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公开(公告)号：US20220390992A1
公开(公告)日：2022-12-08
申请号：US17342237
申请日：2021-06-08
Applicant: Quanta Computer Inc.
Inventor： Chia-Ming LIANG , Jen-Mao CHEN , Hsiao-Ching CHEN , Yu-Tang ZENG
Abstract: A field-replaceable unit (FRU) identification circuit includes a reference voltage source, a reference resistor, a plurality of comparators, and a plurality of comparator input voltage sources. The reference voltage source provides a reference voltage. A first end of the reference resistor is electrically connected to the reference voltage source. Each comparator has two inputs and an output. A first input of each comparator is electrically connected to a second end of the reference resistor. The comparator input voltage sources each provide a comparator input voltage to the second input of one of the comparators. When an FRU is electrically connected to a circuit board where the FRU identification circuit is located, the outputs of the comparators are set to a distinct combination of logical values that uniquely identifies the FRU.
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公开(公告)号：US20220354022A1
公开(公告)日：2022-11-03
申请号：US17387415
申请日：2021-07-28
Applicant: QUANTA COMPUTER INC.
Inventor： Chao-Jung CHEN , Yu Nien HUANG , Sin-Hong LIEN , Jen-Mao CHEN
IPC: H05K7/20
Abstract: A system includes a rack of servers and a fluid circuit for cooling the rack of servers. The fluid circuit includes one or more cooling modules, a heat-exchanging module, and a pump. The one or more cooling modules are thermally connected to a conduit for flowing a coolant therethrough. Each cooling module includes a heat-exchanger thermally connected to the conduit and a chiller fluidly coupled to the heat-exchanger. The heat-exchanging module is fluidly connected to an outlet of the conduit. The pump is configured to drive the coolant from the heat-exchanging module to each server in the rack of servers.
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公开(公告)号：US20240179875A1
公开(公告)日：2024-05-30
申请号：US18435866
申请日：2024-02-07
Applicant: QUANTA COMPUTER INC.
Inventor： Chao-Jung CHEN , Yu-Nien HUANG , Sin-Hong LIEN , Jen-Mao CHEN
IPC: H05K7/20
CPC classification number: H05K7/20663 , H05K7/20327 , H05K7/20354 , H05K7/202
Abstract: A system includes a rack of servers and a fluid circuit for cooling the rack of servers. The fluid circuit includes one or more cooling modules, a heat-exchanging module, and a pump. The one or more cooling modules are thermally connected to a conduit for flowing a coolant therethrough. Each cooling module includes a heat-exchanger thermally connected to the conduit and a chiller fluidly coupled to the heat-exchanger. The heat-exchanging module is fluidly connected to an outlet of the conduit. The pump is configured to drive the coolant from the heat-exchanging module to each server in the rack of servers.
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公开(公告)号：US20190027850A1
公开(公告)日：2019-01-24
申请号：US15886409
申请日：2018-02-01
Applicant: QUANTA COMPUTER INC.
Inventor： Maw-Zan JAU , Jen-Mao CHEN , Chun CHANG
CPC classification number: H01R12/721 , G06F1/186 , G06F1/20 , G06F13/409 , H01R12/675 , H01R12/7082 , H01R2201/06 , H05K7/1487
Abstract: A circuit card assembly includes a circuit card having front and back ends, substantially parallel longitudinal edges between the front and back ends, and a bus connector extending from one of the longitudinal edges. The circuit card assembly includes a bracket structure providing a mounting surface, the mounting surface comprising a bracket for engaging with a plurality of adjacent ones of a plurality of bracket slots with openings at a fixed pitch. The circuit card assembly includes a connector assembly at the surface of said circuit card at the first end, with at least a first input/output (I/O) connector, and a second I/O connector in a stacked arrangement with respect to the surface of said circuit card, where the first I/O connector and the second I/O connector extend through the bracket and are separated by the fixed pitch.
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公开(公告)号：US20170265332A1
公开(公告)日：2017-09-14
申请号：US15063901
申请日：2016-03-08
Applicant: Quanta Computer Inc.
Inventor： Chao-Jung CHEN , Yi-Chieh CHEN , Jen-Mao CHEN , Wei-Chun CHANG
CPC classification number: H05K7/20572 , G11B33/128 , G11B33/142 , H05K7/1489 , H05K7/20727
Abstract: Systems, methods and computer-readable media for reducing upstream preheat for high-density hard disk drive storage. A system can include first and second rows of storage devices installed in a storage rack, the first and second rows having a first distance between consecutive storage devices. The second row can be located behind the first row and farther away from a source of an airflow than the first row. The system can monitor a temperature associated with the second row and when the temperature rises above a threshold, the system can remove a storage device from the first row. The system can then adjust placement within the first row such that the remaining devices have a second, larger distance between each other to increase airflow to storage devices in the second row and reduce system impedance.
