公开(公告)号：US07610950B2

公开(公告)日：2009-11-03

申请号：US11557917

申请日：2006-11-08

申请人： Jun Cao ,  Zhan Wu ,  Shi-Wen Zhou

发明人： Jun Cao ,  Zhan Wu ,  Shi-Wen Zhou

IPC分类号： H01L23/427 ,  F28D15/02

CPC分类号： H01L23/467 ,  F28D15/0275 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a first base plate (10), a fin group (30) arranged on the first base plate, a first heat pipe (50) attached on the first base plate and the fin group and a second heat pipe (60) attached on the first base plate and extending across the fin group. Each of the first and second heat pipes includes an absorbing section and a dissipating section. The absorbing sections of the first and second heat pipes are L-shaped and oriented in opposite directions and dissipating sections of the first and second heat pipes are oriented perpendicular to each other, whereby heat from the first base plate attached with an electronic component can take more different dissipating-paths from the first base plate to the fin group.

摘要翻译： 一种散热装置，包括第一基板（10），布置在第一基板上的翅片组（30），安装在第一基板和翅片组上的第一热管（50）和第二热管 ）连接在第一基板上并延伸穿过翅片组。 第一和第二热管中的每一个包括吸收部分和消散部分。 第一和第二热管的吸收部分为L形并且在相反方向上定向，并且第一和第二热管的散热部分彼此垂直取向，由此附接有电子部件的第一基板的热量可以 从第一基板到散热片组的更多不同的散热路径。

公开(公告)号：US20080105411A1

公开(公告)日：2008-05-08

申请号：US11557917

申请日：2006-11-08

申请人： Jun Cao ,  Zhan Wu ,  Shi-Wen Zhou

发明人： Jun Cao ,  Zhan Wu ,  Shi-Wen Zhou

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  F28D15/0275 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a first base plate (10), a fin group (30) arranged on the first base plate, a first heat pipe (50) attached on the first base plate and the fin group and a second heat pipe (60) attached on the first base plate and extending across the fin group. Each of the first and second heat pipes includes an absorbing section and a dissipating section. The absorbing sections of the first and second heat pipes are L-shaped and oriented in opposite directions and dissipating sections of the first and second heat pipes are oriented perpendicular to each other, whereby heat from the first base plate attached with an electronic component can take more different dissipating-paths from the first base plate to the fin group.

摘要翻译： 一种散热装置，包括第一基板（10），布置在第一基板上的翅片组（30），安装在第一基板和翅片组上的第一热管（50）和第二热管 ）连接在第一基板上并延伸穿过翅片组。 第一和第二热管中的每一个包括吸收部分和消散部分。 第一和第二热管的吸收部分为L形并且在相反方向上定向，并且第一和第二热管的散热部分彼此垂直取向，由此附接有电子部件的第一基板的热量可以 从第一基板到散热片组的更多不同的散热路径。

公开(公告)号：US07518874B2

公开(公告)日：2009-04-14

申请号：US11837458

申请日：2007-08-10

申请人： Jie-Cheng Deng ,  Jun Cao ,  Shi-Wen Zhou

发明人： Jie-Cheng Deng ,  Jun Cao ,  Shi-Wen Zhou

IPC分类号： H05K7/20 ,  H01L23/36

CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  Y10T24/44026 ,  H01L2924/00

摘要： A heat sink assembly includes a heat sink and a clip assembly received in the heat sink. The clip assembly comprises a clip and a movable fastener pivotally connected to the clip via a pair of supporters. Each supporter defines a pivot hole deviated from a center thereof and a retaining slot above the pivot hole. The clip comprises a main body received in the heat sink and two arms extending from the main body and pivotally received in the retaining slots of the supporters. The movable fastener pivotally extends in the pivot holes of the supporters. The movable fastener moves relative to the heat sink and causes rotation of the supporters in a matter such that a distance from the main body of the clip to a bottom of the heat sink is changed, whereby the clip assembly can provide adjustable spring force acting on the heat sink.

摘要翻译： 散热器组件包括散热器和容纳在散热器中的夹子组件。 夹子组件包括夹子和通过一对支撑件枢转地连接到夹子的可移动紧固件。 每个支撑件限定了从其中心偏离的枢轴孔和在枢转孔上方的保持槽。 夹子包括容纳在散热器中的主体和从主体延伸并枢转地容纳在支撑件的保持槽中的两个臂。 可动紧固件在支撑件的枢轴孔中枢转地延伸。 可移动的紧固件相对于散热器移动并引起支撑件的旋转，使得从夹子的主体到散热器的底部的距离改变，由此夹子组件可以提供作用在 散热器。

公开(公告)号：US08296947B2

公开(公告)日：2012-10-30

申请号：US12506213

申请日：2009-07-20

申请人： Peng Liu ,  Guo Chen ,  Shi-Wen Zhou ,  Chun-Chi Chen

发明人： Peng Liu ,  Guo Chen ,  Shi-Wen Zhou ,  Chun-Chi Chen

IPC分类号： B21D53/02 ,  H05K7/20

CPC分类号： B21D53/085 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

摘要： A heat sink includes a base with a plurality of recesses defined therein, a plurality of columned fins each having a head and a body extending from the head, and a cover joining with the base. Each head is received in and higher than a corresponding recess of the base. The heads are sandwiched between the cover and the base, whereby the columned fins are secured on the base. A portion of the cover contacting the head of each of the columned fins protrudes to form a deformed part. A method of manufacturing the heat sink is also disclosed.

