公开(公告)号：US12107636B2

公开(公告)日：2024-10-01

申请号：US17452258

申请日：2021-10-26

Applicant: Tennessee Technological University

Inventor： Charles W. Van Neste

IPC: H04B13/02 ,  H01P3/00 ,  H02J50/20

CPC classification number: H04B13/02 ,  H01P3/00 ,  H02J50/20

Abstract: A system for transmitting electrical signals through a terrestrial body, the terrestrial body having an upper surface, may include a transmitter. The transmitter may include a first electrode positioned proximate the upper surface of the terrestrial body and at least one second electrode positioned beneath the upper surface of the terrestrial body and spaced from the first electrode. The system may include a power source operable to supply power to the first electrode and the at least one second electrode. The system may include a receiver assembly spaced away from the transmitter. When power is supplied to the transmitter, the transmitter may be operable to propagate an electric non-linear wave signal through the terrestrial body. The receiver assembly may be operable to detect the electric non-linear wave signal.

公开(公告)号：US20240186223A1

公开(公告)日：2024-06-06

申请号：US18440915

申请日：2024-02-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shih-Wen LU

IPC: H01L23/495 ,  H01L23/06 ,  H01L23/538 ,  H01P3/00

CPC classification number: H01L23/49575 ,  H01L23/06 ,  H01L23/5384 ,  H01P3/00

Abstract: A semiconductor device package includes a substrate and a conductive lid. The conductive lid is disposed within the substrate. The conductive lid defines a waveguide having a cavity. The waveguide is configured to transmit a signal from a first electronic component to a second electronic component through the cavity.

公开(公告)号：US20240136812A1

公开(公告)日：2024-04-25

申请号：US17969552

申请日：2022-10-18

Applicant: QUALCOMM Incorporated

Inventor： Patrick ISAKANIAN ,  Srivatsan THIRUVENGADAM ,  Darius VALAEE

IPC: H02H9/04 ,  H01P3/00 ,  H03H7/00

CPC classification number: H02H9/046 ,  H01P3/00 ,  H03H7/00

Abstract: An integrated circuit (IC) including a first transceiver interface circuit extending longitudinally in a first direction substantially perpendicular to a second direction parallel to edge of the IC, wherein the first transceiver interface circuit comprises a first T-coil; and a second transceiver interface circuit extending longitudinally in the first direction, wherein the second transceiver interface circuit is staggered from the first transceiver interface circuit along the second direction, wherein the second transceiver interface circuit includes a second T-coil, and wherein the second T-coil is offset from the first T-coil along the first direction.

公开(公告)号：US11705612B2

公开(公告)日：2023-07-18

申请号：US17254823

申请日：2019-05-02

Applicant: Airbus Defence and Space Limited

Inventor： Arthur Bardinet ,  Richard Roberts ,  Stephen Mclaren

IPC: H01P3/127 ,  H01P3/00 ,  H01P1/207 ,  B64G1/66

CPC classification number: H01P3/127 ,  B64G1/66 ,  H01P1/207 ,  H01P3/00

Abstract: An elongate flexible waveguide section for radio frequency signals is provided, wherein the waveguide section is corrugated in the longitudinal direction, and the waveguide section is at least partially corrugated in a circumferential direction perpendicular to the longitudinal direction. Also provided is an apparatus for connecting a VHTS antenna system to a spacecraft.

公开(公告)号：US20190141833A1

公开(公告)日：2019-05-09

申请号：US16238586

申请日：2019-01-03

Applicant: AGC Inc.

Inventor： Tomoya HOSODA ,  Tatsuya TERADA

IPC: H05K1/03 ,  H05K1/02 ,  H05K1/11 ,  H05K3/42

CPC classification number: H05K1/0373 ,  H01P3/00 ,  H01Q1/38 ,  H05K1/024 ,  H05K1/0393 ,  H05K1/115 ,  H05K3/422 ,  H05K3/427 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0212 ,  H05K2203/072 ,  H05K2203/0776 ,  H05K2203/0779 ,  H05K2203/095

Abstract: To provide a wiring substrate having excellent transmission characteristics, of which initial failure of a plating layer formed on an inner wall surface of a hole is suppressed regardless of the type of the pre-treatment applied to the inner wall surface of the hole, and of which the plating layer has favorable heat resistance, and a process for producing it.A wiring substrate 10 comprising an electrical insulator layer 20, a first conductor layer 32 formed on a first surface of the electrical insulator layer 20, a second conductor layer 34 formed on a second surface of the electrical insulator layer 20, and a plating layer 42 provided on an inner wall surface of a hole 40 which opens from the first conductor layer 32 through the second conductor layer 34; wherein the electrical insulator layer 20 has a heat resistant resin layer 22 containing a heat resistant resin and a resin powder; the resin powder is formed from a resin material containing a melt-formable fluororesin having a functional group such as a carbonyl group-containing group; the content of the resin powder is from 5 to 70 mass % to the heat resistant resin layer 22; and the electrical insulator layer 20 has a dielectric constant of from 2.0 to 3.5.

