公开(公告)号：US20210022238A1

公开(公告)日：2021-01-21

申请号：US16517043

申请日：2019-07-19

Applicant: RAYTHEON COMPANY

Inventor： Andrew Southworth ,  Kevin Wilder ,  James Benedict ,  Mary K. Herndon ,  Thomas V. Sikina ,  John P. Haven

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/30 ,  H01Q1/38 ,  H01Q1/52

Abstract: A circuit assembly is provided and includes a printed circuit board (PCB) having a circuit element region and defining a trench surrounding an entirety of the circuit element region, a circuit element disposed within the circuit element region of the PCB; and a Faraday wall. The Faraday wall includes a solid, unitary body having a same shape as the trench. The Faraday wall is disposed within the trench to surround an entirety of the circuit element.

公开(公告)号：US20210337651A1

公开(公告)日：2021-10-28

申请号：US17366836

申请日：2021-07-02

Applicant: RAYTHEON COMPANY

Inventor： Andrew Southworth ,  Kevin Wilder ,  James Benedict ,  Mary K. Herndon ,  Thomas V. Sikina ,  John P. Haven

IPC: H05K1/02 ,  H01Q1/38 ,  H01Q1/52 ,  H05K3/00 ,  H05K3/30

Abstract: A circuit assembly is provided and includes a printed circuit board (PCB) having a circuit element region and defining a trench surrounding an entirety of the circuit element region, a circuit element disposed within the circuit element region of the PCB; and a Faraday wall. The Faraday wall includes a solid, unitary body having a same shape as the trench. The Faraday wall is disposed within the trench to surround an entirety of the circuit element.