摘要翻译： 散热器包括：基部，其具有限定在其中的多个凹部;多个柱状散热片，各自具有从头部延伸的头部和主体;以及与基部接合的盖。 每个头部被接收在基座的相应凹部中并且高于基座的相应凹部。 头部被夹在盖和基座之间，由此将柱状翅片固定在基座上。 接触每个柱状翅片的头部的盖的一部分突出以形成变形部分。 还公开了一种制造散热器的方法。

公开(公告)号：US08220527B2

公开(公告)日：2012-07-17

申请号：US12056295

申请日：2008-03-27

申请人： Peng Liu ,  Shi-Wen Zhou ,  Chun-Chi Chen ,  Yi-Jiun Li

发明人： Peng Liu ,  Shi-Wen Zhou ,  Chun-Chi Chen ,  Yi-Jiun Li

IPC分类号： F28D15/02

CPC分类号： F28D15/0233

摘要： A heat dissipation device includes a heat spreader for thermally engaging with a heat generating electronic device, a heat sink assembly located above the heat spreader, and first and second heat pipes connecting with the heat spreader and the heat sink assembly. Each of the first and second heat pipes comprises an evaporation section engaged in the heat spreader, two arc-shaped condensation sections thermally inserted in the heat sink assembly, and two connecting sections interconnecting corresponding condensation sections and the evaporation section. The condensation sections are coplanar with each other and located in a same circle. The condensation sections of the first heat pipe extend in a clockwise direction, while the condensation sections of the second heat pipe extend in an anticlockwise direction.

摘要翻译： 散热装置包括用于与发热电子设备热接合的散热器，位于散热器上方的散热器组件，以及与散热器和散热器组件连接的第一和第二热管。 第一和第二热管中的每一个包括接合在散热器中的蒸发部分，热插入散热器组件中的两个弧形冷凝部分和互连相应的冷凝部分和蒸发部分的两个连接部分。 冷凝段彼此共面并且位于同一个圆中。 第一热管的冷凝部沿顺时针方向延伸，第二热管的冷凝部沿逆时针方向延伸。

公开(公告)号：US07493940B2

公开(公告)日：2009-02-24

申请号：US11309841

申请日：2006-10-10

申请人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Guo Chen ,  Li He ,  Peng Liu

发明人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Guo Chen ,  Li He ,  Peng Liu

IPC分类号： F24H3/02 ,  F28F9/00 ,  H05K7/20

CPC分类号： H01L23/467 ,  H01L23/4006 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device (100) includes a heat sink (10) having a plurality of fins (14) and a plurality of mounting brackets (20) buckled with the fins of the heat sink. Each of the mounting brackets includes a mounting plate (22) mounted on a top of the heat sink and a baffle plate (26) extending from one side of the mounting plate to a bottom of the heat sink. The baffle plate terminates with a retaining plate (28). A plurality of fasteners (50) extends through the retaining plates to mount the heat dissipation device onto a printed circuit board. Self-tapping screws (40) are used to extend through the fan and the mounting plates of the mounting brackets and threadedly engage with the fins thereby mounting the fan on the heat sink.

摘要翻译： 散热装置（100）包括散热片（10），散热片（10）具有多个散热片（14）和多个与散热片的翅片相互扣合的安装支架（20）。 每个安装支架包括安装在散热器顶部的安装板（22）和从安装板的一侧延伸到散热器底部的挡板（26）。 挡板终止于保持板（28）。 多个紧固件（50）延伸穿过保持板以将散热装置安装到印刷电路板上。 自攻螺钉（40）用于延伸通过风扇和安装支架的安装板，并与翅片螺纹接合，从而将风扇安装在散热器上。

公开(公告)号：US08341842B2

公开(公告)日：2013-01-01

申请号：US12537267

申请日：2009-08-07

申请人： Guo Chen ,  Peng Liu ,  Shi-Wen Zhou ,  Chun-Chi Chen

发明人： Guo Chen ,  Peng Liu ,  Shi-Wen Zhou ,  Chun-Chi Chen

IPC分类号： B21D53/00

CPC分类号： H01L21/4882 ,  H01L23/3672 ,  H01L23/3677 ,  H01L2924/0002 ,  Y10T29/4935 ,  Y10T29/49368 ,  H01L2924/00

摘要： A method of manufacturing a heat sink includes, firstly, providing a plurality of fins each having a head and a body extending from the head, providing a base having a plurality of studs protruding from a top surface thereof, and providing a cover defining a plurality of recesses in a bottom thereof for receiving the heads of the fins and a plurality of orfices for receiving the studs. Next, the cover and the base are pressed to sandwich the heads of the fins therebetween. Then the studs of the base are punched to expand the studs and cause the studs to intimately engage with the cover.

