公开(公告)号：US11527678B2

公开(公告)日：2022-12-13

申请号：US17072899

申请日：2020-10-16

Applicant: OSRAM OLED GmbH

Inventor： Christian Leirer ,  Korbinian Perzlmaier

IPC: H01L33/38 ,  H01L27/146 ,  H01L27/15 ,  H01L31/0224 ,  H01L31/0232 ,  H01L33/08 ,  H01L33/36 ,  H01L33/40

Abstract: An optoelectronic arrangement is specified, comprising a moulded body having a base surface, a first pixel group with a multiplicity of pixels assigned thereto, each having a first semiconductor region, a second semiconductor region and an active region, a multiplicity of separating structures arranged between the pixels, and at least one first contact structure having a first contact plane and a first contact location, which is freely accessible at the base surface, wherein the pixels of the first pixel group are arranged alongside one another at the top surface, the first semiconductor regions and/or the second semiconductor regions of adjacent pixels of the first pixel group are electrically insulated from one another by means of the separating structures, a first contact structure is assigned one-to-one to the first pixel group, and the first semiconductor regions of the pixels of the first pixel group are electrically conductively connected to one another by means of the first contact plane and are electrically contactable by means of the first contact location.

公开(公告)号：US10854783B2

公开(公告)日：2020-12-01

申请号：US15743606

申请日：2016-07-07

Applicant: OSRAM OLED GMBH

Inventor： Christian Leirer ,  Korbinian Perzlmaier

IPC: H01L33/38 ,  H01L33/08 ,  H01L27/146 ,  H01L27/15 ,  H01L31/0224 ,  H01L31/0232 ,  H01L33/36 ,  H01L33/40

Abstract: An optoelectronic arrangement is specified, comprising a moulded body (2) having a base surface (2b), a first pixel group (41) with a multiplicity of pixels (1) assigned thereto, each having a first semiconductor region (11), a second semiconductor region (12) and an active region (10), a multiplicity of separating structures (3) arranged between the pixels (1), and at least one first contact structure (51, 52, 53) having a first contact plane (51) and a first contact location (52), which is freely accessible at the base surface (2b), wherein the pixels (1) of the first pixel group (41) are arranged alongside one another at the top surface (2a), the first semiconductor regions (11) and/or the second semiconductor regions (12) of adjacent pixels (1) of the first pixel group (41) are electrically insulated from one another by means of the separating structures (3), a first contact structure (51, 52, 53) is assigned one-to-one to the first pixel group (41), and the first semiconductor regions (11) of the pixels (1) of the first pixel group (41) are electrically conductively connected to one another by means of the first contact plane (51) and are electrically contactable by means of the first contact location (52).