公开(公告)号：US20240071993A1

公开(公告)日：2024-02-29

申请号：US17894057

申请日：2022-08-23

Applicant: QUALCOMM Incorporated

Inventor： Yanmei SONG ,  William STONE ,  Jianwen XU ,  John HOLMES ,  Ryan LANE

IPC: H01L25/065 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538

CPC classification number: H01L25/0652 ,  H01L21/4853 ,  H01L21/56 ,  H01L23/3157 ,  H01L23/5381 ,  H01L23/5383 ,  H01L23/5389 ,  H01L24/16 ,  H01L2224/16235

Abstract: A package comprising a first metallization portion, a first integrated device coupled to the first metallization portion, a second integrated device coupled to the first metallization portion, a second metallization portion coupled to the first metallization portion through a first plurality of pillar interconnects, a first chiplet located between the first metallization portion and the second metallization portion, wherein the first chiplet is configured to be electrically coupled to the first integrated device through the first metallization portion, and a second chiplet located between the first metallization portion and the second metallization portion, wherein the second chiplet is configured to be electrically coupled to the second integrated device through the first metallization portion.

公开(公告)号：US20190139852A1

公开(公告)日：2019-05-09

申请号：US15804250

申请日：2017-11-06

Applicant: QUALCOMM Incorporated

Inventor： Youmin YU ,  Nader NIKFAR ,  Ryan LANE

IPC: H01L23/367 ,  H01L23/31 ,  H01L23/373 ,  H01L21/56

Abstract: A semiconductor package includes a substrate, a die coupled to the substrate, the die being smaller in size than the substrate and placed on top of the substrate, a mold formed around and over the die, the mold having a top surface and a mold volume, wherein the mold includes at least one of thermally conductive fin and pillar formed within the mold volume to enhance heat transfer within the package, and a film layer formed over the top surface of the mold volume. The mold includes a plurality of grooves and holes formed above and around the die, and a thermally conductive material is filled into the grooves and holes forming at least one of thermally conductive fin and pillar within the mold volume.