公开(公告)号：US20160260760A1

公开(公告)日：2016-09-08

申请号：US14639610

申请日：2015-03-05

Applicant: OmniVision Technologies, Inc.

Inventor： Chun-Sheng Fan ,  Wei-Feng Lin

IPC: H01L27/146

CPC classification number: H01L27/14618 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/14698 ,  H01L2224/11 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

Abstract: An aerogel-encapsulated image sensor includes a device die with an image sensor fabricated thereon and an aerogel layer that encapsulates the image sensor. A method for encapsulating image sensor pixel arrays of respective bare image sensors formed on a sensor array sheet may include injecting an uncured aerogel portion on each image sensor pixel array, and curing each uncured aerogel portion. The step of curing may include at least one of (a) super-critical drying, (b) surface-modification drying, and (c) pinhole drying an uncured aerogel portion. The method may further include singulating the sensor array sheet into a plurality of aerogel-encapsulated image sensors. A method for encapsulating image sensor pixel arrays of respective bare image sensors on a device wafer may include forming an aerogel layer on each bare image sensor. The step of forming may include at least one of spin-coating, dip-coating, and spray-coating the aerogel layer.

Abstract translation: 气凝胶封装的图像传感器包括其上制造有图像传感器的器件裸片和封装图像传感器的气凝胶层。 封装形成在传感器阵列片上的各个裸图像传感器的图像传感器像素阵列的方法可以包括在每个图像传感器像素阵列上注入未固化的气凝胶部分，并固化每个未固化的气凝胶部分。 固化步骤可以包括（a）超临界干燥，（b）表面改性干燥和（c）针孔干燥未固化的气凝胶部分中的至少一种。 该方法还可以包括将传感器阵列片分成多个气凝胶封装的图像传感器。 将各个裸影像传感器的图像传感器像素阵列封装在器件晶片上的方法可包括在每个裸影像传感器上形成气凝胶层。 形成步骤可以包括旋涂，浸涂和喷涂气凝胶层中的至少一个。

公开(公告)号：US20150331305A1

公开(公告)日：2015-11-19

申请号：US14278452

申请日：2014-05-15

Applicant: OmniVision Technologies, Inc.

Inventor： Chun-Sheng Fan

IPC: G03B21/20 ,  H01L25/16 ,  H01L25/00 ,  G02B27/01

CPC classification number: G02B27/26 ,  G02B13/0085 ,  G02B13/16 ,  G02B27/0172 ,  G02B2027/0178 ,  G03B21/006 ,  G03B21/2066 ,  G03B21/2073 ,  H01L25/167 ,  H01L25/50 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A wafer-level liquid-crystal-on-silicon (LCOS) projection assembly includes a LCOS display for spatially modulating light incident on the LCOS display and a polarizing beam-separating (PBS) layer for directing light to and from the LCOS display. A method for fabricating a LCOS projection system includes disposing a PBS wafer above an active-matrix wafer. The active-matrix wafer includes a plurality of active matrices for addressing liquid crystal display pixels. The method, further includes disposing a lens wafer above the PBS wafer. The lens wafer includes a plurality of lenses. Additionally, a method for fabricating a wafer-level polarizing beam includes bonding a PBS wafer and at least one other wafer to form a stacked wafer. The PBS wafer includes a PBS layer that contains a plurality of PBS film bands.

Abstract translation: 晶圆级液晶硅（LCOS）投影组件包括用于空间调制入射在LCOS显示器上的光的LCOS显示器和用于将光引导到LCOS显示器的偏振光束分离（PBS）层。 制造LCOS投影系统的方法包括在有源矩阵晶片上设置PBS晶片。 有源矩阵晶片包括用于寻址液晶显示像素的多个有源矩阵。 该方法还包括在PBS晶片上设置透镜晶片。 透镜晶片包括多个透镜。 另外，制造晶片级偏振光束的方法包括将PBS晶片和至少一个其它晶片接合以形成堆叠的晶片。 PBS晶片包括含有多个PBS膜带的PBS层。

公开(公告)号：US11187933B2

公开(公告)日：2021-11-30

申请号：US16057950

申请日：2018-08-08

Applicant: OmniVision Technologies, Inc.

