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公开(公告)号：US20240268057A1
公开(公告)日：2024-08-08
申请号：US18165830
申请日：2023-02-07
Applicant: Quanta Computer Inc.
Inventor： Yi-Chieh CHEN , Yueh-Chang WU , Te-Chuan WANG , Tzu-Hsuan HSU
IPC: H05K7/20
CPC classification number: H05K7/20136 , H05K7/20209
Abstract: An example assembly includes an equipment room, a cabinet fan module having fans, and a processor configured to execute logic. Temperature sensors are positioned in the air inlet channel and the equipment room. An electrical component having an air inlet area is also positioned in the equipment room. The logic causes the fans to operate at a predetermined speed, and compare a temperature in the air inlet channel with a temperature at the air inlet area. In response to determining that the temperature at the air inlet area is greater than the temperature in the air inlet channel plus a constant value, the operating speed of the fans is increased. Moreover, the operating speed of the fans is decreased in response to determining that the ambient temperature in the air inlet channel plus a constant value is greater than or equal to the temperature at the air inlet area.
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公开(公告)号：US20240265903A1
公开(公告)日：2024-08-08
申请号：US18165838
申请日：2023-02-07
Applicant: Quanta Computer Inc.
Inventor： Yi-Chieh CHEN , Yueh-Chang WU , Te-Chuan WANG , Tzu-Hsuan HSU
IPC: G10K11/168 , H05K7/20
CPC classification number: G10K11/168 , H05K7/20736
Abstract: An example compute cabinet assembly includes an equipment room, an air inlet channel coupled to the equipment room, and a cabinet fan module coupled to the equipment room. The compute cabinet assembly further includes first and second air outlet channels. The first air outlet channel extends along a side of the equipment room towards an outlet of the first air outlet channel. The second air outlet channel extends along another side of the equipment room towards an outlet of the second air outlet channel. The compute cabinet assembly also includes electric fans positioned in the cabinet fan module. The electric fans are configured to create airflow originating at an inlet of the air inlet channel, extending through the equipment room and cabinet fan module, and exiting the compute cabinet assembly at the outlets of the first and second air outlet channels.
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公开(公告)号：US20230345669A1
公开(公告)日：2023-10-26
申请号：US17659977
申请日：2022-04-20
Applicant: Quanta Computer Inc.
Inventor： Yi-Chieh CHEN , Yueh-Chang WU , Te-Chuan WANG , Po-Kai TSENG
CPC classification number: H05K7/20263 , H05K7/20254 , G06F1/20
Abstract: A heat transmissive chassis for a fan-less equipment component such as a 5G component is disclosed. The chassis includes a heat sink section having an interior surface and an exterior surface. The interior surface is configured for contact with a heat-generating electronic device. A lateral hollow compartment is located near the interior surface. A coolant is contained in the hollow compartment.
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公开(公告)号：US20230025554A1
公开(公告)日：2023-01-26
申请号：US17380845
申请日：2021-07-20
Applicant: QUANTA COMPUTER INC.
Inventor： Yi-Chieh CHEN , Yueh-Chang WU , Te-Chuan WANG , Tzu-Hsuan HSU
Abstract: A cooling system for a rack of servers includes a plurality of cooling circuits, where each cooling circuit is coupled to a server of the rack. Each cooling circuit includes a plurality of cooling modules arranged in parallel. Each cooling module includes a cold plate having a cooling conduit passing therethrough, and a pump fluidly coupled to the cooling conduit. The cooling circuit further includes one or more valves fluidly interconnecting the plurality of cooling modules. Each of the one or more valves, when turned on, fluidly connects the cooling conduits of any two adjacent cooling modules. The cooling system further includes a first cooling distribution manifold fluidly connected to the cooling circuit of each of the plurality of servers through an inlet pipe, and a second cooling distribution manifold fluidly connected to the cooling circuit of each of the plurality of servers through an outlet pipe.
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公开(公告)号：US20240196573A1
公开(公告)日：2024-06-13
申请号：US18335720
申请日：2023-06-15
Applicant: Quanta Computer Inc.
Inventor： Yi-Chieh CHEN , Yueh-Chang WU , Yan-Kuei CHEN , Yi-Ta HSU
IPC: H05K7/20
CPC classification number: H05K7/20836 , H05K7/20163 , H05K7/20718
Abstract: An example method for providing cooling capacity and reducing power consumption of a server assembly is disclosed. The method includes receiving temperature information corresponding to a CPU of an electrical component in the server assembly, which further includes an equipment room, and a cabinet fan module positioned adjacent to a side of the equipment room. The cabinet fan module includes electric fans therein, and the electrical component is implemented in the equipment room. The method includes determining a current power level of the CPU, and determining, using the temperature information and the current power level, a first operating speed for the electric fans. Furthermore, the method includes combining the first operating speed with a second operating speed received from a proportional-integral-derivative controller to determine a combined operating speed. The method still further includes instructing the electric fans to operate at the combined operating speed.
