公开(公告)号：US20230216166A1

公开(公告)日：2023-07-06

申请号：US18072539

申请日：2022-11-30

Applicant: Raytheon Company

Inventor： James Benedict ,  Lawrence A. Binek ,  Erika Klek

IPC: H01P1/208 ,  H01P11/00 ,  B33Y10/00 ,  B33Y80/00 ,  B33Y30/00 ,  B29C64/245 ,  B29C64/336

CPC classification number: H01P1/2088 ,  H01P11/007 ,  B33Y10/00 ,  B33Y80/00 ,  B33Y30/00 ,  B29C64/245 ,  B29C64/336 ,  B29L2011/0075

Abstract: A radio frequency (RF) waveguide comprising a channel, a filter, and a support bridge. The channel can comprise an outer wall defining an inner cavity configured to propagate electromagnetic waves. The filter can be disposed in the inner cavity of the channel and can comprise a perimeter edge and an aperture. The support bridge can comprise a first interface connected to an inner surface of the outer wall at a first location, and a second interface connected to the filter at a position between the perimeter edge and the aperture of the filter to support the filter within the channel. The support bridge can remain in place as connected to the filter, and the filter and waveguide can operate without interference from the support bridge, meaning that the waveguide meets all performance specifications and functions as intended for a particular application even with the support bridge left in place.

公开(公告)号：US11444365B2

公开(公告)日：2022-09-13

申请号：US16822399

申请日：2020-03-18

Applicant: RAYTHEON COMPANY

Inventor： James Benedict ,  Erika Klek ,  John P. Haven ,  Michael Souliotis ,  Thomas V. Sikina ,  Andrew R. Southworth ,  Kevin Wilder

IPC: H01P5/08 ,  H01P3/08

Abstract: A RAMP-radio frequency (RAMP-RF) assembly is provided and includes an RF panel including a microstrip interface, a plate including a stripline interface and a microstrip-to-stripline transition element operably connectable to the microstrip interface and to the stripline interface.

公开(公告)号：US11482795B2

公开(公告)日：2022-10-25

申请号：US16744774

申请日：2020-01-16

Applicant: RAYTHEON COMPANY

Inventor： Thomas V. Sikina ,  John P. Haven ,  Gregory M. Fagerlund ,  James Benedict ,  Andrew Southworth ,  Kevin Wilder

IPC: H01Q21/06 ,  B33Y80/00 ,  H01Q1/38 ,  H01Q9/04

Abstract: An antenna and method of manufacturing an antenna. The antenna includes a radiator feed layer, a first radiator patch assembly attached to the radiator feed layer, and a second radiator patch assembly attached to the radiator feed layer. The first radiator patch assembly is separated from the second radiator patch assembly by an air gap. The first radiator patch assembly is attached to the radiator feed layer and the second radiator patch assembly is attached to the radiator feed layer separated from the first radiator patch assembly by the air gap.

公开(公告)号：US20220258244A1

公开(公告)日：2022-08-18

申请号：US17176115

申请日：2021-02-15

Applicant: Raytheon Company

Inventor： James Benedict ,  Raquel M. Doyen ,  Brian J. Duffy ,  Judith E. Gill ,  Erica Klek ,  Jacob Steinberg

IPC: B22F10/47 ,  B33Y10/00 ,  B33Y80/00 ,  B33Y40/20 ,  B22F10/28

Abstract: A method of making a waveguide for a radar system includes forming an additive manufacturing build of a waveguide by forming an initial layer, followed by forming a succession of build layers on the initial layer in a build direction from the initial layer towards a final layer. Forming the succession of build layers includes forming an overhanging feature supported by a support formed in the succession of build layers.

公开(公告)号：US20210226343A1

公开(公告)日：2021-07-22

申请号：US16744774

申请日：2020-01-16

Applicant: RAYTHEON COMPANY

Inventor： Thomas V. Sikina ,  John P. Haven ,  Gregory M. Fagerlund ,  James Benedict ,  Andrew Southworth ,  Kevin Wilder

IPC: H01Q21/06 ,  H01Q9/04 ,  B33Y80/00 ,  H01Q1/38

Abstract: An antenna and method of manufacturing an antenna. The antenna includes a radiator feed layer, a first radiator patch assembly attached to the radiator feed layer, and a second radiator patch assembly attached to the radiator feed layer. The first radiator patch assembly is separated from the second radiator patch assembly by an air gap. The first radiator patch assembly is attached to the radiator feed layer and the second radiator patch assembly is attached to the radiator feed layer separated from the first radiator patch assembly by the air gap.