Inventor： Pei-Wen Ko ,  Chun-Sheng Fan

IPC: G02F1/1335 ,  G02F1/1337 ,  G02F1/1339 ,  G02F1/136

Abstract: A LCOS display panel comprises a silicon substrate, a pixel structure on the silicon substrate, a first and a second PI (polyimide) layers, a LC (liquid crystal) layer between the first and the second PI layers, wherein the second PI layer is disposed on the pixel structure, and the LC layer is disposed on the second PI layer, a glass substrate, an ITO (indium tin oxide) layer, a dam sealing a perimeter of the LCOS display panel to enclose the LC layer within the dam, wherein the dam is disposed between the first and second PI layers, and holds the silicon substrate and the glass substrate together, and a UV (ultra violet) cut filter in an active area of the LCOS display panel, wherein the active area of the LCOS display panel includes the LC layer and the pixel structure.

公开(公告)号：US11164900B2

公开(公告)日：2021-11-02

申请号：US16154544

申请日：2018-10-08

Applicant: OmniVision Technologies, Inc.

Inventor： Chun-Sheng Fan

IPC: H01L31/0203 ,  H01L27/146 ,  H01L23/00

Abstract: An image sensor chip-scale package includes a pixel array, a cover glass covering the pixel array, a dam, and an adhesive layer. The pixel array is embedded in a substrate top-surface of a semiconductor substrate. The semiconductor substrate includes a plurality of conductive pads in a peripheral region of the semiconductor substrate surrounding the pixel array. The dam at least partially surrounds the pixel array and is located (i) between the cover glass and the semiconductor substrate, and (ii) on a region of the substrate top-surface between the pixel array and the plurality of conductive pads. The adhesive layer is (i) located between the cover glass and the semiconductor substrate, (ii) at least partially surrounding the dam, and (iii) configured to adhere the cover glass to the semiconductor substrate.

公开(公告)号：US11114483B2

公开(公告)日：2021-09-07

申请号：US16100835

申请日：2018-08-10

Applicant: OmniVision Technologies, Inc.

Inventor： Chien-Chan Yeh ,  Ying-Chih Kuo ,  Wei-Feng Lin ,  Chun-Sheng Fan

IPC: H01L27/146 ,  G02F1/133 ,  G02F1/1335

Abstract: A cavityless chip-scale image-sensor package includes a substrate, a microlens array, and a low-index layer. The substrate includes a plurality of pixels forming a pixel array. The microlens array includes a plurality of microlenses each (i) having a lens refractive index, (ii) being aligned to a respective one of the plurality of pixels and (iii) having a non-planar microlens surfaces facing away from the respective one of the plurality of pixels. The low-index layer has a first refractive index less than the lens refractive index. The low-index layer also includes a bottom surface, at least part of which is conformal to each non-planar microlens surface. The microlens array is between the pixel array and the low-index layer.

公开(公告)号：US11075239B2

公开(公告)日：2021-07-27

申请号：US16816683

申请日：2020-03-12

Applicant: OmniVision Technologies, Inc.

Inventor： Chun-Sheng Fan ,  Chen-Wei Tsai ,  Wei-Feng Lin

IPC: H01L27/146

Abstract: An optical element comprising a transparent substrate and an anti-reflective coating, wherein the anti-reflective coating further comprises at least a transparent, high refractive index layer and a transparent, low refractive index layer, wherein the high refractive index layer is in contact with the low refractive index layer; and wherein the high refractive index layer is situated at an interface between the anti-reflective coating and air. Further, the low refractive index layer may be silicon oxide; the high refractive index layer may be tantalum oxide or silicon nitride.

公开(公告)号：US10998361B2

公开(公告)日：2021-05-04

申请号：US16139019

申请日：2018-09-22

Applicant: OmniVision Technologies, Inc.

