公开(公告)号：US08296947B2

公开(公告)日：2012-10-30

申请号：US12506213

申请日：2009-07-20

申请人： Peng Liu ,  Guo Chen ,  Shi-Wen Zhou ,  Chun-Chi Chen

发明人： Peng Liu ,  Guo Chen ,  Shi-Wen Zhou ,  Chun-Chi Chen

IPC分类号： B21D53/02 ,  H05K7/20

CPC分类号： B21D53/085 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

摘要： A heat sink includes a base with a plurality of recesses defined therein, a plurality of columned fins each having a head and a body extending from the head, and a cover joining with the base. Each head is received in and higher than a corresponding recess of the base. The heads are sandwiched between the cover and the base, whereby the columned fins are secured on the base. A portion of the cover contacting the head of each of the columned fins protrudes to form a deformed part. A method of manufacturing the heat sink is also disclosed.

摘要翻译： 散热器包括：基部，其具有限定在其中的多个凹部;多个柱状散热片，各自具有从头部延伸的头部和主体;以及与基部接合的盖。 每个头部被接收在基座的相应凹部中并且高于基座的相应凹部。 头部被夹在盖和基座之间，由此将柱状翅片固定在基座上。 接触每个柱状翅片的头部的盖的一部分突出以形成变形部分。 还公开了一种制造散热器的方法。

公开(公告)号：US07493940B2

公开(公告)日：2009-02-24

申请号：US11309841

申请日：2006-10-10

申请人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Guo Chen ,  Li He ,  Peng Liu

发明人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Guo Chen ,  Li He ,  Peng Liu

IPC分类号： F24H3/02 ,  F28F9/00 ,  H05K7/20

CPC分类号： H01L23/467 ,  H01L23/4006 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device (100) includes a heat sink (10) having a plurality of fins (14) and a plurality of mounting brackets (20) buckled with the fins of the heat sink. Each of the mounting brackets includes a mounting plate (22) mounted on a top of the heat sink and a baffle plate (26) extending from one side of the mounting plate to a bottom of the heat sink. The baffle plate terminates with a retaining plate (28). A plurality of fasteners (50) extends through the retaining plates to mount the heat dissipation device onto a printed circuit board. Self-tapping screws (40) are used to extend through the fan and the mounting plates of the mounting brackets and threadedly engage with the fins thereby mounting the fan on the heat sink.

摘要翻译： 散热装置（100）包括散热片（10），散热片（10）具有多个散热片（14）和多个与散热片的翅片相互扣合的安装支架（20）。 每个安装支架包括安装在散热器顶部的安装板（22）和从安装板的一侧延伸到散热器底部的挡板（26）。 挡板终止于保持板（28）。 多个紧固件（50）延伸穿过保持板以将散热装置安装到印刷电路板上。 自攻螺钉（40）用于延伸通过风扇和安装支架的安装板，并与翅片螺纹接合，从而将风扇安装在散热器上。

公开(公告)号：US08341842B2

公开(公告)日：2013-01-01

申请号：US12537267

申请日：2009-08-07

申请人： Guo Chen ,  Peng Liu ,  Shi-Wen Zhou ,  Chun-Chi Chen

发明人： Guo Chen ,  Peng Liu ,  Shi-Wen Zhou ,  Chun-Chi Chen

IPC分类号： B21D53/00

CPC分类号： H01L21/4882 ,  H01L23/3672 ,  H01L23/3677 ,  H01L2924/0002 ,  Y10T29/4935 ,  Y10T29/49368 ,  H01L2924/00

摘要： A method of manufacturing a heat sink includes, firstly, providing a plurality of fins each having a head and a body extending from the head, providing a base having a plurality of studs protruding from a top surface thereof, and providing a cover defining a plurality of recesses in a bottom thereof for receiving the heads of the fins and a plurality of orfices for receiving the studs. Next, the cover and the base are pressed to sandwich the heads of the fins therebetween. Then the studs of the base are punched to expand the studs and cause the studs to intimately engage with the cover.

摘要翻译： 一种制造散热片的方法，首先是提供多个翅片，每个翅片均具有从头部延伸的头部和主体，提供具有从其顶表面突出的多个螺柱的基座，以及提供限定多个 的底部中的凹部用于接收翅片的头部和用于接收螺栓的多个凸起部。 接下来，按压盖和基座以将翅片的头部夹在其间。 然后冲压底座的螺栓以扩展螺柱，并使螺柱与盖子紧密接合。

公开(公告)号：US07589967B2

公开(公告)日：2009-09-15

申请号：US11566025

申请日：2006-12-01

申请人： Shi-Wen Zhou ,  Guo Chen ,  Peng Liu ,  Chun-Chi Chen

发明人： Shi-Wen Zhou ,  Guo Chen ,  Peng Liu ,  Chun-Chi Chen

IPC分类号： H05K7/20 ,  F28F7/00 ,  H01L23/34

CPC分类号： H01L23/467 ,  H01L23/4006 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a heat sink (10) for contacting a heat-generating component and a fan (20) mounted to the heat sink. The fan includes a frame (22) and a motor (24) received in the frame. The fan has an intake. The frame has a top level and a bottom level. An airflow is generated by the fan and flows through the heat sink. An anti-backflow plate (30) is mounted between the top level and the bottom level of the fan. The anti-backflow plate extends outwardly and beyond an extremity of the heat sink to prevent the airflow flowing through the heat sink from entering the intake of the fan.