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Patent Agency Ranking
公开(公告)号：US20220408593A1
公开(公告)日：2022-12-22
申请号：US17353301
申请日：2021-06-21
Applicant: Quanta Computer Inc.
Inventor： Jen-Mao CHEN , Wei-En TSAI , Sin-Hong LIEN , Jhih-Bin GUAN
IPC: H05K7/20
Abstract: A computing device comprises a housing, a heat-generating electronic component, at least one additional electronic component, and a liquid cooling module. The heat-generating component, the at least one additional electronic component, and the liquid cooling module are all positioned inside the housing. The liquid cooling module is configured to cool the heat-generating electronic component, and includes at least one movable radiator. The at least one movable radiator is configured to move between a first position and a second position. When the at least one movable radiator is in the first position tank, the at least one movable radiator blocks access to the at least one additional electronic component within the housing. When the at least one movable radiator is in the second position, the at least one movable radiator allows access to the at least one additional electronic component within the housing.
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公开(公告)号：US20220361362A1
公开(公告)日：2022-11-10
申请号：US17307740
申请日：2021-05-04
Applicant: Quanta Computer Inc.
Inventor： Jen-Mao CHEN , Wei-Te WANG , Ming-Hung TSAI
Abstract: A power supply system for a computer system having a fan module that protects the power supply system from backflow from the fan module is disclosed. A power supply unit has an internal fan emitting an airflow from one end of the power supply unit. The power supply unit is mountable next to the fan module. The power supply system is mountable in proximity to an air baffle that diverts the airflow generated by the internal fan. An air tunnel is located on one side of the power supply unit. The air tunnel has an opening on one end for receiving the airflow diverted by the air baffle from the internal fan. The air tunnel has an opposite end in proximity to a second opening to divert the received airflow under the power supply unit.
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公开(公告)号：US20170325361A1
公开(公告)日：2017-11-09
申请号：US15414311
申请日：2017-01-24
Applicant: QUANTA COMPUTER INC.
Inventor： Chao-Jung CHEN , Yi-Chieh CHEN , Jen-Mao CHEN , Wei-Chun CHANG
IPC: H05K7/20
CPC classification number: H05K7/20736 , G06F1/187 , G11B33/128 , G11B33/142 , H05K7/20781 , H05K7/20836
Abstract: The present technology provides a system for supplying fresh air to downstream components. The system comprises a housing with a first end and a second end, a first plurality of partitions disposed in the housing, and a second plurality of partitions disposed in the housing. The housing comprises a base portion and first and second opposing sidewalls extending from the first end to the second end. Each of the first plurality of partitions includes at least one first ventilation opening associated with each of the plurality of compartments. Each one of the second plurality of partitions comprises at least one partition duct extending through the plurality of partition rows and at least one second ventilation opening connecting the at least one partition duct to associated ones of the plurality of compartments.
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公开(公告)号：US20240237282A1
公开(公告)日：2024-07-11
申请号：US18298725
申请日：2023-04-11
Applicant: Quanta Computer Inc.
Inventor： Wei-Te WANG , Ming-Hung TSAI , Bo-Cheng CIOU , Jen-Mao CHEN
IPC: H05K7/20
CPC classification number: H05K7/20272 , H05K7/20254 , H05K7/20263 , H05K7/20781
Abstract: A liquid cooling system includes a cold plate thermally coupled to a heat-generating electronic component, a heat removal unit fluidly coupled to the cold plate, and a valve fluidly coupled to the cold plate and the heat removal unit. The cold plate has an internal fluid pathway. The heat removal unit delivers the cooling fluid to the cold plate, receives heated cooling fluid from the cold plate, and removes heat from the heated cooling fluid. When the valve is in a first orientation, the cold plate and the heat removal unit are fluidly coupled in a first configuration and the cooling fluid flows through the internal fluid pathway in a first direction. When the valve is in a second orientation, the cold plate and the heat removal unit are fluidly coupled in a second configuration and the cooling fluid flows through the internal fluid pathway in a second direction.
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10.发明申请公开(公告)号：US20230068535A1
公开(公告)日：2023-03-02
申请号：US17514479
申请日：2021-10-29
Applicant: QUANTA COMPUTER INC.
Inventor： Chao-Jung CHEN , Yu-Nien HUANG , Sin-Hong LIEN , Jen-Mao CHEN
Abstract: A method and system controls cooling system leaks in a rack. The method includes monitoring leak detection sensors positioned at computer systems and below sections of a liquid conveyance system. In response to determining if a signal was received from one of the leak detection sensors that is indicative of a leak, the leak detection sensor and the corresponding one of the plurality of computer systems associated the received signal is determined. Power is disconnected to the corresponding one of the computer systems and a signal is transmitted to implement moving first and second valves from open to closed positions. The first valve is positioned within the liquid conveyance system between a hot rack manifold and a thermal contact structure associated with the computer system associated with the received signal. The second valve is positioned within the liquid conveyance system between a cool rack manifold and the thermal contact structure.
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