公开(公告)号：US10680135B2

公开(公告)日：2020-06-09

申请号：US15770334

申请日：2016-10-24

Applicant: OSRAM OLED GMBH

Inventor： Berthold Hahn ,  Korbinian Perzlmaier ,  Christian Leirer ,  Anna Kasprzak-Zablocka

IPC: H01L33/38 ,  H01L33/36 ,  H01L33/62 ,  H01L23/00 ,  H01L33/44

Abstract: The invention relates to an optoelectronic component (100) comprising a semiconductor layer sequence (1) having an active layer (10), wherein the active layer (10) is designed to produce or absorb electromagnetic radiation in intended operation. Furthermore, the component (100) comprises a first contact structure (11) and a second structure (12), by means of which the semiconductor layer sequence (1) can be electrically contacted in intended operation. In operation, a voltage is applied to the contact structures (11, 12), wherein an operation-related voltage difference ΔUbet between the contact structures (11, 12) arises. When the voltage difference is increased, a first arc-over occurs in or on the component (100) between the two contact structures (11, 12). A spark gap (3) between the contact structures (11, 12), which arises in the event of the first arc-over, passes predominantly through a surrounding medium in the form of gas or vacuum and/or through a potting. The first arc-over occurs at a voltage difference of 2·ΔUbet at the earliest.

公开(公告)号：US10665757B2

公开(公告)日：2020-05-26

申请号：US16331558

申请日：2017-08-28

Applicant: OSRAM OLED GmbH

Inventor： Korbinian Perzlmaier

IPC: H01L33/46 ,  G09F13/22 ,  H01L33/20 ,  H01L33/22 ,  H01L33/38 ,  H01L33/44 ,  H01L33/58 ,  H01L33/62 ,  G09F13/04 ,  H01L33/24

Abstract: A component includes a carrier, a semiconductor body and a mirror layer located therebetween, wherein the semiconductor body includes an active layer configured to generate light during operation of the component, the component has a main surface that illuminates during operation, wherein luminous areas of the main surface represent visually detectable information as a pictogram, in a plan view of the main surface, the pictogram has a contour at least partially defined by a contour of the mirror layer, and in a plan view of the main surface, the component has an outline different from the contour of the pictogram.

公开(公告)号：US11855245B2

公开(公告)日：2023-12-26

申请号：US17275675

申请日：2019-09-12

Applicant: Osram OLED GmbH

Inventor： Korbinian Perzlmaier ,  Alexander F. Pfeuffer ,  Kerstin Neveling

IPC: H01L33/62 ,  H01L33/38

CPC classification number: H01L33/62 ,  H01L33/382

Abstract: An optoelectronic semiconductor element may include an optoelectronic semiconductor chip. The optoelectronic semiconductor chip may include a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, a first contact element connected to the first semiconductor layer in an electrically conductive manner, and a second contact element connected to the second semiconductor layer in an electrically conductive manner. The first semiconductor layer and the second semiconductor layer are arranged one above the other to form a layer stack. The first semiconductor layer to where the second semiconductor layer is exposed. The first contact element is arranged over the first semiconductor layer, and the second contact element is arranged over the first semiconductor layer.

公开(公告)号：US11437540B2

公开(公告)日：2022-09-06

申请号：US17148208

申请日：2021-01-13

Applicant: OSRAM OLED GmbH

Inventor： Isabel Otto ,  Korbinian Perzlmaier

IPC: H01L33/00 ,  H01L27/15 ,  H01L33/62 ,  H01L33/40 ,  H01L33/64

Abstract: A component includes a carrier and a semiconductor body arranged on the carrier, wherein the semiconductor body includes a semiconductor layer facing away from the carrier, a further semiconductor layer facing the carrier and an optically active layer located therebetween, the carrier has a metallic carrier layer that is contiguous and mechanically stabilizes the component, the carrier includes a mirror layer disposed between the semiconductor body and the metallic carrier layer, the carrier has a compensating layer directly adjacent to the metallic carrier layer and is configured to compensate for internal mechanical strains in the component, and the compensating layer is arranged between the semiconductor body and the metallic carrier layer.

公开(公告)号：US20210336110A1

公开(公告)日：2021-10-28

申请号：US17273459

申请日：2019-09-10

Applicant: OSRAM OLED GmbH

Inventor： Christian Eichinger ,  Korbinian Perzlmaier

IPC: H01L33/62 ,  H01L33/00 ,  H01L31/02 ,  H01L31/18

Abstract: An optoelectronic semiconductor device includes a support element having a first main surface, an optoelectronic semiconductor chip which is arranged over the support element and adjacent to the first main surface, and an electrical contact element for contacting the optoelectronic semiconductor chip. The electric contact element is arranged in an opening formed in the first main surface of the support element.