摘要翻译： 散热装置包括用于接触发热部件的散热器（10）和安装在散热器上的风扇（20）。 风扇包括框架（22）和接收在框架中的电动机（24）。 风扇有摄入量。 框架具有顶层和底层。 风扇产生气流并流过散热器。 防回流板（30）安装在风扇的顶部和底部水平面之间。 防回流板向外延伸超过散热器的末端，以防止流过散热器的气流进入风扇的入口。

公开(公告)号：US07870889B2

公开(公告)日：2011-01-18

申请号：US11752902

申请日：2007-05-23

申请人： Shi-Wen Zhou ,  Guo Chen ,  Peng Liu ,  Chun-Chi Chen

发明人： Shi-Wen Zhou ,  Guo Chen ,  Peng Liu ,  Chun-Chi Chen

IPC分类号： F28F7/00 ,  H05K7/20

CPC分类号： F28D15/0233 ,  F28D1/0472 ,  F28F1/20 ,  H01L23/367 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device comprises a radiator comprising a collar, a core received in the collar and a helical heat pipe embedded in a circumferential face of the core. The collar has a receiving hole and a plurality of fins extending radially and outwardly from an outer face of the collar. The core together with the heat pipe is received in the receiving hole of the radiator. The core has a flat bottom face and a top face opposite to the bottom face. The heat pipe is located between the radiator and the core and thermally contacts the collar of the radiator and the core. The heat pipe extends from the bottom face of the core to the top face of the core, and has a flattened bottom face coplanar with the bottom face of the core for contacting with an electronic device.

摘要翻译： 散热装置包括散热器，其包括套环，容纳在轴环中的芯和嵌入在芯的圆周面中的螺旋形热管。 套环具有接收孔和从轴环的外表面径向向外延伸的多个翅片。 核心与热管一起被接收在散热器的接收孔中。 芯具有平坦的底面和与底面相对的顶面。 热管位于散热器和芯之间，并与散热器和芯体的轴颈热接触。 热管从芯的底面延伸到芯的顶面，并且具有与芯的底面共面的扁平底面，用于与电子装置接触。

公开(公告)号：US20080130228A1

公开(公告)日：2008-06-05

申请号：US11566025

申请日：2006-12-01

申请人： Shi-Wen Zhou ,  Guo Chen ,  Peng Liu ,  Chun-Chi Chen

发明人： Shi-Wen Zhou ,  Guo Chen ,  Peng Liu ,  Chun-Chi Chen

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  H01L23/4006 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a heat sink (10) for contacting a heat-generating component and a fan (20) mounted to the heat sink. The fan includes a frame (22) and a motor (24) received in the frame. The fan has an intake. The frame has a top level and a bottom level. An airflow is generated by the fan and flows through the heat sink. An anti-backflow plate (30) is mounted between the top level and the bottom level of the fan. The anti-backflow plate extends outwardly and beyond an extremity of the heat sink to prevent the airflow flowing through the heat sink from entering the intake of the fan.

摘要翻译： 散热装置包括用于接触发热部件的散热器（10）和安装在散热器上的风扇（20）。 风扇包括框架（22）和接收在框架中的电动机（24）。 风扇有摄入量。 框架具有顶层和底层。 风扇产生气流并流过散热器。 防回流板（30）安装在风扇的顶部和底部水平面之间。 防回流板向外延伸超过散热器的末端，以防止流过散热器的气流进入风扇的入口。

公开(公告)号：US07898809B2

公开(公告)日：2011-03-01

申请号：US12252373

申请日：2008-10-16

申请人： Yi-Jiun Li ,  Peng Liu ,  Shi-Wen Zhou ,  Chun-Chi Chen

发明人： Yi-Jiun Li ,  Peng Liu ,  Shi-Wen Zhou ,  Chun-Chi Chen

IPC分类号： H05K7/20

CPC分类号： H01L23/3677 ,  H01L21/4882 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10T29/4935 ,  H01L2924/00

摘要： A heat sink includes a base plate and a plurality of cylindrical pins extending upwardly from the base plate. The cylindrical pins each include an upper dissipating portion, a lower mounting portion, and an engaging portion between the dissipating portion and the mounting portion. The mounting portion is interferentially fitted in a lower part of a corresponding aperture of the base plate. The engaging portion has a diameter smaller than that of the mounting portion. The engaging portion is cramped by an interior wall of the base plate defining an upper part of the corresponding aperture of the base plate by punching an upper surface of the base plate downwardly at a rim of the corresponding aperture.