公开(公告)号：US20230216170A1

公开(公告)日：2023-07-06

申请号：US18072516

申请日：2022-11-30

Applicant: Raytheon Company

Inventor： James Benedict ,  Lawrence A. Binek ,  Erika Klek

IPC: H01P3/18 ,  H01P3/20 ,  H01P11/00 ,  H01P5/20

CPC classification number: H01P3/18 ,  H01P3/20 ,  H01P5/20 ,  H01P11/001

Abstract: A radio frequency (“RF”) waveguide device fabricated by additive manufacturing is provided that includes a RF channel comprising a wall and a RF component comprising an unsupported span extending from the wall of the RF channel. The unsupported span can include at least one unsupported surface extending from the wall at an oblique angle relative to the wall. The RF component formed in this manner with additive manufacturing does not negatively impact the RF performance of the RF waveguide.

公开(公告)号：US11632856B2

公开(公告)日：2023-04-18

申请号：US17366836

申请日：2021-07-02

Applicant: RAYTHEON COMPANY

Inventor： Andrew Southworth ,  Kevin Wilder ,  James Benedict ,  Mary K. Herndon ,  Thomas V. Sikina ,  John P. Haven

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/26 ,  H05K3/30 ,  H05K5/00 ,  H05K5/06 ,  H05K9/00 ,  H01L23/34 ,  H01L23/498 ,  H01L23/552 ,  H01Q1/38 ,  H01Q1/52 ,  H05K3/00

Abstract: A circuit assembly is provided and includes a printed circuit board (PCB) having a circuit element region and defining a trench surrounding an entirety of the circuit element region, a circuit element disposed within the circuit element region of the PCB; and a Faraday wall. The Faraday wall includes a solid, unitary body having a same shape as the trench. The Faraday wall is disposed within the trench to surround an entirety of the circuit element.

公开(公告)号：US20210066830A1

公开(公告)日：2021-03-04

申请号：US16552694

申请日：2019-08-27

Applicant: RAYTHEON COMPANY

Inventor： Kevin Wilder ,  Alan C. Smith ,  James Benedict ,  Andrew Southworth ,  Thomas V. Sikina ,  Mary K. Herndon ,  John P. Haven

IPC: H01R12/71 ,  H05K1/02 ,  H05K1/14 ,  H05K3/36 ,  H01R12/70 ,  H01R43/20 ,  H01R43/26

Abstract: A stripline radio-frequency (RF) connection interface is provided and includes first and second printed circuit boards (PCBs). The first PCB includes a first trace, ground planes at opposite sides of the first trace, dielectric material interposed between the first trace and the ground planes and a first end. The first end is formed as a first rabbet at which the first trace is exposed. The second PCB includes a second trace, ground planes at opposite sides of the second trace, dielectric material interposed between the second trace and the ground planes and a second end. The second end is formed as a second rabbet, which is substantially identical to the first rabbet, at which the second trace is exposed. The first and second ends are mated in a shiplap joint to electrically couple the first and second traces.

公开(公告)号：US11890676B2

公开(公告)日：2024-02-06

申请号：US17176115

申请日：2021-02-15

Applicant: Raytheon Company

Inventor： James Benedict ,  Raquel M. Doyen ,  Brian J. Duffy ,  Judith E. Gill ,  Erica Klek ,  Jacob Steinberg

IPC: B22F10/47 ,  B33Y10/00 ,  B33Y80/00 ,  B33Y40/20 ,  B22F10/28 ,  G01R1/02 ,  G01R29/08 ,  H01P11/00

CPC classification number: B22F10/47 ,  B22F10/28 ,  B33Y10/00 ,  B33Y40/20 ,  B33Y80/00 ,  G01R1/02 ,  G01R29/0878 ,  B22F2301/052 ,  H01P11/002 ,  Y10T29/49002

Abstract: A method of making a waveguide for a radar system includes forming an additive manufacturing build of a waveguide by forming an initial layer, followed by forming a succession of build layers on the initial layer in a build direction from the initial layer towards a final layer. Forming the succession of build layers includes forming an overhanging feature supported by a support formed in the succession of build layers.

公开(公告)号：US11089673B2

公开(公告)日：2021-08-10

申请号：US16517043

申请日：2019-07-19

Applicant: RAYTHEON COMPANY

Inventor： Andrew Southworth ,  Kevin Wilder ,  James Benedict ,  Mary K. Herndon ,  Thomas V. Sikina ,  John P. Haven

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/11 ,  H05K1/14 ,  H05K3/00 ,  H05K3/04 ,  H05K3/10 ,  H05K3/22 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K3/46 ,  H01L21/00 ,  H01L21/205 ,  H01L23/48 ,  H01L23/60 ,  H01L23/522 ,  H01L23/528 ,  H05K9/00 ,  H01Q1/38 ,  H01Q1/52 ,  H05K3/30

Abstract: A circuit assembly is provided and includes a printed circuit board (PCB) having a circuit element region and defining a trench surrounding an entirety of the circuit element region, a circuit element disposed within the circuit element region of the PCB; and a Faraday wall. The Faraday wall includes a solid, unitary body having a same shape as the trench. The Faraday wall is disposed within the trench to surround an entirety of the circuit element.