公开(公告)号：US20240314972A1

公开(公告)日：2024-09-19

申请号：US18588745

申请日：2024-02-27

申请人： OVH

发明人： Mohamad HNAYNO ,  Ali CHEHADE

IPC分类号： H05K7/20

CPC分类号： H05K7/20236 ,  H05K7/20263 ,  H05K7/20272 ,  H05K7/20781

摘要： A rack assembly including a cooling module for liquid-to-liquid cooling, a rack and an immersion cooling (IC) rack. The rack includes a rack cooling block that cools a rack electronic processing assembly and a rack fluid conduit that circulates a first cooling fluid through the rack cooling block and the cooling module. The IC rack includes a dielectric IC fluid, an IC cooling block immersed in the dielectric IC fluid for cooling an IC electronic processing assembly when the IC electronic processing assembly is placed in contact with the IC cooling block and an IC fluid conduit that circulates a second cooling fluid through the IC cooling block and the cooling module. The rack and the IC rack are thermally connected via the cooling module such that thermal energy can be transferred between the IC fluid conduit and the rack fluid conduit within the cooling module.

公开(公告)号：US20240074103A1

公开(公告)日：2024-02-29

申请号：US18236033

申请日：2023-08-21

申请人： OVH

发明人： Mohamad HNAYNO ,  Ali CHEHADE ,  Henryk KLABA

IPC分类号： H05K7/20

CPC分类号： H05K7/20272 ,  H05K7/20236 ,  H05K7/20772

摘要： A cooling assembly and method for cooling a plurality of heat-generating components. The cooling assembly includes a main liquid inlet for receiving a heat-transfer liquid, a main liquid outlet for discharging the heat-transfer liquid and a plurality of liquid cooling units. Each liquid cooling unit is in thermal contact with a corresponding heat-generating component and includes an internal liquid conduit, the heat-transfer liquid flowing in the internal liquid conduit collecting thermal energy from the corresponding heat-generating component. The liquid cooling units are arranged in a plurality of groups, each group comprising one or more liquid cooling units fluidly connected in parallel to one another. The groups are arranged in at least one cluster, each cluster comprising two or more groups fluidly connected in series.

公开(公告)号：US20240064933A1

公开(公告)日：2024-02-22

申请号：US18233922

申请日：2023-08-15

申请人： OVH

发明人： Mohamad HNAYNO ,  Ali CHEHADE ,  Henryk KLABA

IPC分类号： H05K7/20 ,  G01M3/32

CPC分类号： H05K7/20272 ,  H05K7/20236 ,  G01M3/3245 ,  G08B21/182

摘要： A fluid leakage deflection arrangement for a liquid-cooled rack-mounted electronic processing assembly and a method for deflecting fluid leakages in a liquid-cooled rack-mounted electronic processing assembly are disclosed. The fluid leakage deflection arrangement comprises an immersion case containing a first cooling liquid in which an electronic device of the rack-mounted electronic processing assembly is at least partially submerged therein; and a deflection unit configured to prevent the electronic device from being in contact with a leaking liquid distinct from the first cooling liquid by diverting leaking liquid away from the electronic components.

公开(公告)号：US20240032247A1

公开(公告)日：2024-01-25

申请号：US18373567

申请日：2023-09-27

申请人： OVH

发明人： Ali CHEHADE ,  Mohamad HNAYNO

IPC分类号： H05K7/20

CPC分类号： H05K7/203 ,  H05K7/20327 ,  H05K7/20336

摘要： An autonomous immersive cooling container configured to cool at least one electronic device is described. The autonomous immersive cooling container includes a container, having sidewalls, that contains a dielectric immersion cooling liquid, the at least one electronic device being, at least in part, immersed in the dielectric immersion cooling liquid. The autonomous immersive cooling container further includes a plurality of cooling structures disposed at non-perpendicular angles on the sidewalls, the plurality of cooling structures configured to transfer heat from an interior of the container to exterior air such that no additional cooling subsystem is used to cool the dielectric immersion cooling liquid.

公开(公告)号：US20220322573A1

公开(公告)日：2022-10-06

申请号：US17698480

申请日：2022-03-18

申请人： OVH

发明人： Ali CHEHADE ,  Mohamad HNAYNO ,  Henryk KLABA

IPC分类号： H05K7/20

摘要： A cooling device mountable on an electronic component comprising: a body having an internal fluid conduit for allowing a heat-transfer fluid to flow therethrough. The body comprises a first surface configured for mounting on the electronic component and permitting thermal transfer therethrough; a second surface; at least one side wall extending between the first surface and the second surface; and a gasket extending along the at least one side wall or a perimeter of the first surface, the gasket configured to extend away from the body beyond the first surface in a direction transverse thereto, to fluidly insulate the first surface when the first surface is mounted on the electronic component and submerged in the immersion cooling liquid in use.

公开(公告)号：US20220279680A1

公开(公告)日：2022-09-01

申请号：US17677185

申请日：2022-02-22

申请人： OVH

发明人： Ali CHEHADE ,  Mohamad HNAYNO ,  Louis GENELLE

IPC分类号： H05K7/20

摘要： A mesh panel for a heat exchanger system is provided. The mesh panel comprises a mesh body extending from an upper end to a lower end, the mesh body having an inlet side and an outlet side opposite the inlet side. The mesh body comprises a plurality of mesh wires arranged to form a mesh pattern defining a plurality of mesh openings between the mesh wires, and at least one penetrating mesh portion extending at least partly along a depth direction of the mesh body, the depth direction being normal to a plane extending between the upper and lower ends of the mesh body, the at least one penetrating mesh portion at least partly defining an air flow opening, the air flow opening having greater dimensions than each of the mesh openings.