摘要翻译： 一种制造散热片的方法，首先是提供多个翅片，每个翅片均具有从头部延伸的头部和主体，提供具有从其顶表面突出的多个螺柱的基座，以及提供限定多个 的底部中的凹部用于接收翅片的头部和用于接收螺栓的多个凸起部。 接下来，按压盖和基座以将翅片的头部夹在其间。 然后冲压底座的螺栓以扩展螺柱，并使螺柱与盖子紧密接合。

公开(公告)号：US07589967B2

公开(公告)日：2009-09-15

申请号：US11566025

申请日：2006-12-01

申请人： Shi-Wen Zhou ,  Guo Chen ,  Peng Liu ,  Chun-Chi Chen

发明人： Shi-Wen Zhou ,  Guo Chen ,  Peng Liu ,  Chun-Chi Chen

IPC分类号： H05K7/20 ,  F28F7/00 ,  H01L23/34

CPC分类号： H01L23/467 ,  H01L23/4006 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a heat sink (10) for contacting a heat-generating component and a fan (20) mounted to the heat sink. The fan includes a frame (22) and a motor (24) received in the frame. The fan has an intake. The frame has a top level and a bottom level. An airflow is generated by the fan and flows through the heat sink. An anti-backflow plate (30) is mounted between the top level and the bottom level of the fan. The anti-backflow plate extends outwardly and beyond an extremity of the heat sink to prevent the airflow flowing through the heat sink from entering the intake of the fan.

摘要翻译： 散热装置包括用于接触发热部件的散热器（10）和安装在散热器上的风扇（20）。 风扇包括框架（22）和接收在框架中的电动机（24）。 风扇有摄入量。 框架具有顶层和底层。 风扇产生气流并流过散热器。 防回流板（30）安装在风扇的顶部和底部水平面之间。 防回流板向外延伸超过散热器的末端，以防止流过散热器的气流进入风扇的入口。

公开(公告)号：US07451806B2

公开(公告)日：2008-11-18

申请号：US11309305

申请日：2006-07-24

申请人： Shi-Wen Zhou ,  Peng Liu ,  Chun-Chi Chen

发明人： Shi-Wen Zhou ,  Peng Liu ,  Chun-Chi Chen

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  F28D15/0266 ,  F28D15/0275 ,  F28F1/32 ,  H01L23/3672 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device is for contacting with a heat generating electronic device to remove heat from the electronic device. The heat dissipation device includes a base for thermally engaging with the electronic device and a plurality of fins arranged on a face of the base. A first heat pipe is located between the base and the fins, and is sinuously positioned on the face of the base. The first heat pipe has a first section located at a central portion of the base and a plurality of second sections located at lateral portions of the base. At least a second heat pipe has a first section thermally positioned to the base, and a second section extending remotely from the base and thermally engaging with the fins.

摘要翻译： 散热装置用于与发热电子装置接触以从电子装置移除热量。 散热装置包括用于与电子设备热接合的基座和布置在基座的表面上的多个翅片。 第一热管位于基座和翅片之间，并且被精确地定位在基座的表面上。 第一热管具有位于基部的中心部分处的第一部分和位于基部的侧部的多个第二部分。 至少第二热管具有热定位到基部的第一部分，以及从基部远程延伸并与翅片热接合的第二部分。

公开(公告)号：US20080017351A1

公开(公告)日：2008-01-24

申请号：US11309305

申请日：2006-07-24

申请人： Shi-Wen Zhou ,  Peng Liu ,  Chun-Chi Chen

发明人： Shi-Wen Zhou ,  Peng Liu ,  Chun-Chi Chen

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  F28D15/0266 ,  F28D15/0275 ,  F28F1/32 ,  H01L23/3672 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device is for contacting with a heat generating electronic device to remove heat from the electronic device. The heat dissipation device includes a base for thermally engaging with the electronic device and a plurality of fins arranged on a face of the base. A first heat pipe is located between the base and the fins, and is sinuously positioned on the face of the base. The first heat pipe has a first section located at a central portion of the base and a plurality of second sections located at lateral portions of the base. At least a second heat pipe has a first section thermally positioned to the base, and a second section extending remotely from the base and thermally engaging with the fins.

摘要翻译： 散热装置用于与发热电子装置接触以从电子装置移除热量。 散热装置包括用于与电子设备热接合的基座和布置在基座的表面上的多个翅片。 第一热管位于基座和翅片之间，并且被精确地定位在基座的表面上。 第一热管具有位于基部的中心部分处的第一部分和位于基部的侧部的多个第二部分。 至少第二热管具有热定位到基部的第一部分，以及从基部远程延伸并与翅片热接合的第二部分。