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Patent Agency Ranking
公开(公告)号：US20230247800A1
公开(公告)日：2023-08-03
申请号：US17587484
申请日：2022-01-28
Applicant: Quanta Computer Inc.
Inventor： Yi-Chieh CHEN , Yueh-Chang WU , Yan-Kuei CHEN , Yangtzu LEE
IPC: H05K7/20
CPC classification number: H05K7/207 , H05K7/20181
Abstract: A computing system includes a cabinet, an inlet temperature sensor, a cooling device, an environmental sensor, and at least one processor. The cabinet houses at least one computing device. The inlet temperature sensor is configured to detect inlet temperature data for the at least one computing device. The inlet temperature data represents internal temperature within the cabinet. The cooling device is coupled to the cabinet for maintaining temperature within the cabinet. The environmental sensor is configured to detect environmental temperature data external to the cabinet. The environmental temperature data represents external temperature outside the cabinet. The at least one processor is configured to: (a) determine if one or more of the inlet temperature data and the environmental temperature data exceeds a temperature range; and (b) in response to the temperature range being exceeded, generate a first warning signal indicating a temperature problem.
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公开(公告)号：US20220418154A1
公开(公告)日：2022-12-29
申请号：US17304704
申请日：2021-06-24
Applicant: Quanta Computer Inc.
Inventor： Yi-Chieh CHEN , Yueh-Chang WU , Te-Chuan WANG , Tzu-Hsuan HSU
Abstract: A cooling device for a computing system is disclosed. The cooling device includes an inlet conduit, a first cold plate, a connecting conduit, a second cold plate, an outlet conduit, and a heat conductor. Coolant flows through the inlet conduit. The first cold plate has a first inlet surface and a first outlet surface. The inlet conduit is coupled to the first inlet surface. The inlet conduit transfers the coolant into the first cold plate. The connecting conduit is coupled at one end to the first outlet surface. The coolant flows from the first cold plate through the connecting conduit. The second cold plate has a second inlet surface and a second outlet surface, the connecting conduit being coupled at another end to the second inlet surface. The outlet conduit is coupled to the second outlet surface. The coolant flows from the second cold plate through the outlet conduit.
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公开(公告)号：US20240049425A1
公开(公告)日：2024-02-08
申请号：US17816889
申请日：2022-08-02
Applicant: Quanta Computer Inc.
Inventor： Yi-Chieh CHEN , Yueh-Chang WU , Yan-Kuei CHEN , Yu-Hung WANG
CPC classification number: H05K7/20272 , H05K7/20254 , G01M3/40 , G06F1/206
Abstract: A structure for protecting an electronic component from coolant leaking from a liquid cooling system is disclosed. The liquid cooling system has a manifold collecting and supplying coolant to a cold plate via inlet and outlet tubes. The cold plate is mounted over a heat-generating component on a circuit board. The structure includes a drip tray having a top surface and a length approximately the distance between the manifold and the cold plate. The drip tray includes a trough for collection of leaking coolant. The tray is inserted between the circuit board and the inlet and outlet tubes.
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公开(公告)号：US20230422426A1
公开(公告)日：2023-12-28
申请号：US17846776
申请日：2022-06-22
Applicant: Quanta Computer Inc.
Inventor： Yi-Chieh CHEN , Yueh-Chang WU , Te-Chuan WANG , Wei-Ju CHEN
CPC classification number: H05K7/20145 , H05K7/20409 , H05K7/2049 , H05K5/0213 , H05K5/0226 , H05K5/03
Abstract: A sunshield to protect an equipment housing from solar heat and allow cooling from external air flow is disclosed. The sunshield includes a main plate configured to be positioned to cover a side of the equipment housing. A vent in the main plate allows air flow through the main plate to the equipment housing. A shutter is rotatable between an open position allowing air flow through the vent, and a closed position blocking air flow through the vent. A biasing mechanism provides force to bias the shutter in the closed position. The force is overcome by a predetermined level of external air flow on the shutter to rotate the shutter to the open position.
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10.发明公开公开(公告)号：US20230354556A1
公开(公告)日：2023-11-02
申请号：US17730913
申请日：2022-04-27
Applicant: Quanta Computer Inc.
Inventor： Yi-Chieh CHEN , Yueh-Chang WU , Ching-Yi SHIH , Kang HSU
CPC classification number: H05K7/20409 , G06F1/206 , H05K5/06
Abstract: A computing system including a water-resistant chassis, at least one electronic component with a heat sink, and a gap filler. The heat sink includes an arrangement of fins separated by inter-fin spaces. The gap filler is in contact with both the heat sink and the water-resistant chassis. The gap filler is positioned in the inter-fin spaces to provide a heat conduction path between the heat sink and the chassis.
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