Inventor： Wei-Feng Lin ,  Chun-Sheng Fan

IPC: H01L27/146 ,  H01L23/15

Abstract: An image-sensor package includes a cover glass, an image sensor, and an integrated circuit. The cover glass has a cover-glass bottom surface, to which the image sensor is bonded. The integrated circuit is beneath the cover-glass bottom surface, adjacent to the image sensor, and electronically connected to the image sensor. A method for packaging an image sensor includes attaching an image sensor to a cover-glass bottom surface of a cover glass, a light-sensing region of the image sensor facing the cover-glass bottom surface. The method also includes attaching an integrated circuit to the cover-glass bottom surface, a top IC-surface of the integrated circuit facing the cover-glass bottom surface.

公开(公告)号：US10313642B2

公开(公告)日：2019-06-04

申请号：US15408724

申请日：2017-01-18

Applicant: OmniVision Technologies, Inc.

Inventor： Chun-Sheng Fan

IPC: H04N9/07 ,  H04N3/14 ,  H04N5/335 ,  H04N9/097 ,  H04N5/225 ,  G02B27/10 ,  G02B13/00 ,  H04M1/02

Abstract: An imaging system for capturing an image of an object comprises a first lens, a dichroic beam splitter, which transmits light of a color band and reflects light of all colors outside the color band, a first image sensor for capturing an image formed by the transmitted light in the color band, a second image sensor for capturing an image formed by the reflected light outside the color band. The first image sensor is a monochrome image sensor and the second image sensor is a color image sensor having a color filter array disposed on pixels of the second image sensor. The image captured by the first image sensor and the image captured by the second image sensor are combined to form a single color image.

公开(公告)号：US10256266B2

公开(公告)日：2019-04-09

申请号：US15480131

申请日：2017-04-05

Applicant: OmniVision Technologies, Inc.

Inventor： Chen-Wei Tsai ,  Chun-Sheng Fan ,  Wei-Feng Lin

IPC: H01L27/146 ,  H04N5/369

Abstract: A chip-scale image sensor package includes a semiconductor substrate, a transparent substrate, a thin film, and a plurality of conductive pads. The semiconductor substrate has (i) a pixel array, and (ii) a peripheral region surrounding the pixel array. The transparent substrate covers the pixel array, has a bottom substrate surface proximate the pixel array, and a top substrate surface opposite the bottom substrate surface. The thin film is on a region of the top substrate surface directly above both (i) the entire pixel array and (ii) a portion of the peripheral region adjacent to the pixel array. Each of the plurality of conductive pads is located within the peripheral region, and is electrically connected to the pixel array. A portion of each of the plurality of conductive pads is not directly beneath the thin film.

公开(公告)号：US20190086708A1

公开(公告)日：2019-03-21

申请号：US15707988

申请日：2017-09-18

Applicant: OmniVision Technologies, Inc.

Inventor： Chun-Sheng Fan

IPC: G02F1/1345 ,  G02F1/1343

Abstract: A method of forming an electrical connection in a liquid crystal on silicon (LCOS) device, comprising: providing a silicon substrate including a first surface and a second surface, wherein the silicon substrate includes an conductive pad at the first surface; providing a cover glass panel that includes a cover glass, a transparent electrode layer formed upon the cover glass, and a first sealing material layer formed upon the transparent electrode layer; forming a second sealing material layer upon the first surface of the silicon substrate, wherein the second sealing material layer covers the conductive pad; forming a display layer, comprising a liquid crystal portion, a first seal portion, and a second seal portion, upon the second sealing material layer; wherein the first seal portion and the second seal portion are situated to form a space between them; and wherein the space is situated on top of the conductive pad; placing the cover glass panel upon the display layer, wherein the first sealing material layer is placed directly in contact with the display layer; singulating the cover glass panel, the display layer, and the silicon substrate, through the space between the first seal portion and the second seal portion, wherein the first seal portion is separated from the second seal portion; subsequently dispensing a conductive adhesive to the cover glass panel and the silicon substrate, wherein the conductive adhesive forms an electrical connection between transparent electrode layer and the conductive pad.