公开(公告)号：US20190089154A1

公开(公告)日：2019-03-21

申请号：US16180296

申请日：2018-11-05

Applicant: CPG Technologies, LLC

Inventor： James F. Corum ,  Kenneth L. Corum ,  Joseph F. Pinzone ,  James D. Lilly

IPC: H02J3/00 ,  H01Q1/00 ,  H04B3/00 ,  H04B5/00 ,  H02J50/80 ,  H02J50/40 ,  H01P3/00 ,  H04B3/52 ,  H02J50/10

CPC classification number: H02J3/00 ,  H01P3/00 ,  H01Q1/00 ,  H02J17/00 ,  H02J50/10 ,  H02J50/40 ,  H02J50/80 ,  H04B3/00 ,  H04B3/52 ,  H04B5/00 ,  H04B5/0037

Abstract: Disclosed are various receive circuits by which to receive a plurality of guided surface waves transmitted by a plurality of guided surface waveguide probes over a surface of a terrestrial medium according to various embodiments.

公开(公告)号：US20180268676A1

公开(公告)日：2018-09-20

申请号：US15981064

申请日：2018-05-16

Applicant: CPG Technologies, LLC

Inventor： James F. Corum ,  Kenneth L. Corum ,  Basil F. Pinzone ,  Joseph F. Pinzone ,  Michael J. D'Aurelio

IPC: G08B21/02 ,  H04B3/52 ,  H04W4/90 ,  H02J50/80 ,  H04B3/54 ,  H01P3/00 ,  H02J50/10

CPC classification number: G08B21/02 ,  H01P3/00 ,  H02J50/10 ,  H02J50/80 ,  H04B3/52 ,  H04B3/54 ,  H04W4/90

Abstract: Disclosed is a system and method for disaster warning recovery including a power modulator. A location is determined for an area affected by an emergency event. An emergency message is generated that corresponds to the emergency event. The emergency message is transmitted by via a guided surface wave. The guided surface wave is launched by a guided surface waveguide probe. The power modulator is coupled to the guided surface waveguide probe.

公开(公告)号：US20180259399A1

公开(公告)日：2018-09-13

申请号：US15906002

申请日：2018-02-27

Applicant: CPG Technologies, LLC

Inventor： James F. Corum ,  Kenneth L. Corum ,  Jerry A. Lomax ,  James M. Salvitti, JR. ,  Philip V. Pesavento

IPC: G01K1/14 ,  H01Q9/34 ,  H02J50/20 ,  H03H7/38 ,  H01P3/00 ,  H01P5/00

CPC classification number: G01K1/14 ,  G01K11/32 ,  H01P3/00 ,  H01P5/00 ,  H01Q9/34 ,  H02J50/20 ,  H02J50/23 ,  H03H7/38

Abstract: Disclosed are various embodiments for providing temperature measurements of a guided surface wave probe and/or a support structure. In one embodiment, among others, a system comprises a guided surface waveguide probe configured to launch a guided surface wave along a lossy conducting medium, where the guided surface waveguide probe generates heat while in operation. The support structure comprises non-conducting structural components that support the electrical components of the guided surface waveguide probe. The system also comprises a temperature sensor positioned on one of the non-conducting structural components.

公开(公告)号：US10074885B2

公开(公告)日：2018-09-11

申请号：US15079614

申请日：2016-03-24

Applicant: Nuvotronics, INC

Inventor： David W. Sherrer ,  John J. Fisher

IPC: H01P3/06 ,  H01P5/18 ,  H01P1/08 ,  H01P5/103 ,  H01P11/00 ,  H05K1/02 ,  H01P3/00 ,  H05K3/46

CPC classification number: H01P3/06 ,  H01P1/08 ,  H01P3/00 ,  H01P5/103 ,  H01P5/183 ,  H01P11/002 ,  H01P11/003 ,  H01P11/005 ,  H05K1/0221 ,  H05K1/0272 ,  H05K3/4644 ,  H05K3/4685 ,  H05K2201/09809 ,  Y10T29/49117 ,  Y10T29/49123

Abstract: Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.

公开(公告)号：US20180090809A1

公开(公告)日：2018-03-29

申请号：US15567361

申请日：2016-04-18

Applicant: BIRD TECHNOLOGIES GROUP INC

Inventor： Timothy L. Holt

IPC: H01P5/08 ,  H01P5/18 ,  H01P5/107 ,  H01P3/00

CPC classification number: H01P5/085 ,  H01P3/00 ,  H01P5/103 ,  H01P5/107 ,  H01P5/18 ,  H01P5/184

Abstract: Disclosed is a capacitive non-directional coupler having a non-directional coupler printed circuit board (PCB) and a capacitive attenuator The non-directional coupler PCB includes a coupler section configured to carry energy travelling on a main transmission line. The non-directional coupler PCB and the capacitive attenuator are configured as a capacitive voltage divider, and provide a sample of the energy on the main transmission line. Also disclosed is a method for measuring for measuring RF power using an RF power sensor having the capacitive non-directional coupler that includes with the non-directional coupler printed circuit board and the capacitive attenuator. Also disclosed is an RF power metering system that includes an RF power sensor having the capacitive non-directional coupler.