摘要翻译： 散热器包括基板和从基板向上延伸的多个圆柱形销。 圆柱销每个包括上消散部分，下安装部分和消散部分和安装部分之间的接合部分。 安装部分周向地装配在基板的相应孔的下部中。 接合部的直径小于安装部的直径。 接合部分被基板的内壁夹住，通过在对应的孔的边缘处向下冲压基板的上表面来限定基板的相应孔的上部。

公开(公告)号：US08220527B2

公开(公告)日：2012-07-17

申请号：US12056295

申请日：2008-03-27

申请人： Peng Liu ,  Shi-Wen Zhou ,  Chun-Chi Chen ,  Yi-Jiun Li

发明人： Peng Liu ,  Shi-Wen Zhou ,  Chun-Chi Chen ,  Yi-Jiun Li

IPC分类号： F28D15/02

CPC分类号： F28D15/0233

摘要： A heat dissipation device includes a heat spreader for thermally engaging with a heat generating electronic device, a heat sink assembly located above the heat spreader, and first and second heat pipes connecting with the heat spreader and the heat sink assembly. Each of the first and second heat pipes comprises an evaporation section engaged in the heat spreader, two arc-shaped condensation sections thermally inserted in the heat sink assembly, and two connecting sections interconnecting corresponding condensation sections and the evaporation section. The condensation sections are coplanar with each other and located in a same circle. The condensation sections of the first heat pipe extend in a clockwise direction, while the condensation sections of the second heat pipe extend in an anticlockwise direction.

摘要翻译： 散热装置包括用于与发热电子设备热接合的散热器，位于散热器上方的散热器组件，以及与散热器和散热器组件连接的第一和第二热管。 第一和第二热管中的每一个包括接合在散热器中的蒸发部分，热插入散热器组件中的两个弧形冷凝部分和互连相应的冷凝部分和蒸发部分的两个连接部分。 冷凝段彼此共面并且位于同一个圆中。 第一热管的冷凝部沿顺时针方向延伸，第二热管的冷凝部沿逆时针方向延伸。

公开(公告)号：US07451806B2

公开(公告)日：2008-11-18

申请号：US11309305

申请日：2006-07-24

申请人： Shi-Wen Zhou ,  Peng Liu ,  Chun-Chi Chen

发明人： Shi-Wen Zhou ,  Peng Liu ,  Chun-Chi Chen

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  F28D15/0266 ,  F28D15/0275 ,  F28F1/32 ,  H01L23/3672 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device is for contacting with a heat generating electronic device to remove heat from the electronic device. The heat dissipation device includes a base for thermally engaging with the electronic device and a plurality of fins arranged on a face of the base. A first heat pipe is located between the base and the fins, and is sinuously positioned on the face of the base. The first heat pipe has a first section located at a central portion of the base and a plurality of second sections located at lateral portions of the base. At least a second heat pipe has a first section thermally positioned to the base, and a second section extending remotely from the base and thermally engaging with the fins.

摘要翻译： 散热装置用于与发热电子装置接触以从电子装置移除热量。 散热装置包括用于与电子设备热接合的基座和布置在基座的表面上的多个翅片。 第一热管位于基座和翅片之间，并且被精确地定位在基座的表面上。 第一热管具有位于基部的中心部分处的第一部分和位于基部的侧部的多个第二部分。 至少第二热管具有热定位到基部的第一部分，以及从基部远程延伸并与翅片热接合的第二部分。

公开(公告)号：US20080017351A1

公开(公告)日：2008-01-24

申请号：US11309305

申请日：2006-07-24

申请人： Shi-Wen Zhou ,  Peng Liu ,  Chun-Chi Chen

发明人： Shi-Wen Zhou ,  Peng Liu ,  Chun-Chi Chen

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  F28D15/0266 ,  F28D15/0275 ,  F28F1/32 ,  H01L23/3672 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device is for contacting with a heat generating electronic device to remove heat from the electronic device. The heat dissipation device includes a base for thermally engaging with the electronic device and a plurality of fins arranged on a face of the base. A first heat pipe is located between the base and the fins, and is sinuously positioned on the face of the base. The first heat pipe has a first section located at a central portion of the base and a plurality of second sections located at lateral portions of the base. At least a second heat pipe has a first section thermally positioned to the base, and a second section extending remotely from the base and thermally engaging with the fins.

摘要翻译： 散热装置用于与发热电子装置接触以从电子装置移除热量。 散热装置包括用于与电子设备热接合的基座和布置在基座的表面上的多个翅片。 第一热管位于基座和翅片之间，并且被精确地定位在基座的表面上。 第一热管具有位于基部的中心部分处的第一部分和位于基部的侧部的多个第二部分。 至少第二热管具有热定位到基部的第一部分，以及从基部远程延伸并与翅片热接合的第二部分。