公开(公告)号：US20210135046A1

公开(公告)日：2021-05-06

申请号：US17148208

申请日：2021-01-13

Applicant: OSRAM OLED GmbH

Inventor： Isabel Otto ,  Korbinian Perzlmaier

IPC: H01L33/00 ,  H01L27/15 ,  H01L33/62 ,  H01L33/40

Abstract: A component includes a carrier and a semiconductor body arranged on the carrier, wherein the semiconductor body includes a semiconductor layer facing away from the carrier, a further semiconductor layer facing the carrier and an optically active layer located therebetween, the carrier has a metallic carrier layer that is contiguous and mechanically stabilizes the component, the carrier includes a mirror layer disposed between the semiconductor body and the metallic carrier layer, the carrier has a compensating layer directly adjacent to the metallic carrier layer and is configured to compensate for internal mechanical strains in the component, and the compensating layer is arranged between the semiconductor body and the metallic carrier layer.

公开(公告)号：US20210043806A1

公开(公告)日：2021-02-11

申请号：US16964219

申请日：2019-01-15

Applicant: OSRAM OLED GmbH

Inventor： Korbinian Perzlmaier ,  Stefan ILLEK

IPC: H01L33/46 ,  H01L33/56

Abstract: A radiation-emitting semiconductor chip may include a semiconductor body, a reflector, at least one cavity, and a seal. The semiconductor body may include an active region configured to generate electronic radiation. The reflector may be configured to reflect a portion of the electromagnetic radiation. The cavity may be filled with a material having a refractive index not exceeding 1.1. The seal may be impermeable to the material. The cavity may be arranged between the reflector and the semiconductor body, and the seal may cover the underside of the reflector.

公开(公告)号：US10763406B2

公开(公告)日：2020-09-01

申请号：US15760209

申请日：2016-09-14

Applicant: OSRAM OLED GMBH

Inventor： Korbinian Perzlmaier ,  Christian Leirer

IPC: H01L29/08 ,  H01L33/00 ,  H01L31/0203 ,  H01L21/00 ,  H01L51/40 ,  H01L33/54 ,  H01L33/48 ,  H01L33/50 ,  H01L33/62 ,  H01L33/44 ,  H01L21/56 ,  H01L33/60 ,  H01L33/46 ,  H01L33/56

Abstract: The invention relates to a semiconductor component comprising: a semiconductor chip (10) which has a semiconductor body (1) with an active region (12) and a substrate (3) with a first conductor body (31), a second conductor body (32) and a first moulded body (33); and a second moulded body (5); wherein the second moulded body (5) completely surrounds the semiconductor chip (10) in lateral directions (L), the semiconductor chip (10) extends all the way through the second moulded body (5) in a vertical direction (V), at least some parts of an upper side and a lower side of the semiconductor chip (10) are not covered by the second moulded body (5), the substrate (3) is mechanically connected to the semiconductor body (2), the active region (12) is connected to the first conductor body (31) and the second conductor body (32) in an electroconductive manner, and the second moulded body (5) is directly adjacent to the substrate (3) and the semiconductor body (1).

公开(公告)号：US10727052B2

公开(公告)日：2020-07-28

申请号：US16240142

申请日：2019-01-04

Applicant: OSRAM OLED GmbH

Inventor： Tobias Gotschke ,  Jürgen Off ,  Korbinian Perzlmaier

IPC: H01L27/32 ,  H01L21/02 ,  H01L33/00 ,  C30B25/04 ,  C30B25/18 ,  C30B29/40 ,  H01L21/78 ,  H01L33/22 ,  H01L33/32

Abstract: A semiconductor chip is disclosed. In an embodiment a semiconductor chip includes a multiply-connected mask layer comprising openings, the openings completely penetrate the mask layer and a semiconductor layer sequence, which, at least in places, is in direct contact with the mask layer, wherein the semiconductor layer sequence is disposed on the mask layer, wherein the mask layer comprises a light-transmissive material, and wherein the light-transmissive material comprises an optical refractive index for light which is smaller than a refractive index of the semiconductor layer sequence.

公开(公告)号：US11894493B2

公开(公告)日：2024-02-06

申请号：US16964219

申请日：2019-01-15

Applicant: OSRAM OLED GmbH

Inventor： Korbinian Perzlmaier ,  Stefan Illek

IPC: H01L33/46 ,  H01L33/56 ,  H01L33/48

CPC classification number: H01L33/465 ,  H01L33/56 ,  H01L33/486

Abstract: A radiation-emitting semiconductor chip may include a semiconductor body, a reflector, at least one cavity, and a seal. The semiconductor body may include an active region configured to generate electronic radiation. The reflector may be configured to reflect a portion of the electromagnetic radiation. The cavity may be filled with a material having a refractive index not exceeding 1.1. The seal may be impermeable to the material. The cavity may be arranged between the reflector and the semiconductor body, and the seal may cover the underside of the reflector.