公开(公告)号：US20240203820A1

公开(公告)日：2024-06-20

申请号：US18085284

申请日：2022-12-20

Applicant: QUALCOMM Incorporated

Inventor： Youmin YU ,  Wei WU ,  Guoping XU ,  Nader NIKFAR

IPC: H01L23/42 ,  H01L23/04 ,  H01L23/498 ,  H01L25/16

CPC classification number: H01L23/42 ,  H01L23/041 ,  H01L23/49822 ,  H01L25/165

Abstract: A package comprising a substrate, a first integrated device coupled to a first surface of the substrate, a lid structure coupled to the substrate, where the lid structure includes a first compartment comprising a side surface and an inner top surface, and a thermal interface material coupled to (i) the first integrated device and (ii) the side surface and the inner top surface of the first compartment of the lid structure. The substrate includes at least one dielectric layer and a plurality of interconnects.

公开(公告)号：US20190139852A1

公开(公告)日：2019-05-09

申请号：US15804250

申请日：2017-11-06

Applicant: QUALCOMM Incorporated

Inventor： Youmin YU ,  Nader NIKFAR ,  Ryan LANE

IPC: H01L23/367 ,  H01L23/31 ,  H01L23/373 ,  H01L21/56

Abstract: A semiconductor package includes a substrate, a die coupled to the substrate, the die being smaller in size than the substrate and placed on top of the substrate, a mold formed around and over the die, the mold having a top surface and a mold volume, wherein the mold includes at least one of thermally conductive fin and pillar formed within the mold volume to enhance heat transfer within the package, and a film layer formed over the top surface of the mold volume. The mold includes a plurality of grooves and holes formed above and around the die, and a thermally conductive material is filled into the grooves and holes forming at least one of thermally conductive fin and pillar within the mold volume.