公开(公告)号：US20230223375A1

公开(公告)日：2023-07-13

申请号：US17574360

申请日：2022-01-12

Applicant: QUALCOMM Incorporated

Inventor： Yangyang SUN ,  Dongming HE ,  Lily ZHAO

IPC: H01L23/00 ,  H01L25/065 ,  H01L25/18 ,  H01L25/00

CPC classification number: H01L24/73 ,  H01L25/0652 ,  H01L25/18 ,  H01L25/0657 ,  H01L24/32 ,  H01L24/26 ,  H01L25/50 ,  H01L24/92 ,  H01L2225/06541 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06565 ,  H01L24/30 ,  H01L2224/301 ,  H01L24/33 ,  H01L2224/33181 ,  H01L24/29 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L24/16 ,  H01L2224/16148 ,  H01L24/13 ,  H01L2224/13082 ,  H01L2224/73104 ,  H01L2224/73253 ,  H01L24/06 ,  H01L2224/06181 ,  H01L24/05 ,  H01L2224/0557 ,  H01L2224/26125 ,  H01L2224/9211

Abstract: A package that includes a first integrated device comprising a first plurality of interconnects; a plurality of solder interconnects coupled to the first plurality of interconnects; a second integrated device comprising a second plurality of interconnects, wherein the second integrated device is coupled to the first integrated device through the second plurality of interconnects, the plurality of solder interconnects and the first plurality of interconnects; a polymer layer located between the first integrated device and the second integrated device; and a plurality of spacer balls located between the first integrated device and the second integrated device.

公开(公告)号：US20210407939A1

公开(公告)日：2021-12-30

申请号：US16917295

申请日：2020-06-30

Applicant: QUALCOMM Incorporated

Inventor： Yangyang SUN ,  Dongming HE ,  Lily ZHAO

IPC: H01L23/00

Abstract: Disclosed is a flip-chip device. The flip-chip device includes a die having a plurality of under bump metallizations (UBMs); and a package substrate having a plurality of bond pads. The plurality of UBMs include a first set of UBMs having a first size and a first minimum pitch and a second set of UBMs having a second size and a second minimum pitch. The first set of UBMs and the second set of UBMs are each electrically coupled to the package substrate by a bond-on-pad connection.