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公开(公告)号：US11444365B2
公开(公告)日：2022-09-13
申请号：US16822399
申请日：2020-03-18
申请人： RAYTHEON COMPANY
发明人： James Benedict , Erika Klek , John P. Haven , Michael Souliotis , Thomas V. Sikina , Andrew R. Southworth , Kevin Wilder
摘要： A RAMP-radio frequency (RAMP-RF) assembly is provided and includes an RF panel including a microstrip interface, a plate including a stripline interface and a microstrip-to-stripline transition element operably connectable to the microstrip interface and to the stripline interface.
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公开(公告)号：US11632856B2
公开(公告)日：2023-04-18
申请号：US17366836
申请日：2021-07-02
申请人： RAYTHEON COMPANY
发明人： Andrew Southworth , Kevin Wilder , James Benedict , Mary K. Herndon , Thomas V. Sikina , John P. Haven
IPC分类号： H05K1/02 , H05K1/11 , H05K1/18 , H05K3/26 , H05K3/30 , H05K5/00 , H05K5/06 , H05K9/00 , H01L23/34 , H01L23/498 , H01L23/552 , H01Q1/38 , H01Q1/52 , H05K3/00
摘要： A circuit assembly is provided and includes a printed circuit board (PCB) having a circuit element region and defining a trench surrounding an entirety of the circuit element region, a circuit element disposed within the circuit element region of the PCB; and a Faraday wall. The Faraday wall includes a solid, unitary body having a same shape as the trench. The Faraday wall is disposed within the trench to surround an entirety of the circuit element.
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公开(公告)号：US20210066830A1
公开(公告)日：2021-03-04
申请号：US16552694
申请日：2019-08-27
申请人： RAYTHEON COMPANY
发明人： Kevin Wilder , Alan C. Smith , James Benedict , Andrew Southworth , Thomas V. Sikina , Mary K. Herndon , John P. Haven
摘要： A stripline radio-frequency (RF) connection interface is provided and includes first and second printed circuit boards (PCBs). The first PCB includes a first trace, ground planes at opposite sides of the first trace, dielectric material interposed between the first trace and the ground planes and a first end. The first end is formed as a first rabbet at which the first trace is exposed. The second PCB includes a second trace, ground planes at opposite sides of the second trace, dielectric material interposed between the second trace and the ground planes and a second end. The second end is formed as a second rabbet, which is substantially identical to the first rabbet, at which the second trace is exposed. The first and second ends are mated in a shiplap joint to electrically couple the first and second traces.
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公开(公告)号：US11482795B2
公开(公告)日：2022-10-25
申请号：US16744774
申请日：2020-01-16
申请人： RAYTHEON COMPANY
发明人： Thomas V. Sikina , John P. Haven , Gregory M. Fagerlund , James Benedict , Andrew Southworth , Kevin Wilder
摘要： An antenna and method of manufacturing an antenna. The antenna includes a radiator feed layer, a first radiator patch assembly attached to the radiator feed layer, and a second radiator patch assembly attached to the radiator feed layer. The first radiator patch assembly is separated from the second radiator patch assembly by an air gap. The first radiator patch assembly is attached to the radiator feed layer and the second radiator patch assembly is attached to the radiator feed layer separated from the first radiator patch assembly by the air gap.
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公开(公告)号：US20220258244A1
公开(公告)日：2022-08-18
申请号：US17176115
申请日：2021-02-15
申请人： Raytheon Company
发明人： James Benedict , Raquel M. Doyen , Brian J. Duffy , Judith E. Gill , Erica Klek , Jacob Steinberg
摘要： A method of making a waveguide for a radar system includes forming an additive manufacturing build of a waveguide by forming an initial layer, followed by forming a succession of build layers on the initial layer in a build direction from the initial layer towards a final layer. Forming the succession of build layers includes forming an overhanging feature supported by a support formed in the succession of build layers.
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公开(公告)号：US20210226343A1
公开(公告)日：2021-07-22
申请号：US16744774
申请日：2020-01-16
申请人： RAYTHEON COMPANY
发明人： Thomas V. Sikina , John P. Haven , Gregory M. Fagerlund , James Benedict , Andrew Southworth , Kevin Wilder
摘要： An antenna and method of manufacturing an antenna. The antenna includes a radiator feed layer, a first radiator patch assembly attached to the radiator feed layer, and a second radiator patch assembly attached to the radiator feed layer. The first radiator patch assembly is separated from the second radiator patch assembly by an air gap. The first radiator patch assembly is attached to the radiator feed layer and the second radiator patch assembly is attached to the radiator feed layer separated from the first radiator patch assembly by the air gap.
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公开(公告)号：US11089673B2
公开(公告)日：2021-08-10
申请号：US16517043
申请日：2019-07-19
申请人： RAYTHEON COMPANY
发明人： Andrew Southworth , Kevin Wilder , James Benedict , Mary K. Herndon , Thomas V. Sikina , John P. Haven
IPC分类号： H05K1/02 , H05K1/09 , H05K1/11 , H05K1/14 , H05K3/00 , H05K3/04 , H05K3/10 , H05K3/22 , H05K3/34 , H05K3/36 , H05K3/40 , H05K3/46 , H01L21/00 , H01L21/205 , H01L23/48 , H01L23/60 , H01L23/522 , H01L23/528 , H05K9/00 , H01Q1/38 , H01Q1/52 , H05K3/30
摘要： A circuit assembly is provided and includes a printed circuit board (PCB) having a circuit element region and defining a trench surrounding an entirety of the circuit element region, a circuit element disposed within the circuit element region of the PCB; and a Faraday wall. The Faraday wall includes a solid, unitary body having a same shape as the trench. The Faraday wall is disposed within the trench to surround an entirety of the circuit element.
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公开(公告)号：US20210022238A1
公开(公告)日：2021-01-21
申请号：US16517043
申请日：2019-07-19
申请人： RAYTHEON COMPANY
发明人： Andrew Southworth , Kevin Wilder , James Benedict , Mary K. Herndon , Thomas V. Sikina , John P. Haven
摘要： A circuit assembly is provided and includes a printed circuit board (PCB) having a circuit element region and defining a trench surrounding an entirety of the circuit element region, a circuit element disposed within the circuit element region of the PCB; and a Faraday wall. The Faraday wall includes a solid, unitary body having a same shape as the trench. The Faraday wall is disposed within the trench to surround an entirety of the circuit element.
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公开(公告)号：US20210337651A1
公开(公告)日：2021-10-28
申请号：US17366836
申请日：2021-07-02
申请人： RAYTHEON COMPANY
发明人： Andrew Southworth , Kevin Wilder , James Benedict , Mary K. Herndon , Thomas V. Sikina , John P. Haven
摘要： A circuit assembly is provided and includes a printed circuit board (PCB) having a circuit element region and defining a trench surrounding an entirety of the circuit element region, a circuit element disposed within the circuit element region of the PCB; and a Faraday wall. The Faraday wall includes a solid, unitary body having a same shape as the trench. The Faraday wall is disposed within the trench to surround an entirety of the circuit element.
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