CLOSED-LOOP LIQUID COOLING SYSTEM
    11.
    发明申请

    公开(公告)号:US20220377943A1

    公开(公告)日:2022-11-24

    申请号:US17445239

    申请日:2021-08-17

    Abstract: A closed-loop liquid cooling system includes a liquid coolant conduit, a cold plate, a pump and a heat exchanger. The liquid coolant conduit is in proximity to a heat-generating electrical component. The liquid coolant conduit allows circulation of a liquid coolant to extract heat therefrom. The liquid coolant conduit includes an inner portion that surrounds and contains the liquid coolant, and an outer portion configured to prevent or inhibit leakage of the liquid coolant from the inner portion and also detect any leakage from the inner portion. The cold plate is in thermal communication with the liquid coolant. The pump is configured to transport the liquid coolant in the liquid coolant conduit. The heat exchanger is coupled to the liquid coolant conduit to extract heat therefrom.

    ACTIVE COOLING DEVICES FOR COOLING AN ELECTRONIC ASSEMBLY DOWNSTREAM OF A COMPUTING SYSTEM

    公开(公告)号:US20220279677A1

    公开(公告)日:2022-09-01

    申请号:US17186509

    申请日:2021-02-26

    Abstract: Embodiments of the disclosure relate to active cooling devices for cooling an electronic assembly positioned downstream in a computing system. In one embodiment, an electronic assembly positioned downstream of the computing system is disclosed. The electronic assembly includes a printed circuit board electrically connected to the computing system; an air duct disposed over the printed circuit board; and an active cooling device thermally coupled to the printed circuit board. The printed circuit board includes a transceiver socket configured to receive at least one optical transceiver and one or more heat-generating components disposed thereon. The at least one optical transceiver is configured to mate with an active optical cable.

    OPEN COMPUTE PROJECT CARD AUXILIARY MODE COOLING

    公开(公告)号:US20210173457A1

    公开(公告)日:2021-06-10

    申请号:US16707913

    申请日:2019-12-09

    Abstract: An electronic device operating in standby mode is provided. The electronic device includes a power supply unit, a cooling device coupled to the power supply unit, at least one electronic component cooled by the cooling device, and a controller coupled to the cooling device. The controller is operable to periodically monitor power data and the temperature of the at least one electronic component in standby mode. The controller is also operable to regulate power supplied to the cooling device based on the monitored power data and the temperature of the at least one electronic component.

    DYNAMICALLY ADJUST MAXIMUM FAN DUTY IN A SERVER SYSTEM

    公开(公告)号:US20190116690A1

    公开(公告)日:2019-04-18

    申请号:US15730948

    申请日:2017-10-12

    Abstract: The present disclosure provides a system and method for dynamically adjusting maximum fan duties in a server system. In accordance with one aspect of the present disclosure, a computer-implemented method for dynamically adjusting maximum fan duties in the server system, comprises: powering on the server system; receiving, from BIOS, bus interface information of a system board of the server system; determining that there is no rotation-vibration issues (RVI) sensitive device directly connected to the system board; and setting a first maximum fan duty for one or more cooling fans of the server system.

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