7/18 ,  H01P3/06

CPC分类号： H01B11/1821 ,  H01B11/002 ,  H01B7/0861 ,  H01B11/183 ,  H01B7/226 ,  H01B7/02 ,  H05K9/0098 ,  H01B7/0892 ,  H01B11/203 ,  H01B7/1895 ,  H01B7/188 ,  H01B7/187 ,  H01P3/06

摘要： Electrical cables and optical waveguides are disclosed as including an electrically insulative foam. The electrically insulative foam can coat at least one electrical conductor of the electrical cable. The electrically insulative foam can coat the optical fiber of the waveguide. The electrically insulative foam can also define a waveguide.

公开(公告)号：US20190044226A1

公开(公告)日：2019-02-07

申请号：US15760594

申请日：2016-09-15

申请人： CELLMAX TECHNOLOGIES AB

发明人： Niclas J. YMAN ,  Dan KARLSSON

IPC分类号： H01Q1/52 ,  H01Q3/36 ,  H01Q3/04 ,  H01Q3/00 ,  H01Q1/24 ,  H01Q21/00 ,  H01Q19/10

CPC分类号： H01Q21/0006 ,  H01P3/06 ,  H01P5/04 ,  H01Q1/246 ,  H01Q3/30 ,  H01Q21/08 ,  H01Q21/26

摘要： An antenna feeding network for a multi-radiator antenna. The feeding network comprises at least one substantially air filled coaxial line, each comprising a central inner conductor, an elongated outer conductor surrounding the central inner conductor, and an elongated rail element slideably movably arranged inside the outer conductor. The rail element is longitudinally movable in relation to at least the outer conductor.

公开(公告)号：US20190006745A1

公开(公告)日：2019-01-03

申请号：US15744542

申请日：2016-06-07

申请人： SHARP KABUSHIKI KAISHA

发明人： EIJI SUEMATSU ,  KEISUKE SATOH

IPC分类号： H01Q1/36 ,  H01P3/06 ,  H03H7/01 ,  H01Q9/04 ,  G01S7/03 ,  A61B5/05

CPC分类号： H01Q1/36 ,  A61B5/0507 ,  A61B5/11 ,  A61B2562/0228 ,  G01S7/032 ,  G01S13/50 ,  G01S2007/028 ,  H01P3/06 ,  H01Q1/2283 ,  H01Q9/045 ,  H01Q21/065 ,  H03H7/0153

摘要： An area and a size of a high frequency device are reduced. The high frequency device includes a first board (1) that has a first surface (1a) on which a circuit unit is formed and a second surface (1b) on which a ground conductor is formed, a second board (2) that has a third surface (2a) on which an antenna is formed and a fourth surface (2b) on which a second ground conductor is formed, and a conductor plate (3), in which the conductor plate (3) is sandwiched between the second surface (1b) and the fourth surface (2b).

公开(公告)号：US20180358675A1

公开(公告)日：2018-12-13

申请号：US15615984

申请日：2017-06-07

申请人： Raytheon Company

发明人： Christopher M. Laighton ,  Susan C. Trulli ,  Elicia K. Harper

IPC分类号： H01P3/00 ,  H01P3/02

CPC分类号： H01P3/006 ,  G02F1/2257 ,  H01P3/003 ,  H01P3/026 ,  H01P3/06

摘要： A microwave transmission line structure having a pair of ground strip conductors on a surface of a dielectric substrate structure. A signal strip conductor is disposed on the surface of the dielectric substrate structure between the pair of ground strip conductors. A solid dielectric layer is disposed over: the signal strip conductor; the upper surface of the dielectric substrate structure between sides of each one of the ground strip conductors; and the signal strip conductor. An electrically conductive shield member is disposed on the solid dielectric layer and on, and in direct contact with, upper surfaces of the pair of ground strip conductors. The structure is used on each one of a plurality of proximate microwave transmission lines formed on the substrate structure to electrically isolate the transmission line.